An easy-to-disassemble device for preventing backsplash liquid from polluting wafers
A wafer and liquid technology, applied in the field of wafer photoresist curing in the semiconductor industry, can solve the problems of small replacement space and inconvenient operation, and achieve the effect of avoiding tilt and stable lifting movement
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[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0035] see Figure 1-2, the embodiment of the present invention provides a device 100 that is easy to disassemble and prevent backsplash liquid from contaminating wafers, including: a waste liquid collection rectifier cup 110 (CUP), a waste liquid collection rectifier cup support 120, at least one lifting active part and at least A translation active part. Wherein, the waste liquid collecting rectifying cup support 120 is located below the waste liquid collecting ...
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