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High-voltage circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, which is applied in the field of PCB manufacturing, can solve the problems of lower wiring density, lower competitiveness, and larger product volume, and achieve the effect of improving voltage resistance and weakening structural strength

Pending Publication Date: 2021-09-03
KUSN HULI MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these methods will reduce the wiring density of the PCB, increase the volume of the product, or lead to an increase in the finished product, reducing competitiveness

Method used

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  • High-voltage circuit board and manufacturing method thereof
  • High-voltage circuit board and manufacturing method thereof
  • High-voltage circuit board and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0020] Such as image 3 As shown, a manufacturing method of a high-voltage circuit board includes: material cutting—inner layer manufacturing—press bonding—drilling—electroplating—outer layer manufacturing—solder masking—forming—surface treatment—testing—final inspection—packaging. In this embodiment, before pressing, at the designated position of the prepreg, a non-conductive slot is made by drilling or milling; then the prepreg with the slot, copper foil, and the inner layer The substrates are stacked in a given order (stacking according to the set order refers to stacking according to the design requirements of each PCB board to achieve the functions required by the design), and are pressed into a multi-layer circuit board in a high-temperature, high-pressure, vacuum environment. In a multilayer circuit board, the slot is located between two adjacent lines with a voltage difference on the substrate; the width of the slot is less than or equal to the distance between the two...

Embodiment 2

[0023] Based on the manufacturing method of the high-voltage circuit board described in Embodiment 1, this embodiment provides a high-voltage circuit board, and the high-voltage circuit board is manufactured by using the manufacturing method of the high-voltage circuit board described in Embodiment 1; figure 1 , figure 2 As shown, in the high-voltage circuit board, a slot 11 is made on the prepreg 1, and the slot 11 is located between two adjacent lines (line a, line b) with a voltage difference on the substrate 2; the slot The width of the hole 11 is less than or equal to the distance L1 between the two adjacent lines (line a, line b) with a voltage difference; the length of the slot is greater than or equal to the length of the parallel area of ​​the two adjacent lines with a voltage difference L2; the substrate includes glass fiber cloth and insulating resin, and the glass fiber cloth is coated with silane as a coupling agent; the prepreg includes glass fiber cloth and ins...

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Abstract

The invention discloses a high-voltage circuit board and a manufacturing method thereof in the technical field of PCB manufacturing. The method comprises the steps: manufacturing a groove hole at a designated position of a prepreg; and stacking and pressing a plurality of prepregs with slotted holes and a substrate of which the inner layer is manufactured according to a set sequence to form a multi-layer circuit board. On the premise that the distance between the conductors is not increased and a special insulating material is not selected, a path for forming electrochemical migration between the conductors is cut off by a physical method, so that the voltage resistance between the conductors is improved.

Description

technical field [0001] The invention belongs to the technical field of PCB manufacturing, and in particular relates to a high-voltage circuit board and a manufacturing method thereof. Background technique [0002] Printed circuit board, abbreviated as PCB, is the basis of modern electronic products, and generally has one or more conductor layers, which play the role of installing and connecting components. PCBs generally use glass fiber cloth coated with insulating resin as a carrier and insulating material. The surface of the glass fiber cloth is generally coated with a layer of silane as a coupling agent to form a relatively stable coupling with the insulating resin. Multi-layer PCBs generally use copper-clad substrates to make several double-sided panels as the inner layer, and then laminate them with prepreg (PP) and copper foil in order, and then press them into multi-layer circuit boards in a high-temperature, high-pressure, and vacuum environment. During the pressin...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K3/00H05K1/02
CPCH05K3/4626H05K3/0047H05K3/0044H05K1/0298
Inventor 凌朔托德·拉塞尔·约翰逊高晨
Owner KUSN HULI MICROELECTRONICS
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