A packaging structure and packaging device for a flexible circuit board

Abstract

The invention discloses a packaging structure of a flexible circuit board, which includes a packaging side cover for quickly positioning the circuit board, and an integrated cooling plate for dissipating heat from the circuit board is installed on one side of the packaging side cover. The surface of the other side of the package side cover is installed with a high-temperature heat conduction plate for auxiliary circuit board port heat dissipation. The invention can realize rapid heat dissipation of the circuit board and control the degree of bending in a relatively sealed environment through the evaporation chamber and the water-absorbing cotton block. When the operation is carried out, once the circuit board heats up, the heat of the conductor on the surface of the circuit board can be quickly dissipated by evaporating the moisture in the absorbent cotton block, and then the heated rapid expansion platform is heated and expanded to squeeze out the moisture in the absorbent cotton block to evaporate in the evaporation chamber The water content is more, the heat dissipation efficiency is higher, and when the water-absorbing cotton block adjusts the inner space of the evaporation chamber by increasing the evaporated water, the water-absorbing cotton block will be compressed and the regulating column will be pressed, so that the bending degree of the circuit board can be controlled operation.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a packaging structure and packaging device of a flexible circuit board. Background technique [0002] Flexible circuit board is a kind of highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability. [0003] During the assembly process where the flexible circuit board is embedded inside the electronic device, the flexible circuit board is easily damaged. In addition, since the flexible circuit board is exposed to the outside world without any protection, once it comes into contact with dust and moisture, the stability of the circuit operation of the flexible circuit board will be reduced. Therefore, in order to solve this problem in the prior art, the flexible circuit board It is arranged in a relatively sealed pa...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a flexible circuit board packaging structure and packaging device to solve the problem that the relatively sealed package in the prior art will cause the circuit board to dissipate heat in time, and the conductor will be easily damaged if the circuit board is bent frequently technical issues

Images