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A laminating machine with feeding buffer

A laminating machine and feeding mechanism technology, applied in lamination auxiliary operations, chemical instruments and methods, lamination, etc., can solve problems such as lamination failure and easily damaged workpiece structure

Active Publication Date: 2018-10-30
广东韦达尔传媒有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The bonding process usually depends on the use of the bonding machine. The performance of the bonding machine determines its working efficiency and bonding quality. However, when the traditional bonding machine feeds the material to the pressing mechanism, the pressing mechanism and the workpiece are in rigid contact, which is easy Destroy the structure of the workpiece, resulting in failure of bonding

Method used

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  • A laminating machine with feeding buffer
  • A laminating machine with feeding buffer
  • A laminating machine with feeding buffer

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Embodiment Construction

[0034] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0035] like Figure 1 to Figure 20 As shown, a four-station laminating machine includes a rotating device 2, a double-mode fixture mechanism 3, a film transfer mechanism 4, a glass sheet feeding mechanism 5, and a film pressing mechanism 6;

[0036] The dual-mode jig mechanism 3 includes a lamination jig 31 and a positioning jig 32, the positioning jig 32 is used to position the diaphragm, and the upper surface of the lamination jig 31 is provided with a sticky soft material;

[0037] The rotating device 2 includes a turntable 21 arranged horizontally, and there are at least four dual-mode jig mechanisms 3 equidistantly arranged on the outside of the upper surface of the turntable 21; each of the dual-mode jig mechanisms 3 corresponds to Station 1 301, Station 2 302, Station 3 303 and Station 4 304...

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PUM

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Abstract

A feeding buffer laminating machine includes dual-mode fixture mechanisms, a film transfer mechanism, a glass sheet feeding mechanism and a mold pressing mechanism; each dual-mode fixture mechanism comprises a film pressing fixture and a positioning fixture; each positioning fixture is used for positioning a film sheet; each film pressing fixture is used for laminating a placing position of a glass sheet and the film sheet; at least four dual-mode fixture mechanisms are provided, and all the dual-mode fixture mechanism correspond to a first station, a second station, a third station and a fourth station respectively; the film transfer mechanism is arranged on the second station; the mold pressing mechanism is arranged on the fourth station; the glass sheet feeding mechanism is arranged on the side of the fourth station and is close to the third station; the glass sheet feeding mechanism comprises a mounting groove and a glass sheet positioning block; the glass sheet positioning block is slidingly mounted in the mounting groove through a connecting piece; a second elastic element is arranged between the mounting groove and the glass sheet positioning block. The invention aims to provide the feeding buffer laminating machine; a material is sucked when fed to a laminating mold, and the laminating mold makes flexible contact with a workpiece, to play a role in buffering and protecting the workpiece.

Description

technical field [0001] The invention relates to the field of electromechanical technology, in particular to a laminating machine with feeding buffer. Background technique [0002] As an input device, a touch screen is widely used in various display devices. Through the touch screen, people can transmit information to the display device by handwriting or point contact. In the touch screen manufacturing process, it is often necessary to bond two boards together. The bonding process is to apply a certain mechanical external force to make the two materials tightly bonded together, so as to achieve the purpose of firm bonding. The bonding process is currently It occupies an important position in various molding process methods. The bonding process usually depends on the use of the bonding machine. The performance of the bonding machine determines its working efficiency and bonding quality. However, when the traditional bonding machine is fed to the pressing mechanism, the pressi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/10B32B38/18B32B38/10
CPCB32B37/10B32B38/10B32B38/1841
Inventor 门锦程
Owner 广东韦达尔传媒有限公司