Packaging mechanism and packaging methodof silicon-based adapter plate

Abstract

The invention discloses a packaging mechanism and a packaging method of a silicon-based adapter platethere, and relates to the technical field of semiconductor processing. The packaging mechanism comprises a silicon substrate, a protective layer, packaging air bags, a heat preservation assembly, a packaging sleeve, an air inlet assembly and a plugging assembly, a mounting groove is formed in the packaging sleeve, the packaging air bags are mounted on the upper side groove wall and the lower side groove wall of the mounting groove, and the silicon substrate is installed in the mounting groove.By arranging the packaging air bags and the air inlet assembly, a one-way valve is opened, high-pressure air in an air tank enters an air cylinder, air inlet of the packaging air bags is achieved, after air inlet of the packaging air bags, positioning, clamping and fixing of the silicon substrate are achieved, stable fixing of the silicon substrate is guaranteed, and after air inlet, due to the fact that air pressure is gradually increased, a piston is jacked, an electrode ball is in contact with an electrode plate, an indicator lamp is powered on and brightens, air inflow to the air cylinderis stopped, it can be guaranteed that the air pressure in the packaging air bags is stable, the silicon substrate is not pressed, and meanwhile fixation of the silicon substrate is guaranteed.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a packaging mechanism of a silicon-based adapter plate and a packaging method thereof. Background technique [0002] With the continuous development of microelectronics technology, users have higher and higher requirements for the miniaturization, multi-function, low power consumption and high reliability of the system, especially in recent years, the blowout of the market demand for portable handheld terminals, such as laptop computers, smart Mobile phones and tablet computers require higher-speed signal transmission and processing capabilities, and put forward higher requirements for system integration and performance. In order to meet high interconnection density and shorten interconnection paths, system integrators began to work more and more Turning more and more to 2.5D / 3D integrated circuits and system-level integration technologies; [0003] When encapsu...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a packaging mechanism and packaging method for a silicon-based adapter board, which solves the problem that after packaging, the adapter board is easy to move, and the movement is prone to friction, which will cause damage to the silicon-based adapter board, and will cause damage to the silicon-based adapter board. The silicon substrate causes irreparable wear and tear, which easily leads to the direct scrapping of the silicon-based adapter board, and easily causes wasteful technical problems

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