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Thermoelectric module and method for manufacturing thermoelectric module post

A thermoelectric module and terminal technology, which is applied in the manufacture/processing of thermoelectric devices, thermoelectric device components, circuits, etc., can solve problems such as condensation of thermoelectric modules, achieve a simple structure, and inhibit electrochemical migration.

Pending Publication Date: 2021-04-16
KELK LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Here, if the temperature adjustment temperature of the thermoelectric element is lower than the dew point of the surrounding environment, condensation may occur in the thermoelectric module.

Method used

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  • Thermoelectric module and method for manufacturing thermoelectric module post
  • Thermoelectric module and method for manufacturing thermoelectric module post
  • Thermoelectric module and method for manufacturing thermoelectric module post

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0051]

[0052] Such as figure 2 As shown, the thermoelectric module 1A has a pair of substrates 2 (upper substrate 21 and lower substrate 22), a plurality of thermoelectric elements 3 (p-type thermoelectric elements 3P and n-type thermoelectric elements 3N) arranged between these substrates 2, and These thermoelectric elements 3 are connected to the first electrode 4A (the upper electrode 41 and the lower electrode 42 ), the terminal 111 and the second electrode 4B.

[0053] The upper substrate 21 and the lower substrate 22 have a plate shape formed of an electrically insulating material. As an example, the upper substrate 21 and the lower substrate 22 are formed of ceramics. The upper substrate 21 faces the lower substrate 22 above and is arranged with a gap therebetween.

[0054] A plurality of thermoelectric elements 3 are arranged at intervals between the upper substrate 21 and the lower substrate 22 in the plane direction perpendicular to the thickness direction of ...

no. 2 approach

[0073]

[0074] Such as Figure 8 or Figure 9 As shown, the thermoelectric module 1B has a pair of substrates 2 (upper substrate 21 and lower substrate 22), a plurality of thermoelectric elements 3 (p-type thermoelectric elements 3P and n-type thermoelectric elements 3N) arranged between these substrates 2, and the The connection electrode 4C (electrode 4 ) to which these thermoelectric elements 3 are connected, the terminals 110 and 111 , and the terminal electrodes 4T to connect these terminals 110 and 111 to the thermoelectric elements 3 .

[0075] The upper substrate 21 and the lower substrate 22 have a plate shape formed of an electrically insulating material. The upper substrate 21 faces the lower substrate 22 above and is disposed with a gap therebetween. The upper substrate 21 and the lower substrate 22 are formed of ceramics as an example.

[0076] The upper substrate 21 and the lower substrate 22 are powder sintered bodies formed into a plate shape by sintering...

no. 3 approach

[0094]

[0095] Such as Figure 12 or Figure 13 As shown, the thermoelectric module 1C has: a pair of substrates 2 (upper substrate 21 and lower substrate 22); a plurality of thermoelectric elements 3 (p-type thermoelectric elements 3P and n-type thermoelectric elements 3N) arranged between these substrates 2; Connection electrode 4C (electrode 4 ) connecting these thermoelectric elements 3 ; heating thermoelectric element 3H; terminals 110 , 111 ; end electrodes 4T connecting these terminals 110 , 111 and thermoelectric elements 3 .

[0096] The upper substrate 21 and the lower substrate 22 have a plate shape formed of an electrically insulating material. The upper substrate 21 faces the lower substrate 22 above and is disposed with a gap therebetween. As an example, the upper substrate 21 and the lower substrate 22 are formed of ceramics.

[0097] Such as Figure 12 As shown, a plurality of thermoelectric elements 3 are arranged in a grid pattern at intervals between ...

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Abstract

Provided is a thermoelectric module capable of further suppressing electrochemical migration with a simple structure. A thermoelectric module includes: a lower substrate; an upper substrate disposed above the lower substrate so as to be opposite to the lower substrate; a plurality of p-type thermoelectric elements and n-type thermoelectric elements disposed between the lower substrate and the upper substrate; first electrodes disposed on an upper surface of the lower substrate and a lower surface of the upper substrate, and sequentially connecting the p-type and n-type thermoelectric elements alternately to form a series circuit; and a second electrode that is provided on the lower substrate and connects a thermoelectric element at an end of the series circuit to a post, in which the post includes a post body formed of nickel, and a nickel passivation film covering a side surface of the post body.

Description

technical field [0001] The invention relates to a thermoelectric module and a method for manufacturing a terminal for the thermoelectric module. [0002] This application is based on the Japanese application with the filing date of October 16, 2019 and the Japanese application No. 2019-189374, and the Japanese application with the filing date of October 16, 2019 and the Japanese application No. 2019-189375 And the Japanese application with the filing date of October 16, 2019 and the application number of Japanese Patent Application No. 2019-189376 claims the right of priority, the content of which is hereby cited. Background technique [0003] Until now, thermoelectric modules have been widely used as circuit elements that absorb or generate heat using the Peltier effect. As an example, as described in Patent Document 1, a thermoelectric module includes: p-type and n-type thermoelectric elements; a pair of electrodes connecting these thermoelectric elements; terminals for s...

Claims

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Application Information

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IPC IPC(8): H01L35/08H01L35/10H01L35/28H01L35/34
CPCH01S5/02415H01S5/06804G02B6/4271H10N10/82H10N10/01H10N10/17H10N10/13H04B10/40G02B6/4204H01S5/0064H01S5/02469H10N10/10
Inventor 松并博之
Owner KELK LTD
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