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Preparation method of anti-electrochemical-migrating nano-silver compound welding paste material

A migratory, nano-silver technology, applied in the direction of welding/cutting media/materials, welding equipment, welding media, etc., can solve the problems of reduced service life, poor mechanical properties, low bonding strength, etc., to achieve difficult agglomeration and dispersion, excellent Structural properties, effects of excellent electronic activity

Inactive Publication Date: 2019-08-09
周轻轩
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention: Aiming at the problem that the traditional composite solder paste material directly preparing composite Ag and Pb has poor mechanical properties and low bonding strength, resulting in a significant reduction in its service life, an anti-electrochemical migration The preparation method of type nano-silver composite solder paste material

Method used

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Experimental program
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Embodiment Construction

[0022]Add palladium chloride to deionized water at a mass ratio of 1:15, stir and mix to obtain a palladium chloride solution, then add nickel chloride to deionized water at a mass ratio of 1:15, stir and mix to obtain a nickel chloride solution , and then weighed 45 to 50 parts of deionized water, 10 to 15 parts of 8% polyvinyl alcohol solution by mass fraction, 10 to 15 parts of palladium chloride solution, and 15 to 20 parts of nickel chloride solution respectively in parts by weight. In the Erlenmeyer flask, control the nitrogen feed rate to 25-30mL / min, pass nitrogen to remove the air, and then place it at 0-5°C under nitrogen atmosphere and keep stirring for 25-30min to obtain the reaction solution and mass ratio 1:25, Add a mass fraction of 2% sodium borohydride solution dropwise to the reaction solution, control the rate of dropping to 1.0-1.5mL / min, keep the temperature for 1-2 hours, and let it stand for 3-5 hours to obtain a composite sol solution; by weight Countin...

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Abstract

The invention relates to a preparation method of an anti-electrochemical-migrating nano-silver compound welding paste material, and belongs to the technical field of welding materials. According to the technical scheme provided by the invention, by adopting a sol compounding scheme, a palladium-nickel compound sol and silver nanoparticles are effectively compounded; through a sol-gel method, Pd atoms on the surfaces of double-metal nanoparticles are dispersed uniformly; meanwhile, nano-silver is easy to agglomerate, so that in order to prevent the agglomeration of the nano-silver, surface active agents are adopted, micelles are formed on the surfaces of silver particles in a flatly lying way so as to be used as a layer of steric hindrance layer, and the nano-silver is prevented from beingagglomerated and grown; and meanwhile, a compound sol material surface carries negative electricity, the surface of the nano-silver carries positive electricity through the surface active agents adsorbed on the surfaces of the silver particles, the surface active agents play a role in directing the deposition of compound gel particles on the surface of the nano-silver, and finally compound particles with core-shell structures are formed so as to be prevented from being agglomerated and dispersed, so that the structural strength and the dispersing performance of the material are further improved.

Description

technical field [0001] The invention relates to a preparation method of an anti-electrochemical migration type nano-silver composite solder paste material, which belongs to the technical field of soldering materials. Background technique [0002] The research on the use of metallic silver as a packaging connection material can be traced back to the 1980s. Micron-sized silver particles and silver flakes were used as connection materials, and a pressure of about 40MPa was applied as the driving force for sintering, which realized the chip and substrate at low temperature. under the connection. The sintering mechanism of the above-mentioned low-temperature connection technology is a densification process caused by solid phase diffusion. Since the sintering process requires the use of external pressure as the sintering driving force, it belongs to pressure-assisted sintering. Tests have proved that with pressure-assisted sintering technology, the sintering temperature can be re...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40
CPCB23K35/40
Inventor 周轻轩
Owner 周轻轩
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