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Metasurface antenna based on square semi-ring feed

A metasurface and feeding technology, applied in the direction of antennas, slot antennas, antenna grounding devices, etc., can solve the problems of low front-to-back ratio, achieve the effect of improving the front-to-back ratio, making up for the high profile, and wide impedance bandwidth

Inactive Publication Date: 2021-11-26
XIDIAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Thus, the present invention solves the problem of low front-to-back ratio of existing metasurface antennas under broadband conditions

Method used

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  • Metasurface antenna based on square semi-ring feed
  • Metasurface antenna based on square semi-ring feed
  • Metasurface antenna based on square semi-ring feed

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Embodiment Construction

[0018] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0019] refer to figure 1 , the present invention includes a dielectric substrate 1, a metal floor 2 printed on the lower surface of the dielectric substrate 1, a metasurface patch 3 printed on the upper surface of the dielectric substrate 1, a first metallized via hole 4, and a second metallized via hole 5.

[0020] The dielectric substrate 1 adopts a square dielectric substrate, and the overall structure of the metasurface antenna is all printed and integrated on the single-layer dielectric substrate 1. The plate used for the dielectric substrate 1 is F4BM-2, and its relative permittivity ε r It is 3.5, the loss tangent value is 0.001, and the floor 4 is kept as a whole without slits, and has the characteristics of single-layer structure, low profile and high front-to-back ratio. What is shown in the center of the dielectric substr...

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Abstract

The invention provides a metasurface antenna based on square semi-ring feed. The metasurface antenna comprises a dielectric substrate, a metal floor printed on the lower surface of the dielectric substrate and a metasurface patch printed on the upper surface of the dielectric substrate. The metasurface patch comprises a plurality of square metal patches which are periodically arranged, a spacing seam is etched in the center of the metasurface patch, a rectangular metal patch is printed in the spacing seam, and the rectangular metal patch is connected with the metal floor through a first metalized through hole. The rectangular metal patch is connected with an SMA inner conductor through a second metalized via hole penetrating through a preformed hole in the metal floor, and the second metalized via hole, the rectangular metal patch and the first metalized via hole which are sequentially connected form a square semi-ring structure, so that the defect of low front-to-back ratio caused by incomplete floor in the prior art is overcome, on the premise of using the single-layer metasurface structure, not only is the profile height of the antenna reduced, the impedance bandwidth of the antenna is further expanded, and the antenna better conforms to the miniaturization and integration trend of a current communication system.

Description

technical field [0001] The invention belongs to the technical field of antennas, and relates to a metasurface antenna, in particular to a metasurface antenna based on square half-ring feeding, which can be used in satellite communication and radar systems. Background technique [0002] In the past ten years, metasurfaces have been widely used in the field of microstrip antennas by virtue of their special electromagnetic characteristics and other advantages, which provide a strong guarantee for the improvement of the performance of microstrip antennas and greatly promote the progress of microstrip antennas. However, The limited bandwidth restricts its further development. Based on this situation, the existing metasurface antennas generally have the following two problems: First, in order to obtain a wider impedance bandwidth, most metasurface antennas will choose to use a multilayer dielectric substrate, that is, by increasing the overall thickness of the dielectric substrate...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q15/00H01Q1/38H01Q1/48H01Q1/50H01Q13/10
CPCH01Q15/0086H01Q1/38H01Q1/48H01Q1/50H01Q13/10
Inventor 焦永昌关云杰冯云霞邱永辉翁子彬张立赵钢吕乐玮翦章
Owner XIDIAN UNIV
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