Unlock instant, AI-driven research and patent intelligence for your innovation.

PCB (Printed Circuit Board) and processing method of PCB test drill hole

A technology of PCB board and processing method, which is applied in the field of processing of PCB board and PCB board trial drilling

Pending Publication Date: 2021-06-08
珠海杰赛科技有限公司 +1
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention provides a PCB board and a method for processing PCB board trial drilling, which solves the technical problems in the above-mentioned prior art. The method for processing PCB board trial drilling c

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • PCB (Printed Circuit Board) and processing method of PCB test drill hole
  • PCB (Printed Circuit Board) and processing method of PCB test drill hole
  • PCB (Printed Circuit Board) and processing method of PCB test drill hole

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] see Figure 1-Figure 4 , figure 1 It is a schematic diagram of the first board structure of the processing method of the PCB board trial drilling in the first embodiment of the present invention, figure 2 for figure 1 A-A sectional view of, image 3 It is a schematic diagram of the 3mm×3mm marked area of ​​the processing method of the PCB board trial drilling in the first embodiment of the present invention, Figure 4 for image 3 The B-B section view.

[0027] The method for processing PCB board trial drilling provided by the present invention belongs to the technical field of circuit board processing. The processing method for PCB board trial drilling can improve the effect of checking the deviation of the first board of high-layer board drilling, and improve the alignment of drilling holes. Improve the inner layer short circuit problem caused by drilling deviation.

[0028] This embodiment firstly provides a PCB board, the PCB board includes N core boards, whe...

Embodiment 2

[0046] see Figure 5 and Figure 6 , Figure 5 It is a schematic diagram of the first board structure of the processing method of the PCB board trial drilling in the second embodiment of the present invention, Figure 6 for Figure 5 C-C section view.

[0047] In this embodiment, the difference from the first embodiment above is that the outer layer of the PCB is not provided with a dielectric layer and a copper foil layer, but the first core board and the Nth core board are used as the outer layer of the PCB. The second to N-1 core boards are used as the inner layer of the PCB board, which is called "outer laminated core board structure". At this time, see Figure 5 and Figure 6 , the second copper layer in the marked area 101 of the first core board 100 faces upward, and the second copper layer in the marked area 701 of the fourth core board 700 faces downward.

[0048] Further, in this embodiment, the diameter of the central pad 111 is 44 mil, the diameter of the cen...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a processing method of a PCB (Printed Circuit Board) test drill hole, which comprises the following steps of: marking a marking area with the specification of 3mm * 3mm on a first core board to an Nth core board, and setting the distance between an (N-1)th marking area and an Nth marking area to be 4mil; carrying out hollowing processing on the (N-1)th core board corresponding to the first to (N-2)th marking areas and the Nth marking area; carrying out hollowing treatment on the Nth core board in an area corresponding to the first to (N-1)th marking regions; etching a central bonding pad on the first copper layer of the marked area of each core board; etching a central base material ring on the second copper layer of the marked area of each core board, wherein the central base material ring coincides with the center of the central bonding pad; clamping a dielectric layer between the (N-1)th core board and the Nth core board; and drilling after pressing from top to bottom. According to the processing method of the PCB test drill hole, the deviation checking effect of the first drilling board of the high-layer board is improved, the drilling alignment degree is improved, and the problem of inner layer short circuit caused by drilling deviation is solved.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a method for processing a PCB board and a trial drilling hole of the PCB board. Background technique [0002] For super-high-rise PCB boards, the effect of drilling layer deviation is checked by the first board test drilling method. Due to the high layer number / copper thickness of super-high-rise PCB boards and the influence of X-RAY inspection penetration effects and other factors, the actual test It is difficult to identify the offset effect of drilling relative to each layer; especially for high-layer boards with small hole-to-line spacing, it is easy to cause the deviation of drilling to be unrecognizable and cause batch drilling offset short circuit problems. Contents of the invention [0003] The present invention provides a PCB board and a method for processing PCB board trial drilling, which solves the technical problems in the above-mentioned prior art...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K1/11H05K1/14H05K1/18H05K3/46
CPCH05K1/115H05K1/14H05K1/185H05K3/4679
Inventor 何亮张良昌黄光建
Owner 珠海杰赛科技有限公司