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High-performance audio and video coding device based on HEVC

A coding device, audio and video technology, applied in the direction of digital video signal modification, TV, color TV, etc., can solve the problems of only focusing on the compression ratio, not on the delay index, etc., to achieve large resolution, convenient positioning and troubleshooting, large Effects of Video Compression Applied

Active Publication Date: 2021-03-19
NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

On the other hand, the HEVC algorithm in the traditional monitoring field only pays attention to the compression ratio and does not pay attention to the delay index

Method used

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  • High-performance audio and video coding device based on HEVC

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Embodiment Construction

[0032] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0033] refer to figure 1 As shown, a high-performance audio and video encoding device based on HEVC, which includes an SDI video interface, a PAL video interface, a CameraLink video interface, an HDMI video interface, an audio interface, a synchronous data output interface, a control interface, a return interface, FPGA, HEVC Encoding core board, the FPGA is used to realize SDI preprocessing module, PAL preprocessing module, CameraLink preprocessing module, audio coding module, control instruction analysis module, return framing module, synchronous data output module.

[0034]Specifically, the SDI video interface receives standard SDI video data, converts the externally input high-speed serial SDI video data into 1 pair of differential clocks and 5 pairs of differential data through the SDI video equalizer and SDI deserializer, and out...

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Abstract

The invention discloses a high-performance audio and video coding device based on HEVC, and belongs to the technical field of audio and video compression. The system comprises an SDI video interface,a PAL video interface, a CameraLink video interface, an HDMI video interface, an audio interface, a synchronous data output interface, a control interface, a return interface, an FPGA and an HEVC coding core board. The FPGA is used for realizing an SDI preprocessing module, a PAL preprocessing module, a CameraLink preprocessing module, an audio coding module, a control instruction analysis module,a return framing module and a synchronous data output module. According to the invention, the compatible video sources are rich, the transmission of the audio from the compression end to the decompression end can be realized, and the audio shouting application from the decompression end to the compression end can also be realized, so that the function of low-delay audio and video transmission isrealized.

Description

technical field [0001] The invention relates to the technical field of audio and video compression, in particular to an HEVC-based high-performance audio and video encoding device, which can be used in unmanned aerial systems that use fixed bandwidth links for transmission. Background technique [0002] The HEVC algorithm is the latest generation of video compression algorithm, which has higher compression efficiency than the H.264 algorithm. In unmanned aerial vehicle systems, link resources are very limited, and the requirements for image quality are getting higher and higher. Therefore, it is of great value to apply the HEVC video coding algorithm to the unmanned aerial vehicle system. Under the same video quality, HEVC can save more link resources than the H.264 algorithm, and improve the working distance and anti-interference performance of the link. On the other hand, the HEVC algorithm in the traditional monitoring field only pays attention to the compression ratio ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N19/12H04N19/184H04N19/42H04N5/765
CPCH04N19/12H04N19/184H04N19/42H04N5/765
Inventor 张俊凯李光耿炎胡佳龚志勇左栋
Owner NO 54 INST OF CHINA ELECTRONICS SCI & TECH GRP
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