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An ag-sio resistant to silver electromigration in high temperature environment 2 Preparation method of nano solder paste

A high-temperature environment, ag-sio2 technology, applied in welding equipment, manufacturing tools, welding media and other directions, can solve problems such as short circuit, affecting reliability, equipment failure, etc., to achieve the effect of simple preparation process, good stability and low cost

Active Publication Date: 2021-08-03
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Silver migration can change the dielectric properties, reduce insulation resistance, lead to the formation of silver "bridges", short circuits between electrodes, affect reliability and cause equipment failure
With the trend of miniaturization of electronic components and the reduction of conductor spacing in electronic packaging, the risk of equipment failure due to electrochemical migration of silver will increase

Method used

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  • An ag-sio resistant to silver electromigration in high temperature environment <sub>2</sub> Preparation method of nano solder paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] (a) Mix silicon dioxide powder with an average particle size of 20-100 nm and diluent terpineol for 30 minutes with the assistance of an ultrasonic water bath, wherein the quality of silicon dioxide powder is 0.1 g, and the quality of terpineol is 0.1 g ;

[0027] (b) The mixture of silicon dioxide powder and diluent terpineol is added to the nano-silver solder paste with an average particle size of 50-500 nm, wherein the quality of the silver solder paste is 113.52g to obtain silver and silicon dioxide powder and terpineol mixture;

[0028] (c) The mixture of silver, silica powder and terpineol obtained in step (b) was stirred for 60s by a high-efficiency stirrer with a rotation speed of 2000 r / min to prepare Ag-SiO 2 nano solder paste.

Embodiment 2

[0030] (a) Mix silicon dioxide powder with an average particle size of 20 to 100 nm and diluent terpineol for 15 minutes with the assistance of an ultrasonic water bath, wherein the quality of the silicon dioxide powder is 5 g, and the quality of terpineol is 7.5 g;

[0031] (b) Add the mixture of silicon dioxide powder and diluent terpineol to the nano-silver solder paste with an average particle size of 50-500nm, wherein the quality of the silver solder paste is 107.95g to obtain silver, silicon dioxide powder and pine A mixture of oleyl alcohols;

[0032] (c) The mixture of silver, silica powder and terpineol obtained in step (b) was stirred for 45s by a high-efficiency stirrer with a rotation speed of 1500 r / min to prepare Ag-SiO 2 nano solder paste.

Embodiment 3

[0034] (a) Mix silicon dioxide powder with an average particle size of 20-100nm and diluent ethanol for 45 minutes with the assistance of an ultrasonic water bath, wherein the quality of silicon dioxide powder is 15g, and the quality of ethanol is 30g;

[0035] (b) Add the mixture of silicon dioxide powder and diluent ethanol to the nano-silver solder paste with an average particle size of 50-500nm, wherein the quality of the silver solder paste is 96.59g to obtain a mixture of silver, silicon dioxide powder and ethanol ;

[0036] (c) The mixture of silver, silicon dioxide powder and ethanol obtained in step (b) was stirred for 30s by a high-efficiency stirrer with a speed of 1000r / min to prepare Ag-SiO 2 nano solder paste.

[0037] The Ag-SiO that the embodiment of the present invention makes 2 Nano-solder paste and commercially-obtained nano-silver paste were sintered at 280°C at a heating rate of 5°C / min, kept for 30 minutes, then cooled in a furnace, and then electromigr...

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Abstract

The invention relates to AgSiO which is resistant to silver electromigration in a high temperature environment 2 The preparation method of nano-solder paste; mixing silicon dioxide powder with an average particle size of 20-100nm and a diluent with the assistance of an ultrasonic water bath; adding it to nano-silver solder paste with an average particle size of 50-500nm, and stirring Mix homogeneously to obtain Ag‑SiO 2 Nano-solder paste; diluent is added to adjust the viscosity of the solder paste so that nano-Ag‑SiO 2 Application and printing of solder paste. The prepared Ag‑SiO 2 Nano-solder paste and commercially obtained nano-silver paste were sintered at 280°C at a heating rate of 5°C / min, kept for 30 minutes and cooled in a furnace, and then electromigrated at a high temperature of 400°C and an electric field strength of 400V / mm experiment. The results show that Ag‑SiO 2 The failure life of the nano solder paste is at least 3.60 times higher than that of the nano silver solder paste.

Description

technical field [0001] The invention relates to a kind of Ag-SiO used in high temperature environment to improve silver electromigration phenomenon 2 The invention discloses a preparation method of nano solder paste, which is used for connecting electronic devices, and belongs to the field of advanced material preparation and packaging of electronic components. Background technique [0002] In recent years, nano-scale nano-silver solder paste has replaced the traditional method of relying on mechanical pressure to provide sintering driving force, realized pressure-free, low-temperature sintering and obtained reliable, lead-free and environmentally friendly connections, and is widely used in wide-bandgap semiconductor high-temperature power chips (eg SiC, GaN). In addition, nano-Ag solder paste has the advantages of good electrical conductivity, good thermal conductivity, excellent fatigue resistance, suitable for high-temperature, high-power and high-density packaging, good...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/30
CPCB23K35/025B23K35/3006
Inventor 梅云辉李丹李欣陆国权
Owner TIANJIN UNIV
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