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LED (Light-emitting Diode) chip, LED luminous substrate, display device and color display control method

A technology for LED chips and display devices, applied in optics, static indicators, nonlinear optics, etc., can solve the problem of high difficulty in production and transfer processes

Active Publication Date: 2017-06-09
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Embodiments of the present invention provide an LED chip set, its color display control method, and a display device, which can solve the problem of high difficulty in the production and transfer process of the existing Micro LED used for color display

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  • LED (Light-emitting Diode) chip, LED luminous substrate, display device and color display control method
  • LED (Light-emitting Diode) chip, LED luminous substrate, display device and color display control method
  • LED (Light-emitting Diode) chip, LED luminous substrate, display device and color display control method

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Embodiment Construction

[0035] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0036] An embodiment of the present invention provides an LED chip, such as figure 1 As shown, it includes: an N-type semiconductor layer 10 , a quantum well layer 20 and a P-type semiconductor layer 30 . The material of the quantum well layer 20 includes InGaN, wherein the molar ratio of indium atoms in InGaN is greater than or equal to 0.3.

[0037] LED (Light Emitting Diode) is mainly composed of PN junction, which has unidirectional conductivity. Its ligh...

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Abstract

The embodiment of the invention provides an LED chip, an LED luminous substrate, a display device and a color display control method and relates to the technical field of LED display. The problem that the conventional Micro LED manufacturing and transferring process for color display is high in difficulty can be solved. The LED chip comprises an N type semiconductor layer, a quantum well layer and a P type semiconductor layer. A material of the quantum well layer comprises indium gallium nitride, wherein a molar ratio of an indium in the indium gallium nitride is greater than or equal to 0.3. The indium gallium nitride serves as a main material of the quantum well layer in the LED chip, and the molar ratio of the indium in the indium gallium nitride is greater than or equal to 0.3, so that when the luminous substrate made of the LED chip is applied to the display device, the color displayed by light rays emitting from the luminous side of the LED chip can be controlled by adjusting current input into the LED chip; and therefore, color display applied to the display device is realized.

Description

technical field [0001] The invention relates to the technical field of LED display, in particular to an LED chip, an LED light-emitting substrate, a display device and a color display control method. Background technique [0002] LED (Light Emitting Diode, light-emitting diode) is a kind of semiconductor diode. It is a photoelectric element that relies on the unidirectional conductivity of the semiconductor PN junction to emit light. LED is currently a lighting element widely used in the world market. It has small size, High brightness, low power consumption, less heat generation, long service life, environmental protection and other advantages, and has a variety of colors, deeply loved by consumers. [0003] As a backlight source, LED chips play an indispensable role in mobile phones, televisions and other electronic products that require backlight display. As the size of electronic products continues to shrink, the size of LED chips needs to be greatly reduced to achieve ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/06H01L33/32H01L27/15G09G3/32
CPCH01L27/156H01L33/06H01L33/32G09G3/32G09G3/3225G09G2300/0426H01L25/167G02F1/133514G02F1/133528G02F1/133603G09G3/3413G09G3/3426G09G2300/0452H01L25/0753H01L33/50H01L33/58G02F1/133548
Inventor 王慧娟王美丽吕振华王飞杨泽洲
Owner BOE TECH GRP CO LTD
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