Dust pollution circuit board insulation failure simulation detection method based on electrochemical migration

Abstract

The invention provides a dust pollution circuit board insulation failure simulation detection method based on electrochemical migration. NaCl and quartz particles are selected as representative components of soluble salt and insoluble particles in dust pollutants, the insulation failure of the circuit board based on the electrochemical migration mechanism under dust pollution is simulated and detected, and the method comprises the following steps: 1, preparing a sample; cleaning a circuit board sample; quantitatively adding a NaCl solution on the surface and covering the quartz particles. 2, preparing a test environment, comprising: setting temperature and humidity; connecting the circuit board sample into a test system; a bias voltage and measurement options are set. 3, carrying out an experiment, comprising the following steps: starting bias voltage; operating the temperature and humidity box; starting a multi-channel insulation resistance test system; experimental continuing 24 hours; 4, data processing, performing morphology analysis on the failure phenomenon of the circuit board; and extracting the characteristic life and carrying out insulation failure judgment. The test method provided by the invention is simple and efficient, and the experimental principle conforms to the actual application situation.

Description

technical field [0001] The present application relates to the technical field of engineering materials, in particular, to a method for simulating and detecting insulation failure of dust-contaminated circuit boards based on electrochemical migration. Background technique [0002] The circuit board is an important part of electronic equipment, and the failure of the circuit board and the electronic components packaged on it will affect the reliability of the entire system. Air pollution is serious in my country. Dust particles can enter the interior of electronic equipment with the air flow, adhere to the surface of circuit boards and electronic components by gravity and electrostatic force, and interact with environmental factors such as ambient temperature, relative humidity, and line-to-line voltage, resulting in circuit failure. Insulation failure based on the electrochemical migration mechanism occurs on the surface of the board. [0003] Studies have shown that the cont...

AI Technical Summary

Problems solved by technology

Studies have shown that the coverage of soluble salts reduces the critical humidity on the surface of the circuit board, making it easier to condense water film on the surface of the circuit board, thereby accelerating the electrochemical migration failure between lines with different potentials, and causing a decrease in the insulation resistance between lines

Even a salt solution with a concentration of 0.1mmol / l can significantly intensify the electrochemical migration between lines on the surface of the circuit board

However, there is no technical solution for the simulation detection method of insulation failure of dust-contaminated circuit boards based on the failure mechanism of electrochemical migration.

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