Rapid tin planting device for BGA chip

Abstract

The invention provides a rapid tin planting device for a BGA chip. The rapid tin planting device comprises a device body, wherein the device body comprises a control table, wherein a tin stripping liquid tank is arranged on one side of the control table. A to-be-tin-planted chip is positioned by virtue of the positioning slot and is firmly adsorbed by virtue of a vacuum pump, a first rotating motor and a second rotating motor cooperatively work to overturn an operation table downwards, the operation table is put down by a first linear motor and a second linear motor to enable the chip to be close to a first spraying head in a waste liquid tank, tin stripping liquid in the tin stripping liquid tank is extracted by virtue of a first water pump so as to remove soldered tin on the chip, the operation table is rotated to be restored, a corresponding tin planting net is fixed under a mounting plate, is put down to the to-be-tin-planted chip by a third linear motor, a soldering aid in a soldering aid tank is extracted by virtue of a second water pump, is sprayed to the tin planting net and then flows to soldering disc of the to-be-tin-planted chip through soldering holes in the tin planting net, and then the to-be-tin-planted chip is filled with tin paste to be heated.

Description

technical field [0001] The invention relates to the technical field of chip maintenance equipment, in particular to a rapid tin planting device for BGA chips. Background technique [0002] In today's information age, with the rapid development of the electronic industry, computers, mobile phones and other products are becoming more and more popular. People have more and more functional requirements for electronic products, higher and higher performance requirements, and smaller and smaller volume requirements. , The weight requirements are getting lighter and lighter, which promotes the development of electronic products in the direction of multi-function, high performance, miniaturization and light weight. In order to achieve this goal, the feature size of the IC chip will be smaller and smaller, and the complexity will continue to increase, so the number of I / Os in the internal circuit of the chip will increase, and the I / O density of the package will continue to increase....

AI Technical Summary

Problems solved by technology

[0003] It is not difficult to see that the existing tin-planting equipment has complex structure, inconvenient operation, and problems such as shifting of the tin-planting net and inaccurate positioning, which may easily cause solder to stick to each other on the pad of the chip, making it unusable, and the time for tin-planting Long, low efficiency of tin planting

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