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Thick film resistor paste suitable for both alumina ceramic substrate and isolation dielectric layer

A technology of alumina ceramics and isolation medium, which is applied in the direction of conductive materials, circuits, electrical components, etc. dispersed in non-conductive inorganic materials, and can solve the problem that products cannot be used universally, multilayer thick film integrated circuit products are inconvenient to use, integrated circuit Problems such as troublesome design and manufacturing process, to achieve the effect of good resistance consistency, small graphic effect, and simple preparation process

Active Publication Date: 2022-03-11
西安宏星电子浆料科技股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Existing resistor pastes for thick film integrated circuits are designed separately for the alumina ceramic substrate and the isolation dielectric layer, and the products cannot be used universally.
It causes inconvenient use of multilayer thick film integrated circuit products, and brings troubles to the design and manufacturing process of integrated circuits

Method used

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  • Thick film resistor paste suitable for both alumina ceramic substrate and isolation dielectric layer
  • Thick film resistor paste suitable for both alumina ceramic substrate and isolation dielectric layer
  • Thick film resistor paste suitable for both alumina ceramic substrate and isolation dielectric layer

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Embodiment Construction

[0015] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments, which do not limit the protection scope of the present invention. The protection scope of the present invention is only limited by the claims, and any omission, replacement or modification made by those skilled in the art on the basis of the disclosed embodiments of the present invention will fall within the protection scope of the present invention.

[0016] 1. Selection of conductive powder: the particle size of silver powder ranges from 1 to 3 μm, and the specific surface area of ​​palladium powder is 5 to 15 m 2 / g, the specific surface area of ​​ruthenium dioxide is 25~55m 2 / g, the specific surface area of ​​lead ruthenate is 3~10m 2 / g.

[0017] 2. Preparation of lead borosilicate glass powder: according to the weight percentage of PbO 57%, SiO 2 7%, CaO 13%, Al 2 o 3 3%, B 2 o 3 15% and ZnO 5%. After mixing various oxides evenly, the r...

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Abstract

The invention discloses a thick-film resistance paste suitable for both alumina ceramic substrates and isolation dielectric layers. The resistance paste is composed of conductive powder, glass bonding phase, additives and organic carriers, wherein the conductive powder is silver powder, At least one of palladium powder, ruthenium dioxide, and lead ruthenate; the glass bonding phase is lead borosilicate glass composite magnesium aluminum spinel. The present invention uses silver powder, palladium powder, ruthenium dioxide, and lead ruthenate as the conductive phase to ensure that the resistance slurry has good resistance and temperature coefficient at different resistance values. By using magnesium aluminum spinel and lead borosilicate glass powder to compound Materials, so that the resistance paste is used on the alumina ceramic substrate and the isolation dielectric layer, all of which have the characteristics of good resistance value consistency and small temperature coefficient, which can meet the use requirements of various thick film circuit products.

Description

technical field [0001] The invention relates to a resistance slurry, in particular to a thick-film resistance slurry which is applied on an alumina ceramic substrate and an isolation medium layer and has the characteristics of good resistance consistency and small temperature coefficient. Background technique [0002] Thick film resistor paste is a technology-intensive product integrating metallurgy, chemistry, materials, electronic technology, analysis and testing technology and other multi-disciplinary fields. In order to adapt to printing, sintering process requirements and practical application requirements, it must have printability, functional characteristics and process compatibility. The commonly used resistance paste is a kind of paste composed of functional phase, binder phase, additives and organic vehicle, mixed in a certain proportion. [0003] As one of the basic raw materials for the production of various thick film integrated circuits, thick film resistor pa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/14H01B1/16H01B1/20H01B1/22H01L27/01
CPCH01B1/14H01B1/16H01B1/20H01B1/22H01L27/013
Inventor 鹿宁党丽萍吴高鹏王妮王博张建益马倩
Owner 西安宏星电子浆料科技股份有限公司
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