Rapid tin planting device for BGA chip

A fast, chip-based technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as displacement of tin-planting nets, mutual adhesion of solder, and complex structures

Inactive Publication Date: 2018-09-04
HUZHOU HUINENG ELECTROMECHANICAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] It is not difficult to see that the existing tin-planting equipment has complex structure, inconvenient operation, and problems such as shifting of the tin-planting net and inac

Method used

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  • Rapid tin planting device for BGA chip
  • Rapid tin planting device for BGA chip
  • Rapid tin planting device for BGA chip

Examples

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Embodiment Construction

[0026] The embodiments involved in the present invention will be described in further detail below in conjunction with the accompanying drawings.

[0027] combine Figure 1 to Figure 7 , a fast tin planting device for BGA chips, including a device body, the device body includes a console 1, one side of the console 1 is provided with a tin stripping liquid tank 3, the tin stripping liquid tank 3 is an open structure at the upper end, and the tin stripping liquid The side wall of the liquid tank 3 is connected with the side wall of the console 1, the top of the console 1 is centered with a waste liquid pool 2, and the waste liquid pool 2 is an open structure at the upper end, and the center of the bottom of the waste liquid pool 2 is provided with a second A sprinkler head 4, the console 1 is a hollow structure, the console 1 includes a console shell, the bottom inside of the console shell is provided with a first water pump 5, and the first water pump 5 includes a first water s...

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PUM

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Abstract

The invention provides a rapid tin planting device for a BGA chip. The rapid tin planting device comprises a device body, wherein the device body comprises a control table, wherein a tin stripping liquid tank is arranged on one side of the control table. A to-be-tin-planted chip is positioned by virtue of the positioning slot and is firmly adsorbed by virtue of a vacuum pump, a first rotating motor and a second rotating motor cooperatively work to overturn an operation table downwards, the operation table is put down by a first linear motor and a second linear motor to enable the chip to be close to a first spraying head in a waste liquid tank, tin stripping liquid in the tin stripping liquid tank is extracted by virtue of a first water pump so as to remove soldered tin on the chip, the operation table is rotated to be restored, a corresponding tin planting net is fixed under a mounting plate, is put down to the to-be-tin-planted chip by a third linear motor, a soldering aid in a soldering aid tank is extracted by virtue of a second water pump, is sprayed to the tin planting net and then flows to soldering disc of the to-be-tin-planted chip through soldering holes in the tin planting net, and then the to-be-tin-planted chip is filled with tin paste to be heated.

Description

technical field [0001] The invention relates to the technical field of chip maintenance equipment, in particular to a rapid tin planting device for BGA chips. Background technique [0002] In today's information age, with the rapid development of the electronic industry, computers, mobile phones and other products are becoming more and more popular. People have more and more functional requirements for electronic products, higher and higher performance requirements, and smaller and smaller volume requirements. , The weight requirements are getting lighter and lighter, which promotes the development of electronic products in the direction of multi-function, high performance, miniaturization and light weight. In order to achieve this goal, the feature size of the IC chip will be smaller and smaller, and the complexity will continue to increase, so the number of I / Os in the internal circuit of the chip will increase, and the I / O density of the package will continue to increase....

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/56H01L21/48
CPCH01L21/4814H01L21/56H01L21/67121
Inventor 陈美金
Owner HUZHOU HUINENG ELECTROMECHANICAL TECH CO LTD
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