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35 results about "Electrochemical migration" patented technology
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Electrochemical migration (ECM) is the dissolution and movement of metal ions in presence of electric potential, which results in the growth of dendritic structures between anode and cathode. The process is most commonly observed in printed circuit boards where it may significantly decrease the insulation between conductors.
Light emitting semiconductor method and device
InactiveUS6946685B1Inhibit migrationSemiconductor/solid-state device detailsSolid-state devicesSilver electrodeElectrochemistry
Silver electrode metallization in light emitting devices is subject to electrochemical migration in the presence of moisture and an electric field. Electrochemical migration of the silver metallization to the pn junction of the device results in an alternate shunt path across the junction, which degrades efficiency of the device. In accordance with a form of this invention, a migration barrier is provided for preventing migration of metal from at least one of the electrodes onto the surface of the semiconductor layer with which the electrode is in contact.
Owner:LUMILEDS
Preparation method and application of modified carbon fiber microelectrode
ActiveCN108663423ALarge specific surface areaWith electroreductionMaterial electrochemical variablesFiberCarbon fibers
The invention discloses a preparation method of a modified carbon fiber microelectrode. The preparation method comprises the steps of surface activation of a carbon fiber, catalyst coating, carbon nanofiber vapor deposition, copper nano particle deposition and assembly. The invention further discloses the application of the modified carbon fiber microelectrode in detection of a nitric oxide concentration. Vapor deposition of the carbon nanofiber is performed on the surface of the carbon fiber; the specific surface area of the carbon fiber can be increased; the contact probability of the carbonfiber and ions is increased; the deposited copper nano particle can allow the carbon fiber to have an electroreduction effect; the reuse stability of the microelectrode can be improved, so that the carbon fiber microelectrode capable of detecting nitrate by a synergic electrochemical action of electrochemical migration and copper oxidoreduction is constructed; and compared with the existing carbon fiber microelectrode, the carbon fiber microelectrode has the advantages of high detection sensitivity, stable output, low energy consumption, high detection speed, simple operation, low preparationcost and the like and can detect nitric oxide in air in real time.
Owner:QINGDAO UNIV
Single-phase nano silver copper alloy solid solution welding paste and preparation method thereof
ActiveCN109332939ALow costSimple preparation processWelding/cutting media/materialsSoldering mediaMass ratioSilver copper
The invention discloses a nano silver copper alloy solid solution welding paste with sintering connection performance and a preparation method for the nano silver copper alloy solid solution welding paste and belongs to the technical field of materials. The nano silver copper alloy solid solution welding paste is made of, in percentage by mass, 80-90% of single-phase nano silver copper alloy particles, 2-8% of a dispersing agent, 2-8% of a dressing agent, 2-8% of a thinning agent and 2-8% of scaling powder. According to the single-phase nano silver copper alloy solid solution welding paste andthe preparation method for the single-phase nano silver copper alloy solid solution welding paste, single-silver-phase silver copper alloy nano particles are directly reduced out adopting a one-stepliquid phase reduction method, the silver copper mass ratio in the silver copper nano alloy particles is flexible and can be adjusted and controlled at will within the range of (0.1-10) : 1, the preparation method has the characteristics of being simple in method, high in production efficiency and wide in process application range, the single-phase nano silver copper alloy solid solution welding paste has excellent connection performance, the boundedness of single nano silver and single nano copper in the application process is overcome, and the single-phase nano silver copper alloy solid solution welding paste has the advantages of low-temperature connection high-temperature service, low connection pressure applying, short connection time, strong oxidation resistance, strong electromigration resistance and electrochemical migration resistance and low relative cost.
Owner:HARBIN INST OF TECH
Method for preparing low-temperature interconnected high-temperature in-service joint by using single-phase nano silver-copper alloy solder paste
ActiveCN109545696AReduced antioxidant capacityLow resistance to electromigrationPrecision positioning equipmentDecorative surface effectsInterfacial reactionOxidation resistant
The invention, which relates to the technical field of micro-connection, provides a method for preparing a low-temperature interconnected high-temperature in-service joint by using a single-phase nanosilver-copper alloy solder paste. The method comprises the following steps: step one, placing a nano inter-metallic compound solder paste on a substrate, completing an alignment process of a to-be-soldered component, and applying a pressure; and step two, placing the system in a reflow furnace, and implementing a preheating phase, a heat preservation phase, a re-flowing phase, and a cooling phaseto complete volatilization of organic matters, uniform sintering among single-phase nano-alloy particles, and wetting and interfacial reaction of a bonding pad. According to the invention, with the single-phase nano silver-copper alloy particles, the powerful driving force is provided for the sintering process based on the excellent surface activity property of the nano particles; the low-temperature connection that is compatible with the traditional reflow soldering process and has the melting point far lower than the melting point of the block is realized; and an excellent joint with the high anti-oxidation, anti-electromigration and anti-electrochemical migration capabilities is formed. The high-temperature service of the low-temperature connection is realized while the compatibility with traditional process is high and the production efficiency is high.
Owner:HARBIN INST OF TECH
Microscopic electrochemical analyzer
InactiveCN1458519AEasy to analyzeIntuitive observationSurface/boundary effectMaterial electrochemical variablesElectrochemical responseDisplay device
The microscopic electrochemical analyzer includes power supply unit, optical microscope, electrolytic bath, video camera, computer, control software with matched with image display and editing functions. The optical microscope is connected via standard CS interface with CCD camera, the CCD camera and the computer are connected via video card, the CCD camera transmits its data to software for control and amplified display in the display, and the electrolytic bath is connected to the outer power supply to constitute the work bath for electrochemical immigration and electrochemical reaction. By means of biological microscopic technology and electrochemical immigration and electrochemical reaction technology, the present invention constitutes the instrument capable of continuous observing, photographing and analyzing electric immigration, reverse emulsion and electrochemical reaction in various polar and non-polar systems and amplifying microscopic dynamic process.
Owner:BEIHANG UNIV
Dust pollution circuit board insulation failure simulation detection method based on electrochemical migration
InactiveCN111398784AThe detection method is simpleFast detection methodVery high resistance measurementsElectronic circuit testingElectrical resistance and conductanceProcess engineering
The invention provides a dust pollution circuit board insulation failure simulation detection method based on electrochemical migration. NaCl and quartz particles are selected as representative components of soluble salt and insoluble particles in dust pollutants, the insulation failure of the circuit board based on the electrochemical migration mechanism under dust pollution is simulated and detected, and the method comprises the following steps: 1, preparing a sample; cleaning a circuit board sample; quantitatively adding a NaCl solution on the surface and covering the quartz particles. 2, preparing a test environment, comprising: setting temperature and humidity; connecting the circuit board sample into a test system; a bias voltage and measurement options are set. 3, carrying out an experiment, comprising the following steps: starting bias voltage; operating the temperature and humidity box; starting a multi-channel insulation resistance test system; experimental continuing 24 hours; 4, data processing, performing morphology analysis on the failure phenomenon of the circuit board; and extracting the characteristic life and carrying out insulation failure judgment. The test method provided by the invention is simple and efficient, and the experimental principle conforms to the actual application situation.
Owner:BEIJING UNIV OF POSTS & TELECOMM
Printed circuit substrate and method of manufacturing the same
ActiveUS20110253431A1Suppresses electrochemical migrationPrevent an electrical short circuit duePrinted circuit assemblingPrinted circuit aspectsHigh densityElectrochemical migration
Disclosed herein are a printed circuit substrate and a method of manufacturing the same. The printed circuit substrate includes an insulating layer, and a circuit layer that includes a circuit pattern disposed on the insulating layer and a barrier layer that is disposed to cover at least one surface of the circuit pattern and suppresses electrochemical migration from the circuit pattern, thereby making it possible to achieve high-density and secure reliability, and the method of manufacturing the same.
Owner:SAMSUNG ELECTRO MECHANICS CO LTD +1
Micro Ag-Cu solder cream, preparing method thereof and application
ActiveCN107511602AImprove performanceEasy to prepareWelding/cutting media/materialsSoldering mediaAlcoholGlycerol
The invention discloses micro Ag-Cu solder cream, a preparing method thereof and application. The Ag-Cu solder cream is prepared by Ag powder, Cu powder and glycerol according to the following proportion that the mass ratio of the Ag powder and the Cu powder is 2-4:1, and the mass ratio of the sum of the mass of the Ag powder and the Cu powder with glycerol is 8-12:1. The grain size of the Ag powder is 5-10 nm, and the grain size of the Cu powder is 20-60 nm. The preparing method of the Ag-Cu solder cream comprises the following steps that the Ag powder and the Cu powder are picked, ethyl alcohol is added into the Ag powder and the Cu powder, grinding is conducted, and Ag-Cu mixed powder is obtained; and glycerol is added again into the Ag-Cu mixed powder to be concocted into viscous cream, and the micro Ag-Cu solder cream is obtained. The micro Ag-Cu solder cream can be used for connecting parts of coppers. According to the specific stepsfor preparing theconnecting parts of coppers, the appropriate micro Ag-Cu solder cream is picked and evenly painted on the connecting surfaces to be connected of two copper base metal, and the connecting surfaces are closed and connected. The micro Ag-Cu solder cream is high in inoxidizability, good in electrochemical migration resistance and high in specific conductance and thermal conductivity, and a connecting head prepared through connecting of the micro Ag-Cu solder cream is ideal in cutting strength and high in reliability.
Owner:WUHAN INSTITUTE OF TECHNOLOGY
Printed circuit board for testing electric-resistant chemical migration performances
InactiveCN103118485AAvoid damageEnhance anti-CAF capabilityPrinted circuit detailsPrinted circuit manufactureGlass fiberCapillary action
The invention provides a printed circuit board for testing electric-resistant chemical migration performances. The printed circuit board is provided with an anti-CAF (anti-conducting cation migration) performance testing graph which comprises a plurality of grooved holes in a two-two spaced manner. The grooved holes are arranged on the anti-CAF performance testing graph to replace currently-arranged drill holes, and arranging of the grooved holes is small in damages to materials when compared with arranging of the drill holes, namely, damages to glass fiber cloth of the printed circuit board can be well avoided during processing of the grooved holes, so that when decontamination and cleaning are performed, the grooved holes, not like the drill hole, are less prone to formation of big halos, and serious capillary action cannot be generated caused by damages to the glass fiber cloth, so that effective hole pitches are lengthened, and anti-CAF capability of the printed circuit board is further improved. The invention further provides a manufacturing method for the printed circuit board for testing electric-resistant chemical migration performances.
Owner:GUANGDONG SHENGYI SCI TECH
Metal-base printed circuit board
ActiveUS20150140293A1Electrochemical migration can be preventedPrevent elutionLayered productsPrinted circuit aspectsInorganic particleElution
A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 μm with an average particle diameter (D50) of 500 nm to 20 μm, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.
Owner:WASEDA UNIV +1
A kind of nano ag-cu solder paste and its preparation method and application
ActiveCN107511602BImprove performanceEasy to prepareWelding/cutting media/materialsSoldering mediaMass ratioCopper
The invention discloses micro Ag-Cu solder cream, a preparing method thereof and application. The Ag-Cu solder cream is prepared by Ag powder, Cu powder and glycerol according to the following proportion that the mass ratio of the Ag powder and the Cu powder is 2-4:1, and the mass ratio of the sum of the mass of the Ag powder and the Cu powder with glycerol is 8-12:1. The grain size of the Ag powder is 5-10 nm, and the grain size of the Cu powder is 20-60 nm. The preparing method of the Ag-Cu solder cream comprises the following steps that the Ag powder and the Cu powder are picked, ethyl alcohol is added into the Ag powder and the Cu powder, grinding is conducted, and Ag-Cu mixed powder is obtained; and glycerol is added again into the Ag-Cu mixed powder to be concocted into viscous cream, and the micro Ag-Cu solder cream is obtained. The micro Ag-Cu solder cream can be used for connecting parts of coppers. According to the specific stepsfor preparing theconnecting parts of coppers, the appropriate micro Ag-Cu solder cream is picked and evenly painted on the connecting surfaces to be connected of two copper base metal, and the connecting surfaces are closed and connected. The micro Ag-Cu solder cream is high in inoxidizability, good in electrochemical migration resistance and high in specific conductance and thermal conductivity, and a connecting head prepared through connecting of the micro Ag-Cu solder cream is ideal in cutting strength and high in reliability.
Owner:WUHAN INSTITUTE OF TECHNOLOGY
Metal-base printed circuit board
ActiveUS9554464B2Inhibit migrationPrevent elutionPrinted circuit aspectsHigh voltage circuit adaptationsInorganic particleElution
A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 μm with an average particle diameter (D50) of 500 nm to 20 μm, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.
Owner:WASEDA UNIV +1
Three asymmetric solid-state electrochemical capacitors constructed through nanometer copolyaniline and activated carbon
InactiveCN106601495AGuaranteed cycle stabilityReduce penetrationHybrid capacitor electrodesCapacitancePolyethylene oxide
The invention relates to three asymmetric solid-state electrochemical capacitors constructed through nanometer copolyaniline and activated carbon. Sulfonated copolyaniline serves as a positive electrode active material, and the activated carbon serves as a negative electrode active material. A positive electrode is soaked in positive electrolyte gels to form a positive electrolyte gel layer; the positive electrolyte gel layer is an anode matrix with positive electrolyte being dissolved therein; the positive electrolyte is an inorganic acid; and the anode matrix is selected from polyvinyl alcohol or polyvinylpyrrolidone. A negative electrode is soaked in negative electrolyte gels to form a negative electrolyte gel layer; the negative electrolyte gel layer is a cathode matrix with negative electrolyte being dissolved therein; the negative electrolyte is neutral salt; and the cathode matrix is selected from carboxymethylcellulose, potassium polyacrylate or polyethylene oxide. Compared with the prior art, the capacitors greatly suppress electrochemical migration and effectively ensure cycling stability of the capacitors, and give play to performance advantages of a pseudocapacitor material and a electrical double-layer capacitor material to the maximum degree.
Owner:TONGJI UNIV
Copper alloy film, protection layer after service based on copper alloy film and preparation method
ActiveCN114058897AImprove the immunityAvoid corrosionVacuum evaporation coatingSputtering coatingBinary alloyAlloy thin film
The invention discloses a copper alloy film, a protective layer after service based on the copper alloy film and a preparation method, the copper alloy film is a binary alloy, and comprises a copper element and an additive element capable of forming a positive mixed entropy with copper; the mass percentage content of the copper element is 95 to 99 wt%; the method comprises the following steps: forming a copper alloy film with positive enthalpy of mixing on a substrate; and then applying an energy field to the copper alloy film, so that the added elements are separated out and a protective layer is formed on the surface of the copper film. According to the invention, the copper alloy film with positive mixing enthalpy is adopted, the added elements in the alloy move towards the surface under the action of pressure difference, finally, the added elements cover the copper, electrochemical migration of the metal copper is inhibited, the resistance of the copper circuit board to electrochemical migration is improved, a double-element coating can be formed at a time through the overall preparation method, the process is simplified, and the reliability of the coating is improved.
Owner:JIANGSU UNIV OF SCI & TECH
Electrochemical analysis device and method for electrochemical migration microcell of electronic product
InactiveCN113218857APrecise volume controlPrecise position controlWeather/light/corrosion resistanceAir cycleProcess engineering
The invention discloses a micro-area electrochemical analysis device and method for electrochemical migration of an electronic product, and is used for analyzing the occurrence trend of a corrosion electrochemical reaction according to micro-area potential distribution on the surface of a circuit board. The device comprises an electrochemical migration generation device, a closed environment simulation container, a pollution gas presetting system, an air circulation system, a waste gas absorption treatment device and a digital display control panel. The pollution gas presetting device, the environment simulation container air circulation system and the waste gas absorption and treatment device are connected with the environment simulation container through pipelines. According to the invention, the influence of pollution gas, environment temperature and humidity and the like on the electrochemical corrosion process of circuit boards, electronic equipment parts and the like in an actual service environment can be effectively simulated, and real-time in-situ micro-area electrochemical analysis is carried out on the corrosion behavior of the circuit boards, the electronic equipment parts and the like.
Owner:UNIV OF SCI & TECH BEIJING
Water-drop test system for electrochemical migration experiment
InactiveCN103344691BReduce electromagnetic interferenceResistance/reactance/impedenceMaterial analysis by electric/magnetic meansHigh resistanceObservational error
The invention discloses a water-drop test system for an electrochemical migration experiment. The water-drop test system comprises a computer unit, a motor drive device, a stepper motor, a water-dropping device, a video capture device, an insulation resistance measuring device and a sample stage. After a sample wafer is loaded well, test parameter information is set in the computer and sent to the water-dropping device, the video capture device and the insulation resistance measuring device; a test order is started; the water-dropping device drops a water drop with specified weight on the sample wafer; the sample wafer is controlled to move toward below the video capture device fast; electrochemical migration phenomenon between wires on the sample wafer is shot and sent back to the computer for storage and real-time display; at the same time; a surface resistance value between wires on the sample wafer is measured by the insulation resistance measuring device and sent back to the computer for storing and displaying a resistance curve. With the water-drop test system, water-dropping operations and water-dropping amount required by the electrochemical migration experiment between the between wires on the surface of the sample wafer can be controlled automatically; measurement error brought by manual operations is prevented effectively; interference and test noise are reduced by adopting triaxial cables and shielded twisted-pair cables; and accuracy of high resistance measurement between the wires on the surface of the sample wafer can be increased.
Owner:BEIJING UNIV OF POSTS & TELECOMM
Thermoelectric module and method for manufacturing thermoelectric module post
PendingCN112670393AInhibition Manufacturing MethodThermoelectric device with peltier/seeback effectThermoelectric device manufacture/treatmentHemt circuitsEngineering
Provided is a thermoelectric module capable of further suppressing electrochemical migration with a simple structure. A thermoelectric module includes: a lower substrate; an upper substrate disposed above the lower substrate so as to be opposite to the lower substrate; a plurality of p-type thermoelectric elements and n-type thermoelectric elements disposed between the lower substrate and the upper substrate; first electrodes disposed on an upper surface of the lower substrate and a lower surface of the upper substrate, and sequentially connecting the p-type and n-type thermoelectric elements alternately to form a series circuit; and a second electrode that is provided on the lower substrate and connects a thermoelectric element at an end of the series circuit to a post, in which the post includes a post body formed of nickel, and a nickel passivation film covering a side surface of the post body.
Owner:KELK LTD
Apparatus and method relating to electrochemical migration
ActiveUS20210289636A1Improve electrical reliabilityReduce manufacturing costPrinted circuit assemblingElectronic circuit testingElectrical conductorHemt circuits
Embodiments of the present invention provide a method (1000) of assembling an electrical circuit comprising one or more copper electrical conductors, the method comprising plating (1010) a surface of the one or more conductors with a layer comprising tin; annealing the plating; applying (1020) solder to at least a portion of the one or more electrical conductors, wherein said solder comprises tin and copper; and annealing the electrical circuit.
Owner:JAGUAR LAND ROVER LTD
Electrochemical migration test method and device for power packaging
PendingCN113376239AImprove ObservabilityGood repeatabilityMaterial analysis by electric/magnetic meansMaterial analysis by optical meansEngineeringElectrochemistry
The invention provides an electrochemical migration test method and device for power packaging, and the test method comprises the following steps: S1, printing a to-be-tested electrode pattern on a substrate through employing metal nanometer conductive ink, and obtaining a to-be-tested sample; s2, performing plasma surface treatment on the electrode pattern of the to-be-tested sample; s3, fixing the to-be-tested sample on an objective table of an optical microscope, adjusting the focal length and magnification times, and connecting the positive and negative electrodes of a power meter with the electrode of the to-be-tested sample when a clear and complete image appears; dripping liquid on a sample to be detected to form a liquid film, and starting in-situ observation by adopting in-situ observation equipment while starting a power meter to apply voltage so as to obtain an in-situ monitoring picture of an electrochemical migration process and a current and voltage change curve. According to the technical scheme, the method is easy to operate, the period is short, the device is very convenient to build, and the obtained experimental result has good observability and repeatability.
Owner:HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
Anti-short-circuit high-voltage circuit board and manufacturing method thereof
PendingCN113507790AAvoid short circuitImprove withstand voltage performanceElectrical connection printed elementsPrinted element electric connection formationElectrical conductorEngineering
The invention discloses an anti-short-circuit high-voltage circuit board and a manufacturing method thereof in the technical field of PCB manufacturing. The manufacturing method comprises the following steps: manufacturing isolation holes between through holes with voltage difference and between through holes with voltage difference and a circuit on the high-voltage circuit board; and on the premise that the distance between the conductors is not increased and special insulating materials are not selected, a path for forming electrochemical migration between the conductors is cut off by a physical method, and the voltage resistance between the conductors is improved.
Owner:KUSN HULI MICROELECTRONICS
Microscopic electrochemical analyzer
InactiveCN1209620CEasy to analyzeQuick analysisSurface/boundary effectMaterial electrochemical variablesElectrochemical responseDisplay device
Owner:BEIHANG UNIV
A kind of preparation method of Ag-Si nano-solder paste that improves silver electrochemical migration
ActiveCN109277722BImproved failure lifeStable shear strengthWelding/cutting media/materialsSoldering mediaElectrochemistrySilver ion
The invention relates to a preparation method of Ag-Si nano-solder paste for improving the electrochemical migration of silver; fully mixing silicon particles with an average particle size of 15-100 nm and a diluent through an ultrasonic water bath; adding the mixture of the silicon particles and the diluent Into the nano-silver solder paste with an average particle size of 50-500nm and by stirring to obtain Ag-Si nano-solder paste; silicon is easily converted into silicon dioxide in the invented Ag-Si nano-solder paste, which promotes the oxygen required for silver ionization The content of silver is also reduced, effectively improving the electromigration of silver. The prepared Ag-Si nano-solder paste and commercial nano-silver solder paste were sintered at 280°C at a heating rate of 5°C / min, kept for 30 minutes, and cooled in the furnace. At a high temperature of 400°C, a voltage of 200V was applied for electrical Migration experiments. The results prove that the failure life of Ag-Si nano-solder paste is at least 5.83 times higher than that of nano-silver solder paste.
Owner:TIANJIN UNIV
PCB-Cu electrochemical migration corrosion failure simulation method
PendingCN114781139AImprove accuracyDesign optimisation/simulationSpecial data processing applicationsPhysical chemistryElectrochemical corrosion
The invention provides a PCB-Cu electrochemical migration corrosion failure simulation method, and belongs to the technical field of metal electrochemical corrosion simulation. The method comprises the following steps: establishing a two-dimensional cellular space, and determining boundary conditions; determining a cellular type and a cellular neighbor type, and determining each cellular type attribute in the cellular space; setting initial distribution of a cellular space; determining a conversion rule between the cells; simulating the corrosion process and morphology change of the PCB-Cu in the voltage coupling humid and hot environment; and processing the simulation result to obtain a curve graph of related products in the PCB-Cu corrosion process. According to the simulation method provided by the invention, the PCB-Cu is taken as a prototype, the specific phenomenon that the PCB-Cu forms a large number of crystal products on the edge of the anode plate and obstructs the subsequent corrosion process in the voltage coupling humid and hot environment is simulated, the accuracy of a simulation result is improved, and a solid foundation is provided for corrosion prevention of an electronic material.
Owner:NANJING UNIV OF POSTS & TELECOMM
Preparation method of anti-electrochemical-migrating nano-silver compound welding paste material
InactiveCN110102934AEvenly dispersedExcellent electronic activityWelding/cutting media/materialsSoldering mediaNickel compoundsSurface-active agents
The invention relates to a preparation method of an anti-electrochemical-migrating nano-silver compound welding paste material, and belongs to the technical field of welding materials. According to the technical scheme provided by the invention, by adopting a sol compounding scheme, a palladium-nickel compound sol and silver nanoparticles are effectively compounded; through a sol-gel method, Pd atoms on the surfaces of double-metal nanoparticles are dispersed uniformly; meanwhile, nano-silver is easy to agglomerate, so that in order to prevent the agglomeration of the nano-silver, surface active agents are adopted, micelles are formed on the surfaces of silver particles in a flatly lying way so as to be used as a layer of steric hindrance layer, and the nano-silver is prevented from beingagglomerated and grown; and meanwhile, a compound sol material surface carries negative electricity, the surface of the nano-silver carries positive electricity through the surface active agents adsorbed on the surfaces of the silver particles, the surface active agents play a role in directing the deposition of compound gel particles on the surface of the nano-silver, and finally compound particles with core-shell structures are formed so as to be prevented from being agglomerated and dispersed, so that the structural strength and the dispersing performance of the material are further improved.
Owner:周轻轩
Apparatus and method relating to electrochemical migration
ActiveUS11470727B2Promote growthIncrease resistanceElectronic circuit testingSemiconductor/solid-state device detailsElectrical conductorHemt circuits
Owner:JAGUAR LAND ROVER LTD
A kind of single-phase nano-silver-copper alloy solid solution solder paste and preparation method thereof
ActiveCN109332939BLow costSimple preparation processWelding/cutting media/materialsSoldering mediaGold particlesNanoparticle
The invention discloses a nano silver copper alloy solid solution welding paste with sintering connection performance and a preparation method for the nano silver copper alloy solid solution welding paste and belongs to the technical field of materials. The nano silver copper alloy solid solution welding paste is made of, in percentage by mass, 80-90% of single-phase nano silver copper alloy particles, 2-8% of a dispersing agent, 2-8% of a dressing agent, 2-8% of a thinning agent and 2-8% of scaling powder. According to the single-phase nano silver copper alloy solid solution welding paste andthe preparation method for the single-phase nano silver copper alloy solid solution welding paste, single-silver-phase silver copper alloy nano particles are directly reduced out adopting a one-stepliquid phase reduction method, the silver copper mass ratio in the silver copper nano alloy particles is flexible and can be adjusted and controlled at will within the range of (0.1-10) : 1, the preparation method has the characteristics of being simple in method, high in production efficiency and wide in process application range, the single-phase nano silver copper alloy solid solution welding paste has excellent connection performance, the boundedness of single nano silver and single nano copper in the application process is overcome, and the single-phase nano silver copper alloy solid solution welding paste has the advantages of low-temperature connection high-temperature service, low connection pressure applying, short connection time, strong oxidation resistance, strong electromigration resistance and electrochemical migration resistance and low relative cost.
Owner:HARBIN INST OF TECH
Copper alloy thin film, protective layer and preparation method based on copper alloy thin film after service
ActiveCN114058897BImprove the immunityAvoid corrosionVacuum evaporation coatingSputtering coatingBinary alloyAlloy thin film
The invention discloses a copper alloy thin film, a protective layer based on the copper alloy thin film after service and a preparation method. The copper alloy thin film is a binary alloy, including copper elements and additive elements that can form positive mixing entropy with copper; The mass percentage is 95~99wt%; by first forming a copper alloy film with positive mixing enthalpy on the substrate; and then applying an energy field to the copper alloy film to precipitate the added elements and form a protective layer on the surface of the copper film. The present invention adopts the copper alloy thin film with positive mixing enthalpy, causes the added elements in the alloy to move to the surface through the action of the pressure difference, and finally makes the added elements cover the copper, inhibits the electrochemical migration of metal copper, and improves the copper circuit board. Resistance to electrochemical migration, the overall preparation method can form a dual-element coating at one time, which simplifies the process and improves the reliability of the coating.
Owner:JIANGSU UNIV OF SCI & TECH
Drill bit with single chip removal groove and double cutting edges and method for avoiding electrochemical migration between board holes
ActiveCN107096946AAvoid electrochemical migrationReduce cracks between holesTransportation and packagingPrinted circuit manufactureEngineeringCam
The invention discloses a drill bit with a single chip removal groove and double cutting edges. The drill bit comprises a drillstock (1) and a drill lip (2); the drillstock (1) and the drill lip (2) are connected through a connecting part (3); the free end of the drill lip (2) is a drill tip (4); a double-helix cutting edge groove (5) is formed in the part, close to the drill tip (4), of the drill lip (2); and the single-helix chip removal groove (6) is formed in the part, close to the connecting part (3), of the drill lip (2). The invention further discloses a method for avoiding electrochemical migration between board holes. The method comprises the steps of S01, analyzing CAM data; S02, defining and screening high-risk hole pairs; and S03, designing a drilling path. According to the drill bit with the single chip removal groove and the double cutting edges and the method for avoiding the electrochemical migration between the board holes, the generation of cracks between the holes can be reduced to the maximum extent, and therefore the aim of preventing electrochemical migration failure can be achieved.
Owner:KUSN HULI MICROELECTRONICS
High-voltage circuit board and manufacturing method thereof
PendingCN113347809ADoes not significantly weaken the structural strengthReduce structural strengthMultilayer circuit manufactureConductive pattern layout detailsElectrical conductorMechanical engineering
The invention discloses a high-voltage circuit board and a manufacturing method thereof in the technical field of PCB manufacturing. The method comprises the steps: manufacturing a groove hole at a designated position of a prepreg; and stacking and pressing a plurality of prepregs with slotted holes and a substrate of which the inner layer is manufactured according to a set sequence to form a multi-layer circuit board. On the premise that the distance between the conductors is not increased and a special insulating material is not selected, a path for forming electrochemical migration between the conductors is cut off by a physical method, so that the voltage resistance between the conductors is improved.
Owner:KUSN HULI MICROELECTRONICS
Electrochemical migration-inhibiting additive and method for inhibiting electrochemical migration using the same
PendingUS20200102430A1Improve reliabilitySemiconductor/solid-state device detailsSolid-state devicesEpoxyDevice material
Disclosed are an additive for suppressing electrochemical migration (ECM) in an electrical wire, and a method of inhibiting the ECM using the additive. A solution containing the ECM-inhibiting additive may inhibit creation of dendrite to prolong an ECM time. The additive as proposed may be mixed with polymer materials such as epoxy molding compound (EMC) or underfill materials used for packaging a semiconductor, or the like. Alternatively, the additive as proposed may be added to metal electrical wires to improve the reliability of semiconductor devices.
Owner:SAMSUNG ELECTRONICS CO LTD
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