Radio frequency circuit board and manufacturing method thereof

Abstract

The invention discloses a radio frequency circuit board and a manufacturing method thereof, relates to the technical field of wireless communication radio frequency modules, and aims to reduce the debugging period of the radio frequency module while solving the problem of impedance mismatch of an output port of the radio frequency module. The radio frequency circuit board comprises a radio frequency chip, a first transmission structure, a radio frequency module, a second transmission structure and a circuit board body. The radio frequency chip is arranged in the first area of the radio frequency module and electrically connected with the radio frequency module through the first transmission structure; and the first transmission structure transmits a radio frequency signal sent by the radio frequency chip to the radio frequency module, and the characteristic impedance of the radio frequency chip meets the target impedance range. The radio frequency module is arranged in the second area of the circuit board body and electrically connected with the circuit board body through the second transmission structure; and the second transmission structure transmits the radio frequency signal to the circuit board body, and the characteristic impedance of the radio frequency module meets the target impedance range. The radio frequency circuit board provided by the invention is used for a wireless communication radio frequency module technology.

Description

technical field [0001] The invention relates to the technical field of wireless communication radio frequency modules, in particular to a radio frequency circuit board and a method for manufacturing the radio frequency circuit board. Background technique [0002] With the development of the Internet of Things, the requirements for the more critical network communication performance and reliability of the Internet of Things devices are getting higher and higher. In IoT devices, the wireless performance of the product mainly depends on the performance of the hardware RF module. Therefore, it is particularly important to ensure the RF performance of the module. [0003] However, at present, the RF module is limited by factors such as the printed circuit board manufacturing process and reflow soldering, and the RF output port of the RF module has a problem of sudden impedance change. [0004] In the prior art, a matching circuit is added to the output port of the radio frequenc...

AI Technical Summary

Problems solved by technology

[0004] In the prior art, a matching circuit is added to the output port of the radio frequency module to solve the problem of sudden impedance change at the output port of the radio frequency module, but the matching circuit also needs to be adapted at the joint between the antenna button and the IPEX socket, which will cause the RF module to The link of the output port of the RF signal of the group does not match, and it will increase the debugging cycle of the RF module

Images