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Production method of rigid-flexible board

A technology of rigid-flex board and manufacturing method, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, electrical components, etc., and can solve problems such as bending of flexible boards

Inactive Publication Date: 2018-05-08
GUANGZHOU FASTPRINT CIRCUIT TECH +2
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Based on this, the present invention aims at overcoming the defect that the separation of the rigid-flexible bonding area in the prior art hides liquid medicine during the production of the over-humidity process of circuit production, and that the flexible board is buckled during the production of the outer circuit, and provides a rigid-flexible combination Method of making the board

Method used

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  • Production method of rigid-flexible board
  • Production method of rigid-flexible board
  • Production method of rigid-flexible board

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Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present invention, and do not limit the protection scope of the present invention.

[0027] Such as Figure 1 to Figure 3 The manufacturing method of a rigid-flexible board shown includes: making the flexible board 10, the first rigid board 20, the second rigid board 30 and the first prepreg 40 respectively, and the first rigid board 20, the flexible board 10 and the second rigid plate 30 are stacked in sequence, and the first prepreg 40 is arranged between each plate, that is, between the first rigid plate 20 and the flexible plate 10, and between the flexible plate 10 and the second rigid plate 30 Both are equipped with a first pre...

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Abstract

The invention discloses a production method of a rigid-flexible board. The method comprises the steps of manufacturing a flexible board, a first rigid board, a second rigid board and first prepregs separately, sequentially stacking the first rigid board, the flexible board and the second rigid board, arranging the first prepregs between the boards and carrying out laminating production through thefirst prepregs; carrying out outer line production on the laminated circuit board; and after outer line production is completed, windowing a middle segment of the first rigid board to form a windowing area, windowing the middle segment of the second rigid board to form a second windowing area and exposing a bending part of the flexible board, wherein the length of the first windowing area is smaller than that of the second windowing area, and the length of the bending part of the flexible board is equal to that of the second windowing area. According to the rigid-flexible board produced by using the production method of the rigid-flexible board, the phenomena of excessive bending and line rupture at the rigid-flexible position are avoided and the reliability of the rigid-flexible board isimproved.

Description

technical field [0001] The invention relates to the field of printed circuit boards, and more specifically, to a method for manufacturing a rigid-flex board. Background technique [0002] In the traditional rigid-flex board, the rigid board and the flexible board in the rigid area are stacked, and the flexible board protrudes from the edge of the rigid area, but the exposed flexible board is often limited by the installation space, making the rigid-flex Excessive bending occurs at the junction, which causes the circuit on the flex board to break. For example, when a rigid-flex board needs to be installed in a cylinder, if a traditional rigid-flex board is used, the circuit of the flexible board will be stuck on the inner wall of the cylinder, causing the circuit of the flexible board to break. Moreover, the production of traditional rigid-flex boards is easy to hide the liquid during production in an over-humidity process, which may easily lead to quality problems. Conten...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/4691
Inventor 叶何远林楚涛李志东
Owner GUANGZHOU FASTPRINT CIRCUIT TECH
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