Weightless chip tin remover

Abstract

The invention provides a weightless chip tin remover which comprises a device body, wherein the device body comprises a control console; a heating plate is arranged at the top of the control console;a heater is arranged in the heating plate; a first supporting plate and a second supporting plate are arranged at the top of the heating plate; the first supporting plate is positioned on one side ofthe heating plate; the second supporting plate is positioned on the other side of the heating plate; and a recovery box is arranged between the first supporting plate and the second supporting plate.The weightless chip tin remover provided by the invention has the beneficial effects that an adsorption table and a chip carrier plate are turned over through a driving motor, so that chips in the chip carrier plate can get close to the heating surface of the heating plate and can be heated by the heater according to the preset temperature, original soldering tin on the surfaces of the chips can be molten to achieve the liquid state, as well as the soldering tin in the liquid state can be separated from the surfaces of the chips under the action of weightlessness and then can drop into the recovery box below the chips; accordingly, the low loss of the soldering tin and the high recovery rate can be achieved; and the chips in batch can be subjected to tin removal and the high tin removal efficiency can be achieved.

Description

technical field [0001] The invention relates to the technical field of chip maintenance equipment, in particular to a weightless chip tin remover. Background technique [0002] In the process of surface mount technology (SMT) production and processing, due to factors such as poor printing and patch placement, chip welding defects appear, and this phenomenon is common in various factories. Ball array package (BGA) chips are basically expensive chips such as central processing unit (CPU), flash memory (Flash), power management, etc. The price is tens, hundreds or even thousands, and it is indispensable on the circuit board of electronic products. of. Due to the high price, defective chips caused by welding must be repaired and reused. In the rework and reuse of BGA chips, the original solder on the chips needs to be removed. At present, there are various tin removal machines on the market, which generally use high temperature to melt the solder on the chip, and then use an ...

AI Technical Summary

Problems solved by technology

However, due to the strong wind force of the air knife, the blown-off solder may not be blown into the predetermined recovery device, which will cause unsatisfactory recovery effect of solder and lead to a certain degree of waste of solder

At the same time, these tin removal machines can only process a small number of chips at the same time, and the efficiency needs to be improved

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