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Method for preparing low-temperature interconnected high-temperature in-service joint by using single-phase nano silver-copper alloy solder paste

A high-temperature service, nano-silver technology, applied in the field of micro-connection, can solve problems such as affecting the performance of sintered joints, easy oxidation, and restricting applications, and achieves strong resistance to electromigration and electrochemical migration, strong oxidation resistance, and compatibility. Good results

Active Publication Date: 2019-03-29
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Common nano-solder pastes include nano-silver solder paste and nano-copper solder paste, but nano-silver is prone to electromigration and electrochemical migration, and the relative cost is relatively high, while nano-copper is easily oxidized and forms an oxide layer, which affects the performance of sintered joints. Limiting its large-scale application in the industrial field

Method used

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  • Method for preparing low-temperature interconnected high-temperature in-service joint by using single-phase nano silver-copper alloy solder paste
  • Method for preparing low-temperature interconnected high-temperature in-service joint by using single-phase nano silver-copper alloy solder paste

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Effect test

specific Embodiment approach 1

[0029] The low-temperature interconnection high-temperature service joint includes a part to be welded 1, a pad I2, a solder paste 3, a pad II4 and a substrate 5, the substrate 5 is welded with a pad II4, and the part to be welded 1 is welded with a pad I2 , the solder paste 3 is located between the pad I2 and the pad II4, and in the following specific implementation manner, the solder paste 3 is a single-phase nano-silver-copper alloy solder paste.

[0030] A method for preparing low-temperature interconnection high-temperature service joints by adopting single-phase nano-silver-copper alloy solder paste, comprising the following steps:

[0031] Lay the single-phase nano-silver-copper alloy solder paste on the pad II4 by screen printing or dispensing, align the pad I2 with the pad II4, and apply a pressure of 0.2~10Mpa to the part to be welded 1;

[0032] Step 2: Put the above system into a reflow furnace, heat it to 180-200°C at a rate of 2-10°C / min to complete the preheatin...

Embodiment 1

[0049] Such as figure 1 , 2 As shown, when a lower pressure is applied, the single-phase nano-alloy particle solder paste interconnection joint forming method includes the following steps:

[0050] Step 1: Incorporate AgNO 3 and CuCl 2 As a precursor, it is placed in a reaction vessel with a molar ratio of 1:1;

[0051] Step 2: adding deionized water into the reaction vessel as a solvent to completely dissolve the metal precursor to obtain a precursor solution;

[0052] Step 3: Add a metal chelating agent to the precursor solution and fully stir to obtain a reaction solution, wherein the molar ratio of the precursor to the metal chelating agent is 4:1, the stirring speed is 200r / min, and the stirring time is 2min; the metal The chelating agent is 2-hydroxypropane-1,2,3-tricarboxylic acid and 2-hydroxypropane-1,2,3-tricarboxylic acid potassium salt;

[0053] Step 4: Add a reducing agent solution with a concentration of 4 mol / L dropwise to the reaction solution at a rate of...

Embodiment 2

[0060] Such as figure 1 , 2 As shown, when a higher pressure is applied, the single-phase nano-alloy particle solder paste interconnection joint forming method includes the following steps:

[0061] Step 1: Incorporate AgNO 3 and CuSO 4 As a precursor, it is placed in a reaction vessel with a molar ratio of 3:1;

[0062] Step 2: adding deionized water into the reaction vessel as a solvent to completely dissolve the metal precursor to obtain a precursor solution;

[0063] Step 3: Add a metal chelating agent to the precursor solution and fully stir to obtain a reaction solution, wherein the molar ratio of the precursor to the metal chelating agent is 10:1, the stirring speed is 400r / min, and the stirring time is 10min; the metal The chelating agent is 2-hydroxypropane-1,2,3-tricarboxylic acid sodium salt and disodium edetate;

[0064] Step 4: Add a reducing agent solution with a concentration of 2 mol / L to the reaction solution dropwise at a rate of 3 ml / min, the volume rat...

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Abstract

The invention, which relates to the technical field of micro-connection, provides a method for preparing a low-temperature interconnected high-temperature in-service joint by using a single-phase nanosilver-copper alloy solder paste. The method comprises the following steps: step one, placing a nano inter-metallic compound solder paste on a substrate, completing an alignment process of a to-be-soldered component, and applying a pressure; and step two, placing the system in a reflow furnace, and implementing a preheating phase, a heat preservation phase, a re-flowing phase, and a cooling phaseto complete volatilization of organic matters, uniform sintering among single-phase nano-alloy particles, and wetting and interfacial reaction of a bonding pad. According to the invention, with the single-phase nano silver-copper alloy particles, the powerful driving force is provided for the sintering process based on the excellent surface activity property of the nano particles; the low-temperature connection that is compatible with the traditional reflow soldering process and has the melting point far lower than the melting point of the block is realized; and an excellent joint with the high anti-oxidation, anti-electromigration and anti-electrochemical migration capabilities is formed. The high-temperature service of the low-temperature connection is realized while the compatibility with traditional process is high and the production efficiency is high.

Description

technical field [0001] The invention belongs to the technical field of micro-connection, and relates to a method for packaging, assembling and interconnecting electronic devices, in particular to a method for preparing low-temperature interconnection and high-temperature service joints by using single-phase nano-silver-copper alloy solder paste. Background technique [0002] Micro-connection technology is one of the core technologies in the manufacturing process of electronic products. It is a key link in electronic device packaging, LED packaging, micro-system packaging, and power component packaging. Micro-connection technology is an important guarantee for the realization of chip functions. However, as The integration of packaged devices is getting higher and higher, more complex functions are realized in smaller sizes, the pin density is getting higher and higher, and the device power is getting higher and higher, which puts forward new requirements for the high temperatu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60B81C3/00B81C1/00
CPCH01L24/27H01L24/83B81C1/00095B81C3/001H01L2224/8321
Inventor 王春青郑振刘威
Owner HARBIN INST OF TECH
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