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Headset, information transmission method and storage medium

A headphone and earphone technology, applied in transmission systems, near-field transmission systems, earpiece/earphone accessories, etc., can solve problems such as low reliability, long physical distance of signal lines, and easy breakage.

Inactive Publication Date: 2020-07-07
GEER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In related technologies, in order to solve the above problems, the physical distance between the signal lines is as far as possible, or each core is wrapped with a shielding material, resulting in a larger cross-sectional area of ​​all the wires, which cannot be assembled to the head of the earphone, and the wires are thick. And hard, easy to break, not very reliable

Method used

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  • Headset, information transmission method and storage medium
  • Headset, information transmission method and storage medium
  • Headset, information transmission method and storage medium

Examples

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Embodiment Construction

[0048] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

[0049] The embodiment of the present application discloses a headset, such as figure 1 As shown, it includes a headband and a first earphone 201 and a second earphone 202 respectively arranged at both ends of the headband 100, and the headset also includes:

[0050] The first coil 301 and the second coil 302 located at both ends of the headband 100; and a magnetically permeable material strip 400 arranged along the headband 100 and having a shape matching the headband, the magnetically perm...

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PUM

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Abstract

The invention discloses a headset, an information transmission method and a computer readable storage medium. The headset comprises a headband, and a first earphone and a second earphone respectivelyarranged at two ends of the headband. The headset further comprises a first coil and a second coil arranged at two ends of the headband, and a magnetic conduction material belt arranged along the headband, wherein the shape of the magnetic conduction material belt is matched with that of the headband, and the two ends of the magnetic conduction material belt penetrate through the first coil and the second coil respectively. The first earphone comprises a first circuit board, the first coil is electrically connected with the first circuit board, and the second coil is electrically connected with the second earphone. As digital signals are transmitted in the magnetic conductive material in the form of magnetic signals without mutual crosstalk, the electrical problems of noise, crosstalk andthe like are solved, and the reliability is higher.

Description

technical field [0001] The present application relates to the technical field of earphones, and more specifically, relates to an earphone, an information transmission method, and a non-volatile computer-readable storage medium. Background technique [0002] Traditional stereo headphones, especially wireless headphones, are connected by connecting wires between the left and right ears. The connection usually includes a power cord, spk (full name in Chinese: speaker, full name in English: SPEAKER) line, mic (full name in Chinese) : Microphone, English full name: microphone) line, audio signal line and some digital control signal lines. Serious signal crosstalk will occur between multiple lines. For example, the crosstalk of the digital signal in the connection line to the spk or mic will generate periodic noise, and the crosstalk of the signal in the spk line to the mic line will form an echo. [0003] In related technologies, in order to solve the above problems, the physica...

Claims

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Application Information

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IPC IPC(8): H04R1/10H04R3/02H04B5/00
CPCH04R1/1008H04R3/02H04B5/24H04B5/72
Inventor 林孟钊
Owner GEER TECH CO LTD
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