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Semiconductor structure and method for forming the same

A semiconductor and wire technology, applied in the field of semiconductor structures and their formation, which can solve the problems of reduced yield, increased processing and IC manufacturing complexity, etc.

Inactive Publication Date: 2017-03-29
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, this scaling down also increases the complexity of processing and manufacturing the IC
With higher device densities and scaling, short circuits may occur more frequently during BEOL processing of ICs, which will result in lower yields

Method used

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  • Semiconductor structure and method for forming the same
  • Semiconductor structure and method for forming the same
  • Semiconductor structure and method for forming the same

Examples

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Embodiment Construction

[0019] The following disclosure provides many different embodiments or examples for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are only examples and are not intended to limit the invention. For example, in the following description, forming a first part over or on a second part may include embodiments in which the first part and the second part are formed in direct contact, and may also include an embodiment that may be formed between the first part and the second part Additional parts so that the first part and the second part may not be in direct contact with one embodiment. Furthermore, the present disclosure may repeat reference numerals and / or characters in various instances. This repetition is for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and / or configu...

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PUM

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Abstract

A semiconductor structure and a method for forming the semiconductor structure are provided. In various embodiments, the method for forming a semiconductor structure includes following steps. A structure on a semiconductor substrate is received, which the structure includes at least two conductive lines and a shorting bridge, and the conductive lines electrically connected to each other through the shorting bridge. The shorting bridge is insulated to make the conductive lines electrically isolated to each other.

Description

technical field [0001] Embodiments of the present invention relate to integrated circuit devices, and more particularly, to semiconductor structures and methods of forming the same. Background technique [0002] The semiconductor industry has experienced exponential growth and continued progress in pursuit of higher device densities and performance and lower costs. Technological advances in integrated circuit (IC) materials and design have produced generations of ICs, each with smaller and more complex circuits than the previous generation. During IC evolution, functional density (eg, the number of interconnected devices per chip area) has generally increased while geometries have shrunk. This scale-down process generally provides benefits by increasing production efficiency and reducing associated costs. [0003] In the general manufacturing scheme of IC, there are two main parts, front end of line (FEOL) process and back end of line (BEOL) process. Typically, BEOLs incl...

Claims

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Application Information

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IPC IPC(8): H01L21/768H01L23/525
CPCH01L21/76888H01L21/485H01L21/764H01L21/7682H01L23/4821H01L23/5222H01L23/528H01L23/5283H01L23/53214H01L23/53223H01L23/53228H01L23/53238H01L23/5329H01L23/5381H01L23/564H01L23/525
Inventor 尤宏志陈建茂
Owner TAIWAN SEMICON MFG CO LTD