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Micro Ag-Cu solder cream, preparing method thereof and application

A nano-solder paste technology, applied in the field of nano-Ag-Cu solder paste and its preparation, can solve problems such as poor resistance to electrochemical migration, damage to substrates and related components, and difficult connections, achieving excellent oxidation resistance and low production costs Low, combined with good effect

Active Publication Date: 2017-12-26
WUHAN INSTITUTE OF TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the high melting points of Ag and Cu lead to difficulties in connection, because too high connection temperature will damage the substrate and related components
Moreover, the solders containing Ag and Cu in the prior art also have problems such as poor resistance to electrochemical migration and easy oxidation.

Method used

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  • Micro Ag-Cu solder cream, preparing method thereof and application
  • Micro Ag-Cu solder cream, preparing method thereof and application
  • Micro Ag-Cu solder cream, preparing method thereof and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] The preparation of nanometer Ag-Cu solder paste, concrete steps are as follows:

[0039] 1. Preparation of Ag powder (nano-silver particles with a particle size of 5-10nm):

[0040] First, 0.6 g of sodium hydroxide and 4.65 g of stearic acid were dissolved in 600 mL of deionized water, heated to 80 °C, and 2.5 g of AgNO 3 , after constant temperature stirring for 1 h, take the white waxy substance in the upper layer and wash it by centrifugation at a centrifugal rate of 7000 r / min, and wash it 4 times (3 times with deionized water and 1 time with alcohol), and the washing time is 10 min each time. Subsequently, the white waxy substance was heated in a tube furnace with nitrogen gas, the heating rate of the tube furnace was 5°C / min, and when it was heated to 250°C, it was kept for 90 minutes, and finally silver nanoparticles with a particle size of 5-10nm were obtained. . figure 2 It is the SEM image of the silver nano particles prepared in this embodiment.

[0041] ...

Embodiment 2

[0046] The preparation of nanometer Ag-Cu solder paste, concrete steps are as follows:

[0047] Step 1, 2 are with embodiment 1;

[0048] Step 3, preparation of nano-Ag-Cu solder paste: the nano-Ag powder with a particle size of 5-10nm and the nano-Cu powder with a particle size of 20-60nm obtained in steps 1 and 2 respectively in a mass ratio of 4:1 Mix, add alcohol and grind until the alcohol is completely volatilized to obtain uniformly mixed nano Ag-Cu powder, then add glycerol whose mass is one-eighth of the total mass of nano Ag-Cu powder, and make a viscous paste to obtain nano Ag -Cu solder paste.

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Abstract

The invention discloses micro Ag-Cu solder cream, a preparing method thereof and application. The Ag-Cu solder cream is prepared by Ag powder, Cu powder and glycerol according to the following proportion that the mass ratio of the Ag powder and the Cu powder is 2-4:1, and the mass ratio of the sum of the mass of the Ag powder and the Cu powder with glycerol is 8-12:1. The grain size of the Ag powder is 5-10 nm, and the grain size of the Cu powder is 20-60 nm. The preparing method of the Ag-Cu solder cream comprises the following steps that the Ag powder and the Cu powder are picked, ethyl alcohol is added into the Ag powder and the Cu powder, grinding is conducted, and Ag-Cu mixed powder is obtained; and glycerol is added again into the Ag-Cu mixed powder to be concocted into viscous cream, and the micro Ag-Cu solder cream is obtained. The micro Ag-Cu solder cream can be used for connecting parts of coppers. According to the specific stepsfor preparing theconnecting parts of coppers, the appropriate micro Ag-Cu solder cream is picked and evenly painted on the connecting surfaces to be connected of two copper base metal, and the connecting surfaces are closed and connected. The micro Ag-Cu solder cream is high in inoxidizability, good in electrochemical migration resistance and high in specific conductance and thermal conductivity, and a connecting head prepared through connecting of the micro Ag-Cu solder cream is ideal in cutting strength and high in reliability.

Description

technical field [0001] The invention belongs to the field of nano connection, and in particular relates to a nano Ag-Cu solder paste and a preparation method and application thereof. Background technique [0002] High-power electronic devices are often accompanied by high operating temperatures. In order to meet the requirements of electronic packaging, solder with a higher melting point is required. The corresponding melting points of Cu and Ag bulk materials are 1080°C and 960°C respectively, which are much higher than the melting point requirements of solder (usually around 200°C). In addition, both Cu and Ag are good conductors of electricity, which also ensures the stable transmission of electrical signals in electronic devices. At the same time, the addition of nano Cu particles can also reduce costs. Therefore, the preparation and application of nano-Ag-Cu solder is of great significance to the field of high-temperature electronic packaging. [0003] However, the h...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/22B23K35/30B23K35/40
CPCB23K35/22B23K35/3006B23K35/40
Inventor 毛样武段煜王珂闵梅胡坤王升高
Owner WUHAN INSTITUTE OF TECHNOLOGY
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