Chip packaging structure used for power converter

A multi-chip packaging and power converter technology, applied in the electronic field, can solve the problems of large area and poor heat dissipation performance, and achieve the effects of flexible system design, enhanced anti-interference performance, and shortened debugging cycle

Inactive Publication Date: 2014-11-26
SILERGY SEMICON TECH (HANGZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] In view of this, the object of the present invention is to provide a multi-chip packaging structure that can be used in power converters to solve the problems of large area and poor heat dissipation performance in the prior art.

Method used

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  • Chip packaging structure used for power converter
  • Chip packaging structure used for power converter
  • Chip packaging structure used for power converter

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Embodiment Construction

[0032] Several preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention is not limited to these embodiments. The present invention covers any alternatives, modifications, equivalent methods and schemes made on the spirit and scope of the present invention. In order to provide the public with a thorough understanding of the present invention, specific details are set forth in the following preferred embodiments of the present invention, but those skilled in the art can fully understand the present invention without the description of these details.

[0033] refer to figure 1 , shows a functional block diagram of an AC / DC step-down power converter 100 . In this embodiment, the AC / DC step-down power converter 100 includes a rectification circuit 101, a filter capacitor C in , a step-down power stage circuit and a controller 103 .

[0034] rectifier circuit 101 and filter capacitor C ...

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Abstract

The invention discloses a chip packaging structure used for a power converter, comprising a lead frame constituted by first type lead feet and second type lead feet, a power member wafer and a power diode wafer. In a multi-chip-packaging structure, better heat radiation performance can be obtained through directly placing a power member wafer and the power diode wafer on a big-area middle bonding pad between the first type lead foots and forming direct electric connection. Furthermore, wafers can form specific electric connection among the wafers in the packaging structure not outside the packaging structure, so that the capability of resisting interference is strong and the reliability and stability of the system are improved.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a physical layer packaging structure for a power converter. Background technique [0002] Power converters, such as DC-DC power converters or AC-DC power converters, are used to provide stable voltage or current sources for various electronic systems, such as low-voltage equipment (such as laptops, mobile phones, etc. ) battery management and LED load drive, etc. [0003] The switching regulator converts the input DC voltage into a high-frequency chopping voltage, and then filters the high-frequency output voltage to convert it into a DC output voltage or a DC output current. Specifically, a switching regulator includes a power device that is alternately connected and disconnected from an input voltage to supply power to a load. An energy storage element that stores and releases energy. A power diode is used to discharge the energy stored in the energy storage element to t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495H01L25/18H01L25/00
CPCH01L2924/1305H01L2924/13091H01L2924/19107H01L2224/48137H01L2224/48247H01L2224/49111H01L2924/00
Inventor 徐孝如叶佳明黄秋凯
Owner SILERGY SEMICON TECH (HANGZHOU) CO LTD
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