Novel power supply power module structure with input protection

Abstract

The invention provides a novel power supply power module structure with input protection and belongs to the field of semiconductor components. The novel power supply power module structure comprises four rectifier chips, an overvoltage protection chip, two input terminals, two output terminals and a plastic package body, and is characterized by further comprising a first frame unit, a second frameunit and a third frame unit which are arranged relatively in sequence; the four rectifier chips are arranged between the first frame unit and the second frame unit; the overvoltage protection chip isarranged between the second frame unit and the third frame unit to form a laminated structure; the two input terminals are led out of the second frame unit; the two output terminals are led out of the first frame unit; the four rectifier chips and the overvoltage protection chip are packaged integrally by the laminated structure, and a structure with the four rectifier chips laid flatly and integrated vertically with the overvoltage protection chip is formed, spatial arrangement of the package structure is more reasonable, the product occupies small planar space on a PCB, and the problem about space utilization rate of the PCB is solved.

Description

technical field [0001] The invention relates to the field of semiconductor components, in particular to a novel power supply module structure with input protection. Background technique [0002] With the development of society, electronic products are becoming more and more sophisticated, and the requirements of electronic products for power supply are also getting higher and higher. When the existing AC power grid is struck by lightning and power equipment starts and stops, instantaneous interference will occur in the power grid, which will damage electronic equipment and circuits. Many electronic components that use direct current are used in electronic products, so it is necessary to add electronic components such as a rectifier bridge that converts AC to DC and has a rectification and voltage stabilization structure before connecting to the grid to realize the protection of other electronic components. Protect. Existing TVS diodes have extremely fast response times (na...

AI Technical Summary

Problems solved by technology

[0004] Although the above structure solves the problem of large space occupied by welding TVS diodes on the circuit board to a certain extent, there are still the following problems: the wire bonding process itself has limitations, the production efficiency is relatively low, and the production conditions are relatively harsh. Moreover, the lead wires used are prone to collapse of the welding wire during the plastic packaging process, resulting in a low product yield and affecting the quality of the product; the lead wires used are generally copper wires, and in order to meet the packaging requirements, the copper wires used The fineness requirement is extremely high, which will inevitably lead to an increase in product cost, and the wiring operation is more troublesome, and the wiring speed is slow, which affects production efficiency; in addition, this structure uses a wire bonding process to weld the TVS diode and the chip of the rectifier bridge in a tiled manner Together, the structural layout is not reasonable enough and occupies a large plane space on the PCB, which not only restricts the miniaturization development of the rectifier bridge, but also directly leads to the limitation of the rectifier bridge that can be packaged by each group of frames in the process of its processing. Quantity, which affects the production efficiency of the product

Images