Modular water-cooled heat dissipation server
A water-cooled heat dissipation and server technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems of poor heat dissipation and high noise, and achieve fast heat dissipation efficiency, low energy consumption, and reasonable structural design Effect
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Embodiment example 1
[0025] Implementation case 1: A modular water-cooled heat dissipation server, including a box body 1, characterized in that a heat-insulating horizontal plate is arranged horizontally inside the box body 1, and the box body 1 is divided into heat-generating components by the heat-insulating horizontal plate for installation room and the electrical control installation room 2 located at the lower end of the heating element installation room, the installation room, the cooling room and the power room 15 are arranged inside the heating element installation room, and the installation board 13 is arranged in the installation room, and the front of the installation board 13 The wall is provided with an installation groove 4, on which a heating element is installed, and a cooling cavity 14 is formed between the heating elements, and a water cooling assembly is arranged in the cooling cavity 14, and the water cooling assembly includes a plurality of cooling balls 5. The heat dissipatio...
Embodiment example 2
[0026] Implementation Case 2: The heat dissipation ball 5 has a hemispherical cross section, the heat dissipation ball 5 is made of aluminum alloy, and thermal conductive silicone grease is arranged between the heat dissipation ball 5 and the heating element.
Embodiment example 3
[0027] Implementation Case 3: The radiator includes a fan 12, a plurality of cooling fins 10 arranged in parallel, and an air guide pipe 11 pierced on the heat dissipation fins 10, and the end of the air guide pipe 11 communicates with the fan 12 , the air guide pipe 11 is provided with ventilation holes, the ventilation holes are set corresponding to the heat dissipation fins 10, a first through hole is provided between the heat dissipation chamber and the installation chamber, and the first header 6 communicate with the cooling fins 10 through the first through hole.
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