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FPCB (flexible printed circuit board) board, smart card and packaging method thereof

A packaging method and smart card technology, applied in the field of smart cards, can solve problems such as poor appearance, high scrap rate, and poor function, and achieve the effect of ensuring appearance and function requirements and improving yield rate

Pending Publication Date: 2018-07-13
SHENZHEN EXCELSECU DATA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main purpose of the present invention is to propose a kind of FPCB board, smart card and packaging method thereof, to solve the problem that the relative position of at least two components of the smart card is shifted due to processing, resulting in poor appearance or poor function, and a high scrap rate. high problem

Method used

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  • FPCB (flexible printed circuit board) board, smart card and packaging method thereof
  • FPCB (flexible printed circuit board) board, smart card and packaging method thereof
  • FPCB (flexible printed circuit board) board, smart card and packaging method thereof

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Embodiment Construction

[0040] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0041] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.

[0042] In addition, if there are descriptions involving "first", "second" and ...

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Abstract

The invention discloses an FPCB (flexible printed circuit board) board, a smart card and a packaging method thereof. The FPCB board is provided with a first component and a second component, the FPCBboard is provided with a through groove at the position of the second component, and the through groove is used for providing a deformation space for the FPCB board when the second component and the first component are positioned on the smart card, so that processing errors of the two components can be adjusted through the deformation, the two components on the FPCB board can be fixedly positionedat correct positions of the smart card, and poor appearance or poor functions of the smart card due to deflection, caused by production and processing errors, of the two components can be avoided. Inaddition, appearance and functional requirements of the components on the smart card are guaranteed, and smart card production yield is increased.

Description

technical field [0001] The invention relates to the technical field of smart cards, in particular to an FPCB board, a smart card and a packaging method thereof. Background technique [0002] The smart cards currently produced usually have an electronic display and a tape carrier unit. The relative positions of the tape carrier unit and the display screen are fixed. If the two positions deviate, it will affect the appearance and cause the entire card to be scrapped. During the production and processing process, the tape carrier unit and the display screen will have processing errors, which will cause the two positions to shift, and cannot be positioned accurately, resulting in poor appearance or poor function, and a high scrap rate of smart cards. Contents of the invention [0003] The main purpose of the present invention is to propose a kind of FPCB board, smart card and packaging method thereof, to solve the problem that the relative position of at least two components o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18
CPCH05K1/18H05K2201/09036H05K1/189H05K1/028H05K2201/10128H05K3/326H05K1/183H05K3/4697H05K3/303H05K2201/09063H05K2201/10431H05K2201/091G06K19/07745Y02P70/50
Inventor 陈柳章
Owner SHENZHEN EXCELSECU DATA TECH
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