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Printed circuit board for testing electric-resistant chemical migration performances

A technology for printed circuit boards and manufacturing methods, applied in the fields of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve problems such as easily affecting the anti-CAF ability of materials, and achieve improved anti-CAF ability and long hole spacing Effect

Inactive Publication Date: 2013-05-22
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to propose a printed circuit board for testing electrochemical migration resistance and a manufacturing method thereof, so as to solve the problem that the drilling holes on the anti-CAF performance test pattern on the current printed circuit board are more likely to affect the anti of the material itself. - Problems with CAF capabilities

Method used

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  • Printed circuit board for testing electric-resistant chemical migration performances
  • Printed circuit board for testing electric-resistant chemical migration performances

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Embodiment Construction

[0024] The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.

[0025] see figure 1 As shown, the prior art printed circuit board 10 for testing electrochemical migration resistance performance is provided with a common anti-CAF performance test pattern 11, and the anti-CAF performance test pattern 11 is provided with a number of drilled holes separated by two pairs 12. The borehole 12 is generally drilled through a mechanical drilling process. However, during the mechanical drilling process, if the swing of the drill bit is unstable or the processing parameters are not set properly, it is easy to cause large tears in the glass fiber cloth inside the drilled hole, so that the desmear cleaning method is generally used for decontamination cleaning. , which will produce severe capillary action, resulting in severe electrochemical migration, and thus shorten the ef...

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Abstract

The invention provides a printed circuit board for testing electric-resistant chemical migration performances. The printed circuit board is provided with an anti-CAF (anti-conducting cation migration) performance testing graph which comprises a plurality of grooved holes in a two-two spaced manner. The grooved holes are arranged on the anti-CAF performance testing graph to replace currently-arranged drill holes, and arranging of the grooved holes is small in damages to materials when compared with arranging of the drill holes, namely, damages to glass fiber cloth of the printed circuit board can be well avoided during processing of the grooved holes, so that when decontamination and cleaning are performed, the grooved holes, not like the drill hole, are less prone to formation of big halos, and serious capillary action cannot be generated caused by damages to the glass fiber cloth, so that effective hole pitches are lengthened, and anti-CAF capability of the printed circuit board is further improved. The invention further provides a manufacturing method for the printed circuit board for testing electric-resistant chemical migration performances.

Description

technical field [0001] The invention relates to the field of printed circuit boards, in particular to a printed circuit board for testing the electrochemical migration resistance performance and a manufacturing method thereof. Background technique [0002] CAF, that is, conductive cation migration, refers to the electrochemical migration of conductive metal salts that migrate across non-metallic substrates inside printed circuit boards under the action of an electric field. It usually occurs on the interface between glass fiber and resin in the printed circuit board base material, resulting in a decrease in the insulation performance between two adjacent conductors or even a short circuit. source of potential danger. This process is that the copper at the anode is ionized into copper ions and forms a conductive fiber along the interface between the glass fiber and the resin. The conductive fiber continues to grow, and when it reaches the cathode, the insulation resistance d...

Claims

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Application Information

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IPC IPC(8): H05K1/02H05K3/00
Inventor 俞中烨
Owner GUANGDONG SHENGYI SCI TECH
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