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49results about How to "Less loss" patented technology

Detinning processing method of chip and chip detinning machine applying method

InactiveCN102126059ALess lossLess solder lossSoldering apparatusSolderingTin
The invention discloses a detinning processing method of a chip, and the method comprises the following steps: providing a scraper, a die, a heating mechanism and a recovery device, wherein a first inclined plane which forms an inclination angle with the horizontal plane is arranged on the upper surface of the die, a plurality of grooves for accommodating and fixing chips are formed on the first inclined plane, the height of each groove is equivalent to the thickness of each chip, and the recovery device is arranged on one side corresponding to the lower edge of the first inclined plane belowa conveying mechanism; arranging the chips in the grooves; placing the die on the heating mechanism, and utilizing the heating mechanism to heat the chips so as to melt soldering tin on the chips; and utilizing the scraper to scrape the soldering tin on the chips into the recovery device. In the method, the scraper is utilized for scraping off the molten soldering tin form the chips, the soldering tin can stably slide into the recovery device along the wall of the scraper, the loss of the soldering tin is low, and the recovery rate is high; and furthermore, the plurality of the grooves are arranged on the die, the plurality of the chips can be scraped according to needs, and the tin scraping efficiency is high. In addition, the invention further provides a chip detinning machine applying the detinning processing method of the chip.
Owner:何光宁

Weightless chip tin remover

InactiveCN108380995ATin removal achievedMeet the needs of batch tin removalSoldering apparatusLiquid stateElectric machinery
The invention provides a weightless chip tin remover which comprises a device body, wherein the device body comprises a control console; a heating plate is arranged at the top of the control console;a heater is arranged in the heating plate; a first supporting plate and a second supporting plate are arranged at the top of the heating plate; the first supporting plate is positioned on one side ofthe heating plate; the second supporting plate is positioned on the other side of the heating plate; and a recovery box is arranged between the first supporting plate and the second supporting plate.The weightless chip tin remover provided by the invention has the beneficial effects that an adsorption table and a chip carrier plate are turned over through a driving motor, so that chips in the chip carrier plate can get close to the heating surface of the heating plate and can be heated by the heater according to the preset temperature, original soldering tin on the surfaces of the chips can be molten to achieve the liquid state, as well as the soldering tin in the liquid state can be separated from the surfaces of the chips under the action of weightlessness and then can drop into the recovery box below the chips; accordingly, the low loss of the soldering tin and the high recovery rate can be achieved; and the chips in batch can be subjected to tin removal and the high tin removal efficiency can be achieved.
Owner:HUZHOU HUINENG ELECTROMECHANICAL TECH CO LTD

A series of anti-wave design for seaports or harbours

The invention provides a series of anti-wave device for a seaport or a harbour. Firstly, an anti-wave wall is constructed at positions of the seaport or the harbour, the anti-wave wall encloses the seaport or the harbour where ships are anchored. Reinforcing and supporting structures are provided on the anti-wave along two directions perpendicular to the central axis of the wall to resist strong stormy waves and allow the anti-wall not to be pushed down by the strong stormy waves. One outlet and one inlet for ships passing through are provided on the anti-wave wall, or, one opening is provided on the anti-wave wall and is taking the roles of the outlet and the inlet, width of the opening needs to be wider. Secondly, when a strong stormy wave is coming and ships are anchored, the outlet and inlet of the anti-wave wall are blocked by wave-breaking facilities. The wave-breaking facility is composed of a plurality of overlapped fine-mesh nets. The width of the wave-breaking facility is wider than the outlet and inlet of the anti-wave wall, when the tide falls, the bottom edge of the wave-breaking facility may be about 20 meters below the water surface, when the tide rises, the top edge of the wave-breaking facility may be about 10 meters above the water surface. Such anti-wave wall and wave-breaking facility can effectively break the impulsive force and energy of stormy waves. Certain facilities need to be constructed outside the anti-wave wall, which allows ships arriving late to avoid risk. All the facilities which are contacting with seawater are required to be able to resist seawater corrosion.
Owner:赵彦杰

Concrete stair manufacturing mold, concrete stair manufacturing method and concrete stair

InactiveCN112659334AAvoid damageDoes not affect the demoulding operationMouldsMechanical engineeringMold removal
The invention discloses a concrete stair manufacturing mold. The concrete stair manufacturing mold comprises a first mold part used for forming a ceramic tile pasting surface of a concrete stair prefabricated part, a mold connecting surface of the first mold part is provided with a rough surface forming part, and the rough surface forming part is provided with a demolding angle. The concrete stair manufacturing mold is suitable for manufacturing the concrete stair prefabricated part with a surface suitable for sticking ceramic tiles. The invention discloses a concrete stair manufacturing method. The concrete stair manufacturing method comprises the steps that the first mold part with the rough surface forming part on the mold connecting surface is used for forming the ceramic tile pasting surface of the concrete stair prefabricated part, and the rough surface forming part is provided with the demolding angle. The method is suitable for sticking ceramic tiles when being used for manufacturing concrete stair prefabricated parts. According to the concrete stair manufactured through the concrete stair manufacturing method, the surface suitable for pasting ceramic tiles is formed on the surface, needing ceramic tile pasting, of the concrete stair prefabricated part.
Owner:河南省第一建设集团荥阳装配式建筑有限公司

Detinning processing method of chip and chip detinning machine applying method

InactiveCN102126059BLess lossLess solder lossSoldering apparatusSolderingTin
The invention discloses a detinning processing method of a chip, and the method comprises the following steps: providing a scraper, a die, a heating mechanism and a recovery device, wherein a first inclined plane which forms an inclination angle with the horizontal plane is arranged on the upper surface of the die, a plurality of grooves for accommodating and fixing chips are formed on the first inclined plane, the height of each groove is equivalent to the thickness of each chip, and the recovery device is arranged on one side corresponding to the lower edge of the first inclined plane belowa conveying mechanism; arranging the chips in the grooves; placing the die on the heating mechanism, and utilizing the heating mechanism to heat the chips so as to melt soldering tin on the chips; and utilizing the scraper to scrape the soldering tin on the chips into the recovery device. In the method, the scraper is utilized for scraping off the molten soldering tin form the chips, the soldering tin can stably slide into the recovery device along the wall of the scraper, the loss of the soldering tin is low, and the recovery rate is high; and furthermore, the plurality of the grooves are arranged on the die, the plurality of the chips can be scraped according to needs, and the tin scraping efficiency is high. In addition, the invention further provides a chip detinning machine applying the detinning processing method of the chip.
Owner:何光宁

Rapid tin planting device for BGA chip

The invention provides a rapid tin planting device for a BGA chip. The rapid tin planting device comprises a device body, wherein the device body comprises a control table, wherein a tin stripping liquid tank is arranged on one side of the control table. A to-be-tin-planted chip is positioned by virtue of the positioning slot and is firmly adsorbed by virtue of a vacuum pump, a first rotating motor and a second rotating motor cooperatively work to overturn an operation table downwards, the operation table is put down by a first linear motor and a second linear motor to enable the chip to be close to a first spraying head in a waste liquid tank, tin stripping liquid in the tin stripping liquid tank is extracted by virtue of a first water pump so as to remove soldered tin on the chip, the operation table is rotated to be restored, a corresponding tin planting net is fixed under a mounting plate, is put down to the to-be-tin-planted chip by a third linear motor, a soldering aid in a soldering aid tank is extracted by virtue of a second water pump, is sprayed to the tin planting net and then flows to soldering disc of the to-be-tin-planted chip through soldering holes in the tin planting net, and then the to-be-tin-planted chip is filled with tin paste to be heated.
Owner:HUZHOU HUINENG ELECTROMECHANICAL TECH CO LTD

Production method of vacuum impregnated dried waxberry

The invention discloses a production method of vacuum impregnated dried waxberry. The production method comprises the following steps: 1) fresh fruit raw material picking and cleaning; 2) vacuum impregnation processing, namely (1) preparing an impregnation solution from 50% of sugar liquor, 1.5% of citric acid, 1% of liquorice root and the balance of water, (2) vacuumizing for 20+/-1 minutes and inflating with air for 60 minutes, and impregnating the vacuumized waxberry blanks in the impregnation solution for about 10 hours for permeating more thoroughly; 3) freeze-drying, namely taking out the impregnated waxberry blanks for quick-freezing, and then dehydrating in a freeze-dryer for about 9-10 hours until the moisture content in the waxberry blanks is lower than 4%, and then taking out and directly packaging in vacuum. According to the production method of the vacuum impregnated dried waxberry, the fresh waxberries are freeze-dried at an ultralow temperature and then the finished dried waxberry is obtained; the dried waxberry is low in loss of nutritional ingredients and flavor; the nutrition, taste and fragrance of the waxberries are remained to the utmost extent, and the original color and shape of the waxberries are kept; in addition, the vacuum impregnation technique is adopted in the middle of dry-making, and therefore, the vacuum impregnated product having the unique flavor can be obtained while the waxberry product gains the prepared nutrients.
Owner:苏州苏东庭生物科技有限公司
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