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Preparation method of Ag-SiO2 nano-welding paste capable of resisting silver electromigration in high-temperature environment

A high-temperature environment, ag-sio2 technology, used in welding equipment, welding media, manufacturing tools, etc., can solve problems such as short circuits, affecting reliability, changing dielectric properties, etc., to achieve a simple preparation process, good stability, and high efficiency. Effect

Active Publication Date: 2019-01-29
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Silver migration can change the dielectric properties, reduce insulation resistance, lead to the formation of silver "bridges", short circuits between electrodes, affect reliability and cause equipment failure
With the trend of miniaturization of electronic components and the reduction of conductor spacing in electronic packaging, the risk of equipment failure due to electrochemical migration of silver will increase

Method used

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  • Preparation method of Ag-SiO2 nano-welding paste capable of resisting silver electromigration in high-temperature environment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] (a) Mix silicon dioxide powder with an average particle size of 20-100 nm and diluent terpineol for 30 minutes with the assistance of an ultrasonic water bath, wherein the quality of silicon dioxide powder is 0.1 g, and the quality of terpineol is 0.1 g ;

[0027] (b) the mixture of silicon dioxide powder and diluent terpineol is added to the nano-silver solder paste with an average particle size of 50-500nm, wherein the quality of the silver solder paste is 113.52g to obtain silver, silicon dioxide powder and A mixture of terpineols;

[0028] (c) The mixture of silver, silicon dioxide powder and terpineol obtained in step (b) was stirred for 60s by a high-efficiency stirrer with a speed of 2000r / min to prepare Ag-SiO 2 nano solder paste.

Embodiment 2

[0030] (a) Mix silicon dioxide powder with an average particle size of 20 to 100 nm and diluent terpineol for 15 minutes with the assistance of an ultrasonic water bath, wherein the quality of the silicon dioxide powder is 5 g, and the quality of terpineol is 7.5 g;

[0031] (b) Add the mixture of silicon dioxide powder and diluent terpineol to the nano-silver solder paste with an average particle size of 50-500nm, wherein the quality of the silver solder paste is 107.95g to obtain silver, silicon dioxide powder and pine A mixture of oleyl alcohols;

[0032] (c) The mixture of silver, silicon dioxide powder and terpineol obtained in step (b) was stirred for 45s by a high-efficiency stirrer with a speed of 1500r / min to prepare Ag-SiO 2 nano solder paste.

Embodiment 3

[0034] (a) Mix silicon dioxide powder with an average particle size of 20-100 nm and diluent ethanol for 45 minutes with the assistance of an ultrasonic water bath, wherein the quality of the silicon dioxide powder is 15 g, and the quality of ethanol is 30 g;

[0035] (b) Add the mixture of silicon dioxide powder and diluent ethanol to the nano-silver solder paste with an average particle size of 50-500nm, wherein the quality of the silver solder paste is 96.59g to obtain a mixture of silver, silicon dioxide powder and ethanol ;

[0036] (c) The mixture of silver, silicon dioxide powder and ethanol obtained in step (b) is stirred for 30s by a high-efficiency stirrer with a speed of 1000r / min to prepare Ag-SiO 2 nano solder paste.

[0037] The Ag-SiO that the embodiment of the present invention makes 2 Nano-solder paste and commercially-obtained nano-silver paste were sintered at 280°C at a heating rate of 5°C / min, kept warm for 30 minutes, then cooled in a furnace, and then ...

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Abstract

The invention relates to a preparation method of an Ag-SiO2 nano-welding paste capable of resisting silver electromigration in a high-temperature environment. The method comprises the following stepsthat silicon dioxide powder with the average particle size of 20-100 nm is mixed with a diluent under the assistance of an ultrasonic water bath; the mixture is added into a nano-silver soldering paste with the average particle size of 50-500 nm, uniform stirring and mixing are conducted to prepare an Ag-SiO2 nano-soldering paste; the diluent is added to adjust viscosity of the soldering paste soas to facilitate coating and printing of the Ag-SiO2 nano soldering paste; the prepared Ag-SiO2 nano-soldering paste and the commercially-obtained nano-silver soldering paste are correspondingly sintered at 280 DEG C per the heating rate of 5 DEG C / min, the temperature is kept for 30 min, furnace cooling is then conducted, and then an electric migration experiment is carried out at a high-temperature condition of 400 DEG C and 400 V / mm electric field intensity. The result proves that compared with a nano-silver soldering paste, the failure life of the Ag-SiO2 nano soldering paste is at least prolonged by 3.60 times.

Description

technical field [0001] The invention relates to a kind of Ag-SiO used in high temperature environment to improve silver electromigration phenomenon 2 The invention discloses a preparation method of nano solder paste, which is used for connecting electronic devices, and belongs to the field of advanced material preparation and packaging of electronic components. Background technique [0002] In recent years, nano-scale nano-silver solder paste has replaced the traditional method of relying on mechanical pressure to provide sintering driving force, realized pressure-free, low-temperature sintering and obtained reliable, lead-free and environmentally friendly connections, and is widely used in wide-bandgap semiconductor high-temperature power chips (eg SiC, GaN). In addition, nano-Ag solder paste has the advantages of good electrical conductivity, good thermal conductivity, excellent fatigue resistance, suitable for high-temperature, high-power and high-density packaging, good...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30
CPCB23K35/025B23K35/3006
Inventor 梅云辉李丹李欣陆国权
Owner TIANJIN UNIV
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