37results about How to "Avoid Impedance Mismatches" patented technology

Apparatus and method to detect corrosion in metal junctions. Corroded metal junctions are usually discovered by visual inspection. The present invention detects corrosion in metal junctions when it is not visually apparent. A corroded metal junction acts as a nonlinear device. It generates harmonics and other nonlinear products (such as intermodulation) of any signals applied to the junction. The presence of relatively high level harmonics and / or intermodulation products indicates directly that corrosion has occurred. To detect corrosion in a metal junction, one couples a fundamental frequency signal (f0) into the junction and tests for harmonics of that frequency, especially the third harmonic. Harmonic frequency signals that are relatively large (i.e., above the harmonics generated by the testing system) indicate the presence of corrosion. Measurements to determine if a metal junction is corroded are performed without disturbing the junction.

Disclosed are an apparatus and method for testing performance of a mobile station having a global positioning system (GPS) mounted therein. The method provides for virtually changing parameters requited for a registration at a base station so that the mobile station excludes the registration and directly enters a test state with an idle mode, and testing the performance of the mobile station in the idle mode test state. Accordingly, no re-boot is necessary to register with the base station upon completion of the test.

The invention discloses a low-temperature reading method of a superconducting nanowire single-photon detector. The method involves a high input impedance amplification circuit at low temperature, a device base and a bias plate, wherein the high input impedance amplification circuit enters a room temperature environment through a coaxial line; the superconducting nanowire single-photon detector atlow temperature is connected with the bias plate through a bonding line; the bias plate is connected to a current source in the room temperature environment through a pin header and a direct current line; the superconducting nanowire single-photon detector is placed on the device base; and an output end of the superconducting nanowire single-photon detector is connected to an input end of the highinput impedance amplification circuit through the bonding line. The method solves the problems of weak detection signals of the superconducting nanowire single-photon detector, impedance mismatch andenergy loss caused by the traditional 50 omega room temperature reading method, effectively improves the pulse amplitude and the signal-to-noise ratio of output signals of the device, and particularly realizes photon number resolution for a serial SNSPD device.

The invention discloses a method for testing dynamic indentation of a material. The method is characterized by comprising the following steps of: fixedly arranging a tested piece on the end face of one end, which faces a transmission bar, of an incident bar, and fixedly arranging a tested piece on the end face of one end, which faces the incident bar, of the transmission bar; sticking a first strain gauge to the incident bar; sticking a second strain gauge to the transmission bar; electrically connecting the first strain gauge and the second strain gauge with an ultra-dynamic strain indicator respectively; striking the incident bar by using a striking bar to ensure that the two test pieces and a stress ball extrude one other to form indentations; and processing the indentations to obtain a time travel curve of press-in force and press-in displacement of the tested pieces. The method has the advantages that the dynamic mechanical performances of the material are measured by using an experimental method, the phenomenon of impedance mismatch of the connecting part of a pressure head and a pressure bar in the prior art is avoided, and the problem that part of the connecting part of the incident bar and the pressure bar generates plastic deformation during dynamic loading in the prior art is solved, so that the measurement accuracy of the method is high, and the maximum indenting velocity can be higher than 30 m / s.

The invention belongs to the technical field of ultrasonic cleaning, in particular to a double-tank ultrasonic cleaner based on a bidirectional ultrasonic radiation recombination transducer. The double-tank ultrasonic cleaner comprises a bidirectional radiation transducer, wherein a front radiation surface and a rear radiation surface of the bidirectional radiation transducer are bonded with a first cleaning tank and a second cleaning tank respectively, and the bidirectional radiation transducer comprises piezoelectric chips, front metal tapered radiation blocks and rear metal tapered radiation blocks. By changing the front and rear metal radiation materials of the bidirectional radiation transducer, different sound radiation power can be generated in the two cleaning tanks of ultrasonic cleaner; by changing the geometric shapes of the front and rear metal radiation materials of the bidirectional radiation transducer, ultrasonic radiation of different strength can be generated; and with the additional design of the bidirectional radiation transducer, the problems of ultrasonic reflection and impedance mismatching are solved, and the radiation efficiency and power of the bidirectional radiation transducer are improved and increased greatly. The double-tank ultrasonic cleaner has the advantages of low energy dissipation, and high radiation power and radiation efficiency, and deserves to be popularized and applied.

A chip package having at least a substrate, a chip and a conductive trace is provided. The substrate has a first surface, a second surface, a cavity and at least one substrate contact all positioned on the first surface of the substrate. The chip has an active surface with at least one chip contact thereon. The chip is accommodated inside the cavity with at least one sidewall having contact with one of the sidewalls of the cavity. The active surface of the chip and the first surface of the substrate are coplanar. The conductive trace runs from the active surface of the chip to the first surface of the substrate so that the chip contact and the substrate contact are electrically connected.

The invention relates to a combined through-hole construction of printed circuit board, which can be applied to a first, and a second signal line, and a printed circuit board of multi-substrate. The combined through-hole construction includes a first and a second through-hole corresponding to the first and the second signal lines through the multi-substrate spaced by a predetermined distance, and a insulation region corresponding to rim of the first through-hole and the second through-hole. The insulation region includes at least a region extending a first safe distance from the outer edge of the first through-hole, a region extending a second safe distance from the outer edge of the second through-hole, and a region between the first through-hole and the second through-hole. Therefore, unmatched resistance and electromagnetic interference caused by wiring between the first and the second through-holes in prior art is avoided by the insulation region.

A display panel includes a pixel array substrate, a counter substrate, and a display medium. The pixel array substrate includes a substrate, a plurality of scan lines, a plurality of data lines, a plurality of pixel units and a gate driving circuit. The gate driving circuit is disposed in the peripheral region of the substrate and includes a plurality of first signal lines, a plurality of second signal lines, a plurality of pseudo signal lines, and a plurality of contact structures. Each of the second signal lines is electrically connected to a corresponding one of the first signal lines. Eachof the pseudo signal lines is electrically connected to a corresponding one of the second signal lines. Each of the first signal lines is electrically connected to the corresponding second signal line via a corresponding one of the contact structures. Each of the pseudo signal lines is electrically connected to the corresponding second signal line via a corresponding one of the contact structures.

A semiconductor device includes a semiconductor substrate having an electrode formed above a surface thereof; a first insulating resin layer that is provided over the semiconductor substrate and has a first opening defined at a position corresponding to the electrode; a first wiring layer that is provided on the first insulating resin layer and is connected to the electrode through the first opening; a second insulating resin layer provided over the first insulating resin layer and the first wiring layer, the second insulating resin layer having a second opening that is defined at a position different from the position of the first opening in a direction of the surface of the semiconductor substrate; and a second wiring layer that is provided on the second insulating resin layer and is connected to the first wiring layer through the second opening, wherein the second wiring layer includes an induction element, and a sum of a thickness of the first insulating resin layer and a thickness of the second insulating resin layer is not less than 5 mum and not more than 60 mum.

The invention provides a power division and combination device, a feed network and an electrically tunable antenna. The power dividing combiner comprises a power division circuit and a combination circuit, wherein the power division circuit comprises a power division circuit main body and a plurality of power division circuit branches, the power division circuit main body comprises two ends, and each power division circuit branch is connected with the first end of the power division circuit main body; the combination circuit comprises two combination circuit branches, and each combination circuit branch is connected with the second end of the power division circuit main body; the two combination circuit branches are respectively corresponding to different frequency bands; and each combination circuit branch is formed by connecting a plurality of microstrip lines with different widths. According to the power division and combination device, the feed network and the electrically tunable antenna provided by the invention, when the signal is transmitted through the branch circuits of the combination circuit, impedance matching is performed on the signal and each microstrip line in the branch circuit of the combination circuit, and the impedance of the power division and combination device is kept within the deviation range of standard impedance, so that the phenomenon of impedance mismatching can be avoided, the fluctuation of the standing-wave ratio in the branch circuits of the combination circuit can be reduced, and the stability of signal transmission can be improved.

A chip package having at least a substrate, a chip and a conductive trace is provided. The substrate has a first surface, a second surface, a cavity and at least one substrate contact all positioned on the first surface of the substrate. The chip has an active surface with at least one chip contact thereon. The chip is accommodated inside the cavity with at least one sidewall having contact with one of the sidewalls of the cavity. The active surface of the chip and the first surface of the substrate are coplanar. The conductive trace runs from the active surface of the chip to the first surface of the substrate so that the chip contact and the substrate contact are electrically connected.

A semiconductor package substrate including a substrate body having a front surface configured for mounting a semiconductor chip on the front surface and a rear surface facing the front surface and comprising a window passing through the front and rear surfaces, the window having one or more surfaces inclined from the front surface toward the rear surface; and a conductive pattern arranged along an inclined surface of the window so as to extend from the front surface to the rear surface of the substrate body.

The invention discloses a radio frequency circuit board and a manufacturing method of the radio frequency circuit board, and relates to the technical field of radio frequency modules for wireless communication, so as to reduce the debugging cycle of the radio frequency module when solving the impedance mismatch problem of the output port of the radio frequency module. The radio frequency circuit board includes: a radio frequency chip, a first transmission structure, a radio frequency module, a second transmission structure and a circuit board body. The radio frequency chip is arranged in the first area of ​​the radio frequency module, and is electrically connected with the radio frequency module through the first transmission structure. The first transmission structure transmits the radio frequency signal sent by the radio frequency chip to the radio frequency module, and its characteristic impedance meets the target impedance range. The radio frequency module is arranged in the second area of ​​the circuit board body, and is electrically connected with the circuit board body through the second transmission structure. The second transmission structure transmits the radio frequency signal to the circuit board body, and its characteristic impedance meets the target impedance range. The radio frequency circuit board provided by the invention is used for radio frequency module technology of wireless communication.

An inner conductor terminal (10) is made of a metal plate and includes tubular first terminal portion (11) and second terminal portion (12) each having an opening end. A bent portion (15) links the first and second terminal portions (11, 12) and covers the respective opening ends of the first and second terminal portions (11, 12) by facing the openings. A tab (13) projects from an end of the first terminal portion (11) opposite to the opening end, and a lead (14) projects from an end part of the second terminal portion (12) opposite from the opening end. The inner conductor terminal (10) includes two side panels (16) projecting from the second terminal portion (12) to be located at both sides of the bent portion (15) and covering a clearance between the bent portion (15), the first terminal portion (11) and the second terminal portion (12) from both sides.

A driving circuit used in a transmission line includes an operational amplifier and an output circuit. The operational amplifier is used for receiving a voltage signal to generate an output. The output circuit is coupled to the operational amplifier and used for receiving the output of the operational amplifier and determining current(s) passing through the output circuit to generate an output signal of the driving signal so as to adjust the output impedance of the driving circuit to match the transmission line; the output impedance of driving circuit is adjustable and determined by the current(s) passing through the output circuit.

The present invention provides a borehole ultrasonic piezoelectric transducer and a borehole ultrasonic logging instrument, wherein the borehole ultrasonic piezoelectric transducer includes a casing, and the casing is provided with a positive electrical connector and a negative electrical connector; The piezoelectric composite sheet arranged in the housing, the two ends of the piezoelectric composite sheet are respectively provided with a metal positive electrode and a metal negative electrode, the metal positive electrode is connected to the positive electrical connector, and the metal negative electrode Connect the negative electrode connector; the matching layer group arranged on the metal positive electrode side of the piezoelectric composite sheet; the backing damping block arranged on the metal negative electrode side of the piezoelectric composite sheet, the back The lining damping block absorbs the ultrasonic energy radiated backward by the piezoelectric composite sheet. The borehole ultrasonic logging tool includes the borehole ultrasonic piezoelectric transducer. The invention reduces the acoustic impedance of the vibrating chip by the piezoelectric composite material, and solves the impedance mismatch between the downhole transducer and the propagation medium with a multi-layer matching layer structure.

The invention relates to a seal structure of chip of bridging-typed and its manufacture method, at last including a substrate, a chip and at least a conductor; the substrate has a first surface and its corresponding second surface, a depressed section and at least a contact of substrate, whose contact is on the first surface of substrate. The chip has a active surface and at least a contact of substrate which is on the active surface of chip. The chip is in the depressed section of substrate, whose at least one sidewall is near the depressed section, the active surface of chip and the first plane of substrate are installed for the public plane. Conductor is extending on the active surface of chip and the first plane on substrate, linking the contact of chip to that of substrate. The invention can shorten the distance between chip and substrate, increasing the electrical property efficiency of chip structure, which is more suitable for practical use and has use value in industry.

According to embodiments of the present invention, an image display apparatus comprises: a display panel including a panel substrate, and an electrode structure and an insulating structure stacked onthe panel substrate; a touch sensing structure disposed on the display panel; and an antenna electrode layer disposed on the display panel at the same level as the sensing structure and at least partially overlapping the electrode structure of the display panel in a thickness direction. Therefore, a thin and highly reliable image display apparatus can be implemented by disposing the antenna electrode layer in consideration of electrode structures of the display panel and the touch sensing structure.

The invention discloses a radio frequency circuit board and a manufacturing method thereof, relates to the technical field of wireless communication radio frequency modules, and aims to reduce the debugging period of the radio frequency module while solving the problem of impedance mismatch of an output port of the radio frequency module. The radio frequency circuit board comprises a radio frequency chip, a first transmission structure, a radio frequency module, a second transmission structure and a circuit board body. The radio frequency chip is arranged in the first area of the radio frequency module and electrically connected with the radio frequency module through the first transmission structure; and the first transmission structure transmits a radio frequency signal sent by the radio frequency chip to the radio frequency module, and the characteristic impedance of the radio frequency chip meets the target impedance range. The radio frequency module is arranged in the second area of the circuit board body and electrically connected with the circuit board body through the second transmission structure; and the second transmission structure transmits the radio frequency signal to the circuit board body, and the characteristic impedance of the radio frequency module meets the target impedance range. The radio frequency circuit board provided by the invention is used for a wireless communication radio frequency module technology.

The invention discloses a dielectric resonator antenna module and a communication terminal. The dielectric resonator antenna module comprises a dielectric resonator, a plastic clamp and a PCB. The plastic clamp is used for clamping the dielectric resonator, and the dielectric resonator penetrates through the plastic clamp; the plastic clamp is fixed on one side of the PCB; one side of the PCB is completely attached to one side of the dielectric resonator; and according to the antenna module, the clamp is introduced, and the dielectric resonator is fixed on the PCB through the clamp, so that the dielectric resonator and the PCB are completely attached; the mode is different from an existing integration mode of the dielectric resonator and the PCB, and gaps caused by uncontrollable factors such as glue or welding tin materials between the dielectric resonator and the PCB are avoided, so that impedance mismatch can be prevented and the reliability of the antenna can be improved in a millimeter wave frequency band, and meanwhile, the clamp is made of a plastic material and can also expand the bandwidth of the antenna.

The invention discloses an electro optical phase modulator with a frequency state feedback function. The modulator comprises a power extraction unit, a power detection unit, a feedback signal generation unit and an electro optical phase modulation crystal, wherein the electro optical phase modulation crystal modulates the phase of an input light beam; the power extraction unit extracts a power signal and a drive signal in the drive signal output from a modulation signal source and the power signal of an interference signal of a reflection signal obtained by reflecting the drive signal through the electro optical phase modulation crystal; the power detection unit converts the power signal into an electric signal; the feedback signal generation unit generates feedback information according to the electric signal and feeds the feedback information back to the modulation signal source; and the modulation signal source regulates the drive signal according to a feedback signal so as to keep the frequency value of the drive signal close to the resonance frequency of the phase modulator.

The invention discloses a low-power multi-load wireless powered adaptive DC voltage stabilizing system which comprises an adjustable high-frequency power supply system, an energy emission main resonator, a wireless power supply coil array, an adjustable high-frequency compensation capacitor, a multi-energy conversion type DC stabilizing system, a voltage acquisition feedback module and a multi-load array, wherein the multi-energy conversion type DC stabilizing system supplies energy to the load through an energy conversion mode of electromagnetic energy-magnetic potential energy-mechanical energy-electric energy. The low-power multi-load wireless powered adaptive DC voltage stabilizing system solves the problems that a low-power load node is unstable in power supply voltage and is limited in the power supply mode, particularly solves the problems that the sensor node or implantable equipment of human body and the like under an Internet of things system are difficult in power supply and troublesome in battery replacement; the system is stable in power supply performance, has no characteristics of virtual-high voltage turn-off and over-current conduction in a conventional rectification and voltage-stabilizing system, and is high in anti-interference ability.

The present invention provides a coaxial connector that realizes a high frequency signal flowing through a contact in a high frequency band. A coaxial connector includes a three-point contact, a housing including a first and a second connection base, and a shell including a cylindrical portion accommodating the first connection base and an extension portion covering one opening of the cylindrical portion with a bottom plate piece and accommodating the second connection base. The bottom plate piece includes an inclined surface having a higher side on the base end portion of the metal plate and a lower side on the tip end side of the metal plate. The distance between the metal plate of the contact and the bottom surface of the shell which are isolated by an insulating material of the housing is configured to become identical between the tip end side and the base end side of the contact.