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A kind of single-phase nano-silver-copper alloy solid solution solder paste and preparation method thereof

A nano-silver and copper alloy technology, applied in the field of materials, can solve the problems of poor oxidation stability of nano-copper solder paste, and achieve the effects of strong resistance to electromigration and electrochemical migration, relatively low cost, and improved dispersion

Active Publication Date: 2021-03-23
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem of electromigration and chemical migration of nano-silver solder paste in the prior art, and the technical problem of poor oxidation stability of nano-copper solder paste. The present invention describes a single-phase nano-silver-copper alloy Solid solution solder paste and preparation method thereof

Method used

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  • A kind of single-phase nano-silver-copper alloy solid solution solder paste and preparation method thereof
  • A kind of single-phase nano-silver-copper alloy solid solution solder paste and preparation method thereof

Examples

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specific Embodiment approach 1

[0031] A single-phase nano-silver-copper alloy solid solution solder paste, comprising single-phase nano-silver-copper alloy particles, a dispersant, a modifier, a diluent and a soldering flux, in terms of the mass percentage of the solder paste, the single-phase nano-silver Copper alloy particles account for 80% to 90%, dispersants account for 2% to 8%, modifiers account for 2% to 8%, thinners account for 2% to 8%, and fluxes account for 2% to 8%.

[0032] Preferably, the flux is rosin resin and its derivatives.

[0033] Preferably, the modifying agent is one or more combinations of polyethylene glycol, stearic acid, and fish oil.

[0034] Preferably, the dispersant is at least one of citric acid and polyvinylpyrrolidone, and the molecular weight of the polyvinylpyrrolidone is 30000-58000.

[0035] Preferably, the diluent is at least one of alcohol and acetone.

[0036] A method for preparing the above-mentioned micro-single-phase nano-silver-copper alloy solid solution sol...

Embodiment 1

[0052] Such as figure 1 As shown, the specific method for preparing single-phase silver-copper nano-alloy particle solder paste with a silver-copper ratio of 1:1 in this example is as follows:

[0053] A single-phase nano-silver-copper alloy solid solution solder paste, comprising single-phase nano-silver-copper alloy particles, a dispersant, a modifier, a diluent and a soldering flux, in terms of the mass percentage of the solder paste, the single-phase nano-silver Copper alloy particles accounted for 84%, dispersants accounted for 3%, modifiers accounted for 7%, thinners accounted for 3%, and flux accounted for 3%.

[0054] A preparation method of the above-mentioned single-phase nano-silver-copper alloy solid solution solder paste, the specific steps are as follows:

[0055] Step 1: Incorporate AgNO 3 and CuCl 2 As a precursor, it is placed in a reaction vessel with a molar ratio of 1:1;

[0056] Step 2: adding deionized water into the reaction vessel as a solvent to co...

Embodiment 2

[0064] Such as figure 1 As shown, the specific method for preparing single-phase nano-silver-copper alloy particle solder paste with a silver-copper ratio of 3:1 in this example is as follows:

[0065] A single-phase nano-silver-copper alloy solid solution solder paste, comprising single-phase nano-silver-copper alloy particles, a dispersant, a modifier, a diluent and a soldering flux, in terms of the mass percentage of the solder paste, the single-phase nano-silver Copper alloy particles account for 80%, dispersant accounts for 5%, modifier accounts for 5%, thinner accounts for 5%, and flux accounts for 5%.

[0066] A preparation method of the above-mentioned single-phase nano-silver-copper alloy solid solution solder paste, the specific steps are as follows:

[0067] Step 1: Incorporate AgNO 3 and CuSO 4 As a precursor, it is placed in a reaction vessel with a molar ratio of 3:1;

[0068] Step 2: adding deionized water into the reaction vessel as a solvent to completely ...

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Abstract

The invention discloses a nano silver copper alloy solid solution welding paste with sintering connection performance and a preparation method for the nano silver copper alloy solid solution welding paste and belongs to the technical field of materials. The nano silver copper alloy solid solution welding paste is made of, in percentage by mass, 80-90% of single-phase nano silver copper alloy particles, 2-8% of a dispersing agent, 2-8% of a dressing agent, 2-8% of a thinning agent and 2-8% of scaling powder. According to the single-phase nano silver copper alloy solid solution welding paste andthe preparation method for the single-phase nano silver copper alloy solid solution welding paste, single-silver-phase silver copper alloy nano particles are directly reduced out adopting a one-stepliquid phase reduction method, the silver copper mass ratio in the silver copper nano alloy particles is flexible and can be adjusted and controlled at will within the range of (0.1-10) : 1, the preparation method has the characteristics of being simple in method, high in production efficiency and wide in process application range, the single-phase nano silver copper alloy solid solution welding paste has excellent connection performance, the boundedness of single nano silver and single nano copper in the application process is overcome, and the single-phase nano silver copper alloy solid solution welding paste has the advantages of low-temperature connection high-temperature service, low connection pressure applying, short connection time, strong oxidation resistance, strong electromigration resistance and electrochemical migration resistance and low relative cost.

Description

technical field [0001] The invention belongs to the technical field of materials, and in particular relates to a single-phase nanometer silver-copper alloy solid solution solder paste with sintering connection performance and a preparation method thereof. Background technique [0002] With the development of related technologies in the electronic industry, the size of electronic devices is getting smaller and smaller, the pin density is getting higher and higher, and the power is getting higher and higher, which puts forward higher high temperature resistance for solder used in the field of micro-connection Require. [0003] However, higher high temperature resistance often means that a connection material with a higher melting point needs to be selected, which requires a higher connection temperature during the connection process, which is easy to cause damage to components and affect component reliability. [0004] Since the sintering temperature of the particles is propo...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/02B23K35/36
CPCB23K35/025B23K35/3601
Inventor 王春青郑振刘威
Owner HARBIN INST OF TECH
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