Air switch mounting plate cooling structure using siphon

A cooling structure and mounting board technology, applied in the direction of electric switches, protection switches, emergency protection devices, etc., can solve the problems of inability to disperse and cool, the air switch is easily disturbed by temperature, and the power distribution cabinet cannot be short-circuited, etc., to achieve improved cooling The effect of efficiency and quality

Pending Publication Date: 2022-05-03
王春霞
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to provide a cooling structure of air switch mounting plate using siphon, to solve the problem that the mounting plate on the side of the air switch proposed in the above background technology cannot disperse and cool the heat generated by the air switch when it is installed. As a result, the air switch is susceptible to temperature interference during use and cannot operate normally, which makes it unable to better protect electronic components such as short circuits, severe overloads, and undervoltages inside the power distribution cabinet.

Method used

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  • Air switch mounting plate cooling structure using siphon
  • Air switch mounting plate cooling structure using siphon
  • Air switch mounting plate cooling structure using siphon

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Embodiment 1

[0026] as attached figure 1 to attach Image 6 Shown: a cooling structure of the air-opening mounting plate using siphon, the cooling structure of the air-opening mounting plate using siphon includes a power distribution cabinet 1, a cooling box 2, a circulating cooling mechanism is arranged inside the cooling box 2, and the side of the power distribution cabinet 1 A resistance pressurization mechanism is provided, and a mounting plate 102 is provided on one side of the power distribution cabinet 1 , and an air switch 101 is fixedly installed on one side of the mounting plate 102 .

[0027] as attached figure 1 , 5 As shown: the circulating cooling mechanism includes a water storage tank A201, a semiconductor refrigeration chip 2011, a water storage tank B202, a U-shaped pipe 203, a water pump 3, a catheter 301, a hollow shell 302 and a gear A303, and one side of the cooling box 2 is fixedly installed with Water storage tank A201, the semiconductor cooling chip 2011 is fixe...

Embodiment 2

[0035] as attached figure 1 , 2 . As shown in 3: the inside of the water storage tank B202 is provided with a chute A4.

[0036] The present invention also includes a uniform flow water outlet mechanism, which is arranged inside the chute A4, and the uniform flow water outlet mechanism includes a slider A401, a rack 402, a floating ball 403, a spherical valve 5, a connecting rod 501, and a gear B502 , the sliding block A401 is installed inside the chute A4, the rack 402 is fixedly installed above the slider A401, the floating ball 403 is fixedly installed on the side of the slider A401, and the spherical valve 5 is embedded under the U-shaped pipe 203, and the spherical valve 5 is a A connecting rod 501 is fixedly installed on one side of the connecting rod 501, and a gear B502 is fixedly installed on one side of the connecting rod 501, and the gear B502 and the rack 402 are engaged. , the water pump 3 pumps out the cooling water, so that the floating ball 403 loses its buoy...

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Abstract

The invention provides an air switch mounting plate cooling structure utilizing siphoning, which comprises a power distribution cabinet and a cooling box, a circulating cooling mechanism is arranged in the cooling box, a resistor pressurizing mechanism is arranged on the side surface of the power distribution cabinet, a mounting plate is arranged on one side in the power distribution cabinet in a matched manner, and an air switch is fixedly mounted on one side of the mounting plate. The circulating cooling mechanism comprises a water storage tank A, a semiconductor chilling plate, a water suction pump, a liquid guide pipe, a hollow shell and a gear A. The water storage tank A is fixedly installed on one side in the cooling tank, the semiconductor chilling plate is fixedly installed on the lower portion in the water storage tank A, a water storage tank B is fixedly installed on the other side in the cooling tank, and the water storage tank A is higher than the water storage tank B; and a U-shaped pipe is fixedly mounted between the water storage tank A and the water storage tank B. Cooling water can be circularly cooled by using a siphon principle, so that the cooling efficiency and quality of the cooling water on the mounting plate and the air switch are improved, the air switch is prevented from being broken due to high temperature during use, and the cooling efficiency is improved.

Description

technical field [0001] The invention relates to the field of temperature reduction of the installation board, in particular to an air-opening installation board cooling structure utilizing siphon. Background technique [0002] The air switch is a switch that will automatically disconnect as long as the current in the circuit exceeds the rated current. The air switch is a very important electrical appliance in the low-voltage power distribution network and electric drive system. It integrates control and multiple protection functions. In addition to completing the contact and breaking of the circuit, it can also protect the short circuit, severe overload and undervoltage of the circuit or electrical equipment, and can also be used to start the motor infrequently; [0003] The mounting plate of the air switch is a fixed device for supporting the air switch. When the heat generated by the air switch cannot be dissipated through the mounting plate, an open circuit will occur. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01H71/02H01H9/52H02B1/56H02B1/30H02B1/32
CPCH01H71/02H01H9/52H02B1/565H02B1/306H02B1/32
Inventor 王春霞
Owner 王春霞
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