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Virtual reality device

A technology of virtual reality and equipment, applied in the field of virtual reality, can solve the problems of active cooling methods such as high noise, short life, and inapplicability, and achieve the effect of being conducive to lightweight design, realizing heat dissipation and cooling, and avoiding weight problems

Pending Publication Date: 2018-11-06
QINGDAO PICO TECH CO LTD
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  • Abstract
  • Description
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Problems solved by technology

However, the existing active cooling method, which uses fans to dissipate heat, is noisy and has a short lifespan, and is not suitable for virtual reality equipment

Method used

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Embodiment Construction

[0023] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0024] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation, therefore, should not be construed as limiting the invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and should not ...

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Abstract

The invention discloses a virtual reality device which comprises a front shell, and a mainboard arranged on the inner side of the front shell, wherein the front shell is made of a heat-conducting material; a processing chip and a power management circuit are arranged on the front side of the mainboard; a thermal diffusion membrane is arranged between the inner wall of the front shell and the mainboard; and the thermal diffusion membrane is respectively contacted with the front shell, the processing chip and the power management circuit. With the adoption of a passive heat dissipation manner, the front shell and cooling fins of the virtual reality device are integrated, the front shell is made of the heat-conducting material, the thermal diffusion membrane is arranged between the inner wallof the front shell and the mainboard and contacted with the processing chip and the power management circuit of the mainboard, so that heat generated by operation is rapidly conducted to the front shell and finally dissipated to an external environment, and heat dissipation cooling of the virtual reality device can be realized. Moreover, by taking the front shell as the cooling fins of the virtual reality device, the weight problem brought by added extra cooling fins is solved, the lightweight design is facilitated, and the wearing experience is improved.

Description

technical field [0001] The invention relates to the technical field of virtual reality, in particular to a virtual reality device. Background technique [0002] In virtual reality technology, in order to provide users with an immersive virtual reality experience, it is usually necessary to use a virtual reality device close to the body, such as a virtual reality all-in-one machine shaped like a virtual reality helmet, glasses, etc., and a processor chip is installed in its housing , as a game host, it can run applications and use the embedded screen-lens system to provide users with a realistic virtual reality experience. From the perspective of safety and comfort experience, virtual reality devices need to have good heat dissipation . However, the existing active cooling method, which uses fans to dissipate heat, is noisy and has a short lifespan, and is not suitable for virtual reality devices. Contents of the invention [0003] In view of the problem that a virtual re...

Claims

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Application Information

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IPC IPC(8): G02B27/01
CPCG02B27/0176G02B2027/0178
Inventor 王彦波李海岗刘远航
Owner QINGDAO PICO TECH CO LTD
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