PCB-Cu electrochemical migration corrosion failure simulation method

Abstract

The invention provides a PCB-Cu electrochemical migration corrosion failure simulation method, and belongs to the technical field of metal electrochemical corrosion simulation. The method comprises the following steps: establishing a two-dimensional cellular space, and determining boundary conditions; determining a cellular type and a cellular neighbor type, and determining each cellular type attribute in the cellular space; setting initial distribution of a cellular space; determining a conversion rule between the cells; simulating the corrosion process and morphology change of the PCB-Cu in the voltage coupling humid and hot environment; and processing the simulation result to obtain a curve graph of related products in the PCB-Cu corrosion process. According to the simulation method provided by the invention, the PCB-Cu is taken as a prototype, the specific phenomenon that the PCB-Cu forms a large number of crystal products on the edge of the anode plate and obstructs the subsequent corrosion process in the voltage coupling humid and hot environment is simulated, the accuracy of a simulation result is improved, and a solid foundation is provided for corrosion prevention of an electronic material.

Description

technical field [0001] The invention belongs to the technical field of metal electrochemical corrosion simulation, and in particular relates to a PCB-Cu electrochemical migration corrosion failure simulation method. Background technique [0002] As the carrier and support for information transmission, electronic materials are widely used in various electronic devices. With the continuous innovation of electronic technology, electronic circuits and components are developing in the direction of further miniaturization and high integration. A very small amount of adsorbed thin liquid film or corrosion products will have a serious impact on the performance of electronic circuits and components. Compared with structural materials, on the one hand, a small amount of contamination can lead to severe corrosion of electronic materials. On the other hand, electronic circuits and components mostly work under the combined action of electric field and magnetic field. The existence of ...

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Problems solved by technology

However, some existing metal corrosion models use cellular automata technology, and most of them simulate the general metal uniformity or pitting corrosion, which are not material-specific, and ignore the simulation of the corrosion form of specific components, such as PCB-Cu Corrosion is a special phenomenon that forms a large number of crystalline products at the edge of the anode plate and hinders the subsequent corrosion process

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