New led panel components, 3d panel components and 3d display

A panel component, a new technology, applied in the direction of electrical components, semiconductor devices, electric solid devices, etc., can solve the problem that the resolution of the LED display cannot be further improved, and achieve the effect of reducing the dot pitch, improving the resolution, and simplifying the installation process

Active Publication Date: 2021-07-23
北京天泰博远科技发展有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to solve the problem that the resolution of the LED display screen in the prior art cannot be further improved, the present invention provides a novel LED panel assembly, a 3D panel assembly and a 3D display screen

Method used

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  • New led panel components, 3d panel components and 3d display
  • New led panel components, 3d panel components and 3d display
  • New led panel components, 3d panel components and 3d display

Examples

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Embodiment 1

[0054]The research and development personnel of this application found in the research and development process that the existing LED display uses lamp beads as pixels, and the lamp beads are generally bound to three LED chips of red, green and blue on the bracket, and the conductive pins (conductive pins) are connected by gold wires. Pins are used to electrically connect with the driver board 7), and encapsulated with silicone resin or epoxy resin. Red, green and blue LED chips are used as sub-pixels. This kind of packaging method first has a certain volume of the bracket, and it is difficult to make it smaller. When installing, the lamp beads should not be too close to each other, and a certain gap needs to be reserved. All of these lead to the inability to further improve the resolution. A breakthrough in technology is required to find a breakthrough point.

[0055] At the same time, the heat dissipation performance of LED display modules has always been the bottleneck tha...

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Abstract

In order to solve the problem that the resolution of the existing LED display screen cannot be further improved, the present invention provides a novel LED panel assembly, a 3D panel assembly and a 3D display screen. The novel LED panel assembly provided by the present invention includes a ceramic substrate, the ceramic substrate includes a front and a back; the front of the ceramic substrate is plated with copper sinking, and a circuit pattern layer is formed on the front; The bonding area includes a chip mounting area and a common mounting area; each bonding area is drilled with a front-to-back conducting hole; the inner wall of the guide hole is plated with copper, and the back of the ceramic substrate is plated with copper to form a ring The pad is filled with metal conductors in the via holes, so that electrical connection terminals are formed on the back of the ceramic substrate; By adopting the solution of the present invention, the dot spacing between sub-pixels can be further reduced, and the resolution can be improved.

Description

technical field [0001] The invention relates to the field of LED display. Background technique [0002] LCD (full name in Chinese: liquid crystal display, full name in English: Liquid Crystal Display) due to its principle and structural limitations, it is difficult to make it bigger, the bigger it is, the more difficult it is, the yield rate is low, and its cost increases significantly. Due to its size limitation, in some outdoor advertising display screens or 3D display fields with large size requirements, LCD display screens cannot meet the requirements. [0003] LED (full name in Chinese: Light Emitting Diode, full name in English: Light Emitting Diode) display is currently developing rapidly due to its advantages of high brightness, low operating voltage, low power consumption, large size, long life, impact resistance and stable performance. [0004] Existing LED displays can be made larger, generally divided into indoor LED and outdoor LED displays; outdoor LED display...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/12G09F9/33
Inventor 李应樵
Owner 北京天泰博远科技发展有限公司
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