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Electrochemical analysis device and method for electrochemical migration microcell of electronic product

An electrochemical analysis and electronic product technology, applied in the field of electrochemical migration micro-area electrochemical analysis devices of electronic materials, can solve the problem of inability to realize real-time monitoring of surface corrosion state, poor repeatability of water drop test and controllability of test conditions, and inability to guarantee liquid Volume and weight consistency, etc., to eliminate deviation and ensure consistency

Inactive Publication Date: 2021-08-06
UNIV OF SCI & TECH BEIJING
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the consistency of liquid volume and weight cannot be guaranteed by manually adding droplets, resulting in poor repeatability of the water drop test and poor controllability of the test conditions; and the current water drop test is only carried out at room temperature and atmospheric environment, which cannot further simulate the actual situation. Changes in environmental factors such as temperature, humidity and other polluting gases in the application cannot realize real-time monitoring of surface corrosion status

Method used

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  • Electrochemical analysis device and method for electrochemical migration microcell of electronic product

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Experimental program
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Effect test

Embodiment 1

[0054] After soldering wires to a 20×30×1mm PCB-Cu circuit board, fix it on the lifting stage 17, connect the circuit board to the constant voltage source electrochemical workstation 18, and connect the electrodes of the probe-type electrochemical pen 16 to Connect with electrochemical workstation 19;

[0055] Close the test box, adjust the lifting stage 17, so that it is filled with 0.05mol / L NaHSO 3 The microsyringe of the solution is located directly above the gap between the two electrodes of the PCB, and the distance between the needle and the sample is 5 mm ± 1 mm; the microsyringe pump 2 is controlled by the digital display control panel 14 to drip 1 μL containing 0.05 mol / L NaHSO 3 of droplets;

[0056] Rotate knob 1, use a hand-held microscope to observe and record the surface morphology of the PCB board before corrosion occurs;

[0057] Rotate the knob 1, and adjust the lifting platform, so that the bottom surface of the probe type electrochemical pen 16 is in cont...

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Abstract

The invention discloses a micro-area electrochemical analysis device and method for electrochemical migration of an electronic product, and is used for analyzing the occurrence trend of a corrosion electrochemical reaction according to micro-area potential distribution on the surface of a circuit board. The device comprises an electrochemical migration generation device, a closed environment simulation container, a pollution gas presetting system, an air circulation system, a waste gas absorption treatment device and a digital display control panel. The pollution gas presetting device, the environment simulation container air circulation system and the waste gas absorption and treatment device are connected with the environment simulation container through pipelines. According to the invention, the influence of pollution gas, environment temperature and humidity and the like on the electrochemical corrosion process of circuit boards, electronic equipment parts and the like in an actual service environment can be effectively simulated, and real-time in-situ micro-area electrochemical analysis is carried out on the corrosion behavior of the circuit boards, the electronic equipment parts and the like.

Description

technical field [0001] The invention relates to the technical field of corrosion and protection of electronic materials, in particular to a micro-area electrochemical analysis device and method for electrochemical migration of electronic materials. Background technique [0002] At present, in order to meet the requirements of miniaturization, multi-function, high density and high flexibility, electronic components are developing towards the direction of small pitch and fine aperture. This has led to electronic components being more sensitive to temperature, humidity and pollutants in the service environment. On the other hand, electronic components are usually biased in the actual service environment. Previous studies have shown that electrochemical migration failure caused by corrosion is considered to be one of the most important failure modes of electronic components. Electrochemical migration occurs when two adjacent and biased electrodes are covered by a layer of elect...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N17/02
CPCG01N17/02
Inventor 肖葵刘璇易盼白子恒冯亚丽刘倩倩董超芳李晓刚
Owner UNIV OF SCI & TECH BEIJING
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