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Electrochemical migration test method and device for power packaging

A test method and electrochemical technology, applied in measurement devices, nanotechnology for sensing, scientific instruments, etc., can solve the problems of difficult capture of migration process and difficulty of electrochemical migration observation.

Pending Publication Date: 2021-09-10
HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of the above technical problems, the present invention discloses an electrochemical migration testing method and device for power packaging. The thin liquid film method is used as the research method to build a platform for in-situ observation and real-time monitoring of electrochemical migration of electronic materials. , which solves the difficulties in the observation of electrochemical migration and the difficulty of capturing the migration process in the test

Method used

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  • Electrochemical migration test method and device for power packaging
  • Electrochemical migration test method and device for power packaging
  • Electrochemical migration test method and device for power packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] (1) Mix metal nanoparticles and organic solvents (ethyl cellulose, ethyl acetate, defoamer, terpineol, etc. at a mass ratio of 1:1:2:1:10) at a mass ratio of 6:4 Evenly, ultrasonic vibration is used for 5 minutes when mixing, the speed of the paste mixing machine is 700r / min, and the number of repetitions is 5 times, so as to obtain metal nano conductive ink; then use 200 mesh screen to print metal nano conductive ink on the alumina ceramic substrate , the distance between electrodes was controlled to be 0.5 mm. After the ink was naturally air-dried, the sample was pre-sintered in a tube furnace. The pre-treatment temperature was 50 °C, and the heating rate was 2 °C / min. Intensive pulsed light sintering, the pulsed light sintering parameters are: pulse energy 7.0 J / cm², pulse width 3000 us, repetition times 1, pulse form is single pulse, so as to complete the preparation of the sample to be tested for electrochemical migration.

[0061] (2) Use the metal nano-ink patter...

Embodiment 2

[0064] (1) Mix metal nanoparticles and organic solvents (ethyl cellulose, ethyl acetate, defoamer, terpineol, etc. at a mass ratio of 1:1:2:1:10) at a mass ratio of 6:4 Evenly, ultrasonic vibration is used for 5 minutes when mixing, the speed of the paste mixing machine is 700r / min, and the number of repetitions is 5 times, so as to obtain metal nano conductive ink; then use 200 mesh screen to print metal nano conductive ink on the alumina ceramic substrate , the distance between electrodes was controlled to be 0.5 mm. After the ink was naturally air-dried, the sample was pre-sintered in a tube furnace. The pre-treatment temperature was 50 °C, and the heating rate was 2 °C / min. Intensive pulsed light sintering, the pulsed light sintering parameters are: pulse energy 7.0 J / cm², pulse width 3000 us, repetition times 1, pulse form is single pulse, so as to complete the preparation of the sample to be tested for electrochemical migration.

[0065] (2) Use the metal nano-ink patter...

Embodiment 3

[0068] (1) Mix metal nanoparticles and organic solvents (ethyl cellulose, ethyl acetate, defoamer, terpineol, etc. at a mass ratio of 1:1:2:1:10) at a mass ratio of 6:4 Evenly, ultrasonic vibration is used for 5 minutes when mixing, the speed of the paste mixing machine is 700r / min, and the number of repetitions is 5 times, so as to obtain metal nano conductive ink; then use 200 mesh screen to print metal nano conductive ink on the alumina ceramic substrate , the distance between electrodes was controlled to be 0.5 mm. After the ink was naturally air-dried, the sample was pre-sintered in a tube furnace. The pre-treatment temperature was 50 °C, and the heating rate was 2 °C / min. Intensive pulsed light sintering, the pulsed light sintering parameters are: pulse energy 7.0 J / cm², pulse width 3000 us, repetition times 1, pulse form is single pulse, so as to complete the preparation of the sample to be tested for electrochemical migration.

[0069] (2) Use the metal nano-ink pattern ...

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Abstract

The invention provides an electrochemical migration test method and device for power packaging, and the test method comprises the following steps: S1, printing a to-be-tested electrode pattern on a substrate through employing metal nanometer conductive ink, and obtaining a to-be-tested sample; s2, performing plasma surface treatment on the electrode pattern of the to-be-tested sample; s3, fixing the to-be-tested sample on an objective table of an optical microscope, adjusting the focal length and magnification times, and connecting the positive and negative electrodes of a power meter with the electrode of the to-be-tested sample when a clear and complete image appears; dripping liquid on a sample to be detected to form a liquid film, and starting in-situ observation by adopting in-situ observation equipment while starting a power meter to apply voltage so as to obtain an in-situ monitoring picture of an electrochemical migration process and a current and voltage change curve. According to the technical scheme, the method is easy to operate, the period is short, the device is very convenient to build, and the obtained experimental result has good observability and repeatability.

Description

technical field [0001] The invention belongs to the technical field of electrochemical migration testing in the field of power electronic packaging, and in particular relates to an electrochemical migration testing method and device for power packaging. Background technique [0002] With the continuous innovation of electronic technology and the demand for multi-functional and portable electronic equipment, electronic components are developing in the direction of high integration, miniaturization, more pins, and thinner. The spacing between circuit board connectors, chip pins, wires, and solder joints in electronic components is also drastically reduced under this premise. In this case, even if the operating voltage is only a few volts, the electric field strength is still Up to 100~1000 V / cm. Because more than 90% of electronic equipment is used in the atmospheric environment, the working environment such as temperature, humidity, dust particles and air pollutants will ine...

Claims

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Application Information

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IPC IPC(8): G01N27/416G01N21/84B82Y15/00B82Y40/00
CPCG01N27/416G01N21/84B82Y15/00B82Y40/00
Inventor 计红军徐诗韵张文武
Owner HARBIN INST OF TECH SHENZHEN GRADUATE SCHOOL
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