Packaging structure and packaging device of flexible circuit board

A flexible circuit board and packaging structure technology, applied in the directions of printed circuits, printed circuit manufacturing, printed circuit components, etc., can solve the problems of insufficient heat dissipation of the circuit board and damaged conductors, reducing the degree of bending and high heat dissipation efficiency. Effect

Active Publication Date: 2020-11-20
江苏爱矽半导体科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a flexible circuit board packaging structure and packaging device to solve the problem that the relatively sealed pac

Method used

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  • Packaging structure and packaging device of flexible circuit board
  • Packaging structure and packaging device of flexible circuit board
  • Packaging structure and packaging device of flexible circuit board

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Embodiment Construction

[0041] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0042] like figure 1 As shown, the present invention provides a package structure of a flexible circuit board, including a package side cover 1 for quick positioning of the circuit board, and an integrated cooling plate for dissipating heat from the circuit board is installed on one side of the package side cover 1 2. The other side surface of the packaging side cover 1 is installed with a high-temperature heat conduction plate 3 for assisting the heat dissipa...

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Abstract

The invention discloses a packaging structure of a flexible circuit board. The packaging structure comprises a packaging side cover for quickly positioning the circuit board, an integrated heat dissipation plate used for dissipating heat of the circuit board is installed on the surface of one side of the packaging side cover, and the surface of the other side of the packaging side cover is provided with a high-temperature heat conduction plate which is used for assisting the heat dissipation of the port of the circuit board. According to the invention, an evaporation chamber and an absorbent cotton block are arranged, rapid heat dissipation of the circuit board and operation of controlling the bending degree are realized in a relatively sealed environment, during implementation, once the circuit board emits heat, the heat of the conductor on the surface of the circuit board can be quickly dissipated by evaporating the moisture in the absorbent cotton block; then, the heated quick expansion table is heated to expand to extrude moisture in the absorbent cotton block; and when the space in the evaporation chamber is adjusted to be reduced by increasing the evaporation moisture of theabsorbent cotton block, the absorbent cotton block is pressed, so that the regulation and control column is pressed, and therefore, the operation of controlling the bending degree of the circuit boardcan be realized.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a packaging structure and packaging device of a flexible circuit board. Background technique [0002] Flexible circuit board is a kind of highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability. [0003] During the assembly process where the flexible circuit board is embedded inside the electronic device, the flexible circuit board is easily damaged. In addition, since the flexible circuit board is exposed to the outside world without any protection, once it comes into contact with dust and moisture, the stability of the circuit operation of the flexible circuit board will be reduced. Therefore, in order to solve this problem in the prior art, the flexible circuit board It is arranged in a relatively sealed pa...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K7/20H05K3/00
CPCH05K1/02H05K3/00H05K7/20309H05K7/20381H05K7/205
Inventor 周波
Owner 江苏爱矽半导体科技有限公司
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