A kind of engineering adhesive capable of photothermal dual curing and its preparation method and application

Abstract

The invention discloses a photothermal dual-curable engineering adhesive and its preparation method and application. It is prepared from the following components in parts by weight: 20-70 parts of polyurethane acrylate; 10 parts of epoxy polyacrylate ~30 parts; 15~40 parts of isobornyl acrylate; 10~30 parts of cyclotrimethylolpropane methylal acrylate; 0.2~15 parts of nano inorganic filler; 0.5~3 parts of photoinitiator; 0.5~3 parts of thermal initiator 3 parts; 0.5-5 parts of photochromic powder. Nano-inorganic fillers are uniformly dispersed in the adhesive, so that the adhesive has high hardness after curing, no cracks on the surface, and good mechanical properties; and the photochromic powder in the adhesive can be evenly fused with the adhesive after modification, solving the problem of The problem of ultraviolet light absorption of conventional colored adhesives is solved, so that the adhesive is completely cured and has the function of color indication. The engineering adhesive capable of dual curing of light and heat described in the invention has a simple preparation method, a short production cycle, and is easy for industrial production.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to a photothermal dual-curable engineering adhesive and a preparation method and application thereof. Background technique [0002] Adhesives play an extremely important role in industrial production and engineering. Due to the problems of traditional solvent-based and hot-melt adhesives in the process of production and use, such as polluting the environment, high energy consumption in the production process, slow curing speed, short service life, and reduced bond strength after long-term use, the application of adhesives is limited. Application, especially when used in some engineering fields such as civil engineering and construction, due to the limitation of external conditions, the curing of adhesives is more difficult, which restricts the development of the adhesive industry to a certain extent. Therefore, the development and application of new adhesives have attracted much attention....

AI Technical Summary

Problems solved by technology

However, UV-curable adhesives also have their own limitations. The hardness of conventional UV-curable adhesives is not high after curing, and the adhesive layer is brittle and may have cracks, and the mechanical properties are poor; During the curing process, the light-absorbing effect of the adhesive itself will lead to incomplete curing of the glue, or even no curing, resulting in insufficient bonding strength or even bonding failure; during the curing process, the shading part of the translucent material or component is exposed to ultraviolet The absorption, blocking and reflection of light lead to a decrease in the photoinitiation efficiency of the adhesive and incomplete curing, which greatly reduces the mechanical properties of the adhesive.

These limitations directly limit the scope of application of UV-curable adhesives in engineering fields such as construction, automobiles, machinery, electronics, aerospace, and medical treatment to a certain extent.

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