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Bill financing method and system based on intelligent auction platform, equipment and medium

An intelligent and bill technology, applied in the field of bill financing, can solve the problems of difficulty in financing, expensive financing, and loss of income for small and medium-sized enterprises, and achieve the effects of protecting interests, improving successful matching, and improving transparency.

Pending Publication Date: 2021-06-11
HUNAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The present invention provides a bill financing method based on an intelligent bidding platform, a system, a device, and a computer-readable storage medium, so as to solve the technology that small and medium-sized enterprises have difficulty in financing, expensive financing and damaged income in the existing bill acceptance mode question

Method used

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  • Bill financing method and system based on intelligent auction platform, equipment and medium
  • Bill financing method and system based on intelligent auction platform, equipment and medium
  • Bill financing method and system based on intelligent auction platform, equipment and medium

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Embodiment Construction

[0044] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention can be implemented in various ways defined and covered below.

[0045] like figure 1 As shown, the preferred embodiment of the present invention provides a method for bill financing based on an intelligent bidding platform, comprising the following steps:

[0046] Step S1: The fund demander node and the fund supplier node register their identities, and record them on the blockchain after successful registration;

[0047] Step S2: The fund demander node lists the bill information into the demand information of the smart auction platform node, and the fund supplier node lists the available funding information into the supply information of the smart auction platform node;

[0048] Step S3: The fund demander node publishes financing information on the smart auction platform node, multiple fund supplier nodes publish bidding info...

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Abstract

The invention discloses a bill financing method, system and device based on an intelligent auction platform, and a computer readable storage medium, and the method employs the technology of combining a block chain with an intelligent auction algorithm, builds a decentralized bill trading platform, improves the authenticity and transparency of bill financing background data, the trading cost such as searching cost, information cost and bargaining cost is reduced, the bargaining capability of the fund demander is improved, the benefit loss of the fund demander in the financing process is reduced, meanwhile, the probability of successful matching and transaction conclusion of the two parties is improved, and finally the safer, more efficient and more reliable financing method is achieved.

Description

technical field [0001] The present invention relates to the technical field of bill financing, in particular, to a bill financing method based on an intelligent bidding platform, a system, a device, and a computer-readable storage medium. Background technique [0002] Bill financing refers to a method in which the holder of the bill obtains a commercial bill of exchange through a non-trade method, and uses the bill to apply to the bank for discounting funds to achieve financing purposes. The traditional bill financing business process is that when small and medium-sized enterprises have capital needs, they go to the bank with a commercial acceptance bill to go through the bill discount procedure. Under the background that discount and rediscount rates have been basically marketized, the cost of obtaining funds for bill financing is much lower than that of general loans, thereby reducing the financing cost of enterprises. [0003] The traditional bill acceptance mode has the...

Claims

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Application Information

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IPC IPC(8): G06Q30/08G06Q20/38G06Q20/40G06Q40/04G06Q40/06
CPCG06Q30/08G06Q20/3825G06Q20/3827G06Q20/3829G06Q20/4014G06Q40/04G06Q40/06
Inventor 马超群杨竟澜周中定李信儒兰秋军
Owner HUNAN UNIV
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