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Preparation method of Ag-Si nanometer welding paste for improving silver electrochemistry migration

A silver electrochemistry and nano-welding technology, applied in welding equipment, welding medium, manufacturing tools, etc., can solve the problems of changing dielectric properties, affecting reliability, equipment failure, etc., and achieving simple preparation process, good stability and cost. low effect

Active Publication Date: 2019-01-29
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Silver electromigration can change the dielectric properties, reduce insulation resistance, lead to the formation of silver "bridges", short circuits between electrodes, affect reliability and cause equipment failure
With the trend of miniaturization of electronic components and the reduction of conductor spacing in electronic packaging, the risk of equipment failure due to electrochemical migration of silver will increase

Method used

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  • Preparation method of Ag-Si nanometer welding paste for improving silver electrochemistry migration

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] (a) Mix silicon particles with an average particle size of 15-100 nm and diluent terpineol for 30 minutes with the assistance of an ultrasonic water bath, wherein the quality of the silicon particles is 0.1 g, and the quality of terpineol is 0.1 g;

[0026] (b) Add the mixture of silicon particles and diluent terpineol prepared above to the nano-silver solder paste with an average particle size of 50-500nm, wherein the quality of the silver solder paste is 113.52g to obtain silver, silicon particles and pine A mixture of oleyl alcohols;

[0027] (c) The mixture of silver, silicon particles and terpineol obtained in step (b) was stirred for 60s by a high-efficiency stirrer with a rotation speed of 2000r / min to prepare Ag-Si nano-solder paste.

Embodiment 2

[0029] (a) Mix silicon particles with an average particle size of 15-100 nm and diluent terpineol for 15 minutes with the assistance of an ultrasonic water bath, wherein the quality of the silicon particles is 1 g, and the quality of terpineol is 2 g;

[0030] (b) Add the mixture of silicon particles and diluent terpineol prepared above to the nano-silver solder paste with an average particle size of 50-500nm, wherein the quality of the silver solder paste is 112.5g, to obtain silver, silicon particles and terpineol A mixture of oleyl alcohols;

[0031] (c) The mixture of silver, silicon particles and terpineol obtained in step (b) was stirred for 45s by a high-efficiency stirrer with a rotation speed of 1500r / min to prepare Ag-Si nano-solder paste.

Embodiment 3

[0033] (a) Mix silicon particles with an average particle size of 15-100 nm and diluent terpineol for 45 minutes with the assistance of an ultrasonic water bath, wherein the quality of the silicon particles is 15 g, and the quality of terpineol is 22.5 g;

[0034] (b) Add the mixture of silicon particles and diluent terpineol prepared above to the nano-silver solder paste with an average particle size of 50-500nm, wherein the mass of silver is 96.59g to obtain silver, silicon particles and terpineol mixture;

[0035] (c) The mixture of silver, silicon particles and terpineol obtained in step (b) was stirred for 30s by a high-efficiency stirrer with a rotation speed of 1000r / min to prepare Ag-Si nano-solder paste.

[0036] The prepared Ag-Si nano-solder paste and the commercially obtained nano-silver paste were sintered at a heating rate of 5 °C / min at 280 °C, kept for 30 min and cooled in the furnace, and then applied at a high temperature of 400 °C. Electromigration experime...

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Abstract

The invention relates to a preparation method of Ag-Si nanometer welding paste for improving silver electrochemistry migration. According to the method, silicon particles with the average particle size being 15-100 nm and diluent are fully mixed through ultrasonic water bath; a mixture of the silicone particles and the diluent is added to the nanometer silver welding paste with the average particle size being 50-500 nm, and stirred to prepare the Ag-Si nanometer welding paste. According to the method, silicone in the Ag-Si nanometer welding paste is transformed into silicon dioxide, the content of oxygen needed by silver ionization is also reduced, and electric migration of silver is effectively improved. The prepared Ag-Si nanometer welding paste and commercial nanometer silver welding paste are sintered at the temperature of 280 DEG C and at the heating rate of 5 DEG C per minute, heat is preserved for 30 min, then boiler cooling is carried out, and 200 V voltage is applied to carrying out electricity migration testing on the 400 DEG C high-temperature condition. The result proves that the burn-out life of the Ag-Si nanometer welding paste is at least prolonged by 5.83 times compared with the nanometer silver welding paste.

Description

technical field [0001] The invention relates to a preparation method of Ag-Si nanometer solder paste for improving silver electrochemical migration, which belongs to the field of advanced material preparation and packaging of electronic components. Background technique [0002] In recent years, nano-scale nano-silver solder paste has replaced the traditional method of relying on mechanical pressure to provide sintering driving force, realized pressure-free, low-temperature sintering and obtained reliable, lead-free and environmentally friendly connections, and is widely used in wide-bandgap semiconductor high-temperature power chips (eg SiC, GaN). In addition, nano-Ag solder paste has the advantages of good electrical conductivity, good thermal conductivity, excellent fatigue resistance, suitable for high-temperature, high-power and high-density packaging, good processability, green lead-free, and low process temperature. With the development of the power electronics industr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30
CPCB23K35/025B23K35/3006
Inventor 梅云辉李丹李欣陆国权
Owner TIANJIN UNIV
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