Chip packaging structure used for power converter
A multi-chip packaging and power converter technology, applied in the electronic field, can solve the problems of large area and poor heat dissipation performance, and achieve the effects of flexible system design, enhanced anti-interference performance, and shortened debugging cycle
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[0032] Several preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention is not limited to these embodiments. The present invention covers any alternatives, modifications, equivalent methods and schemes made on the spirit and scope of the present invention. In order to provide the public with a thorough understanding of the present invention, specific details are set forth in the following preferred embodiments of the present invention, but those skilled in the art can fully understand the present invention without the description of these details.
[0033] refer to figure 1 , shows a functional block diagram of an AC / DC step-down power converter 100 . In this embodiment, the AC / DC step-down power converter 100 includes a rectification circuit 101, a filter capacitor C in , a step-down power stage circuit and a controller 103 .
[0034] rectifier circuit 101 and filter capacitor C ...
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