Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A kind of preparation method of Ag-Si nano-solder paste that improves silver electrochemical migration

A silver electrochemical and nano-welding technology, applied in welding equipment, manufacturing tools, welding media, etc., can solve problems such as changing dielectric properties, affecting reliability, and equipment failure, and achieves simple preparation process, good stability, and low cost. low effect

Active Publication Date: 2021-04-30
TIANJIN UNIV
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Silver electromigration can change the dielectric properties, reduce insulation resistance, lead to the formation of silver "bridges", short circuits between electrodes, affect reliability and cause equipment failure
With the trend of miniaturization of electronic components and the reduction of conductor spacing in electronic packaging, the risk of equipment failure due to electrochemical migration of silver will increase

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of preparation method of Ag-Si nano-solder paste that improves silver electrochemical migration

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025](a) mixed with silicon particles having an average particle size of 15 to 100 nm and the diluent pine alcohol at a heroic water bath for 30 min, of which the mass of silicon particles was 0.1 g, and the mass of pine alcohol was 0.1 g.

[0026](b) The mixture of silicon particles and diluent pine alcohols prepared above was added to nano silver solder paste having average particle size of 50 to 500 nm, with silver solder paste to obtain silver, silicon particles and pine Mixture of oil alcohol;

[0027](c) The mixture of silver, silicon particles and phenolorol obtained by step (b) was stirred by a high-efficiency agitator gauge of 2000 r / min by a high-efficiency agitation instrument having a rotational speed of 2000 r / min.

Embodiment 2

[0029](a) mixed with silicon particles having a average particle size of 15 to 100 nm and the diluent pine alcohol at a proposition of the ultrasonic water bath, wherein the mass of silicon particles is 1 g, the mass of pine alcohol is 2g;

[0030](b) The mixture of the above-prepared silicon particles and diluent pine alcohol added to nano silver solder paste having a average particle size of 50 to 500 nm, wherein the mass of silver solder paste is 112.5 g, resulting in silver, silicon particles and pine. Mixture of oil alcohol;

[0031](c) The mixture of silver, silicon particles, and pine alcohol obtained by step (b) was stirred with a high-efficiency agitatorometer having a rotation speed of 1500 r / min, and the Ag-Si Nano-Si is obtained.

Embodiment 3

[0033](a) a mixture of silicon particles having an average particle size of 15 to 100 nm and the diluent pine alcohol were mixed with a concentrated water bath, of which the mass of silicon particles was 15 g, and the mass of pine alcohol was 22.5 g.

[0034](b) The mixture of silicon particles and diluent pine alcohols prepared above was added to nano-silver solder paste having a average particle size of 50 to 500 nm, with silver mass of 96.59 g, resulting in silver, silicon particles, and pine alcohol. mixture;

[0035](c) The mixture of silver, silicon particles and phenolorol obtained by step (b) was stirred by a high-efficiency agitation instrument having a rotational speed of 1000 r / min, and was prepared by agharged the Ag-Si Nano-Si.

[0036]The obtained Ag-Si nano-Si nanor solder paste and the commercial nano silver solder paste were sintered at 280 ° C at a heating rate of 5 ° C / min, and the rear furnace was cold, then at a high temperature condition of 400 ° C, applied The 200V...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
shear strengthaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention relates to a preparation method of Ag-Si nano-solder paste for improving the electrochemical migration of silver; fully mixing silicon particles with an average particle size of 15-100 nm and a diluent through an ultrasonic water bath; adding the mixture of the silicon particles and the diluent Into the nano-silver solder paste with an average particle size of 50-500nm and by stirring to obtain Ag-Si nano-solder paste; silicon is easily converted into silicon dioxide in the invented Ag-Si nano-solder paste, which promotes the oxygen required for silver ionization The content of silver is also reduced, effectively improving the electromigration of silver. The prepared Ag-Si nano-solder paste and commercial nano-silver solder paste were sintered at 280°C at a heating rate of 5°C / min, kept for 30 minutes, and cooled in the furnace. At a high temperature of 400°C, a voltage of 200V was applied for electrical Migration experiments. The results prove that the failure life of Ag-Si nano-solder paste is at least 5.83 times higher than that of nano-silver solder paste.

Description

Technical field[0001]The present invention relates to a method of improving an Ag-Si nano-solder paste of silver electrochemical migration, belonging to the preparation of advanced material and electronic component package.Background technique[0002]In recent years, nano-stage nano-silver solder paste replaces the traditional method of providing sintering driving force, achieving pressure, low temperature sintering and obtain reliable, lead-free environmentally friendly connection, widely used in broadband semiconductor high temperature chip For example, SiC, GaN. In addition, nano-Ag solder paste has good conductivity, good thermal conductivity, excellent anti-fatigue performance, suitable for high temperature high-power and high density packages, good processability, green lead-free and low process temperature, etc., with the development of the power electronics industry It gradually replaces the traditional tin lead solder into the preferred interconnect material for high-power el...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30
CPCB23K35/025B23K35/3006
Inventor 梅云辉李丹李欣陆国权
Owner TIANJIN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com