Sound pickup equipment and headset

[0031] Embodiment one

[0032] figure 1 A cross-sectional view of an embodiment of a sound pickup device provided by the present invention.

[0033] refer to figure 1 As shown, the sound pickup device provided in this embodiment can be applied to electronic devices such as earphones, and specifically includes a housing 10 and a microphone 20 , and a hollow channel 100 is also provided inside the housing.

[0034] The microphone 20 is disposed inside the housing 10 , and the hollow channel 100 is also located inside the housing 10 , and its length is longer than the thickness of the housing 10 . One end of the hollow channel 100 is opened on the shell, and the other end extends to the microphone 20, so that the sound needs to pass through the long hollow channel 100 when it reaches the microphone 20 through the shell 10. When a sound reaches the microphone 20, the microphone 20, the sound can be converted into a corresponding electrical signal to complete sound pickup.

[0035] Wherein, the microphone 20 is an electret microphone, and may also be a MEMS microphone.

[0036] It can be seen from the above technical solution that this embodiment provides a sound pickup device, which includes a shell, a microphone and a long hollow channel, the microphone communicates with the outside of the shell through the hollow channel, when the sound enters the shell It needs to go through a long hollow channel to reach the microphone, so that the sound needs to go through a long propagation path. During the propagation process, the sound pressure will become more stable due to the long hollow channel, thus avoiding irregular sound The phenomenon of spray marks generated by pressure makes users get a good experience.

[0037] Embodiment two

[0038] figure 2 It is a sectional view of another sound pickup device embodiment provided by the present invention.

[0039] refer to figure 2 As shown, the sound pickup device provided by this embodiment is applied to a headset, and specifically includes a shell, which includes a first shell 11 and a second shell 12, and between the first shell 11 and the second shell 12 is also A middle case 30 , a cover member 50 , an electronic circuit board 40 and a microphone 20 are provided.

[0040] When the sound pickup device is placed flat on a plane, the first housing 11 is located at the uppermost side, while the second housing 12 is located at the lowermost side, and the two housings form a closed cavity for the middle housing The body 30, the cover member 50, the electronic circuit board 40 and the microphone 20 are enclosed inside.

[0041] The middle housing 30 acts as a support, one side of which faces the first housing 11 and the other side faces the second housing 12 . The electronic circuit board 40 is arranged on the side facing the first housing 11, and a through hole 31 is arranged on it, as figure 2 As shown, the cover member 50 is provided on the side facing the second housing 12, and there is a gap between the cover member 50 and the middle housing 30, forming the hollow passage 100 described in the previous embodiment, the hollow passage 100 starts from the through hole 31 and ends with an end 32 of the middle cover plate 30, where a sound pickup hole (not shown) is opened.

[0042] The microphone 20 is arranged on the electronic circuit board 40, and the electronic circuit board 40 is fixed on the side of the middle housing 30 facing the first housing 11, and the microphone 20 on the electronic circuit board 40 passes through the through hole on the middle cover plate 30. The hole 31 faces the cover member 50 . Moreover, the distance between the microphone 20 and the cover member 50 is approximately equal to the width of the hollow channel 100 , and the central axis of the microphone 20 is perpendicular to the direction of the hollow channel 100 in terms of placement.

[0043] The middle casing 30 and the cover plate member 50 are connected by an adhesive, such as 3M glue, and the first casing 11 and the middle casing 30 are connected at the edges of the two, specifically, the two can be welded together by ultrasonic welding. together; the middle shell 30 and the second shell 12 can also be welded together by ultrasonic welding at their edge positions.

[0044] It can be seen from the above technical solution that this embodiment provides a sound pickup device, which is applied to a headset and includes a first housing, a second housing, an intermediate housing, a cover part, an electronic circuit board and microphone. The first casing, the electronic circuit board, the middle casing, the cover plate part and the second casing are sequentially connected, so that the first casing and the second casing form a cladding cavity, and the electronic circuit board, the middle casing The body and the cover part are wrapped inside, wherein, the hollow channel formed by the cover part and the middle shell is used as a channel for the sound to enter. Due to its slender structure, the sound pressure has changed when it reaches the microphone at the end of the hollow channel. It is relatively stable, so that the phenomenon of spraying marks caused by irregular sound pressure can be avoided, so that users can get a good use experience.

[0045]The cover plate part 50 in this embodiment can generally be made of stainless steel, that is, a stainless steel cover plate is used, and a groove 51 is arranged in the middle of the cover plate part 50, that is, the groove 51 and the middle housing 30 are used to form the Hollow channel 100 as sound channel.

[0046] In addition, there are end cap parts 33 at both ends of the sound pickup device. So that the first housing 11 and the second housing 12 form a complete closed cavity.

[0047] MEMS microphones are microphones based on MEMS (Micro Electromechanical Systems) technology. Simply put, a capacitor is integrated on a microsilicon chip. It can be manufactured using a surface mount process, can withstand high reflow temperatures, and is easy to integrate with CMOS processes and Other audio circuits are integrated and have improved noise cancellation performance and good RF and EMI suppression. The full potential of MEMS microphones has yet to be tapped, but products using this technology have demonstrated many advantages in a variety of applications, especially in mid-to-high-end mobile phone applications.

[0048] Embodiment three

[0049] Figure 5 A cross-sectional view of another sound pickup device embodiment provided for the invention.

[0050] refer to Figure 5 As shown, the sound pickup device provided in this embodiment is based on the previous embodiment with additional damping cloth 70 and silicone sleeve 80 .

[0051] The damping cloth 70 covers the surface of the microphone 20 to make the sound softer and more beautiful, and it can also play a dust-proof role to prevent dust from entering the interior of the microphone 20 through the hollow channel 100 .

[0052] The silicone sleeve 80 is used to wrap around the microphone 20 so that the microphone 20 can be tightly socketed in the through hole of the middle housing 30 to avoid vibration.