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Cathode plate

A cathode plate and cathode technology, applied in the direction of electrodes, photographic technology, instruments, etc., can solve the problem of peeling off the deposited metal or dividing it into two basically identical plates, etc.

Inactive Publication Date: 2006-07-12
COPPER REFINERIES PTY LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, applicants have found that even with the grooves 15, the deposited metal may not peel cleanly from the cathode plate or separate into two substantially identical plates 20, 30

Method used

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Embodiment Construction

[0035]1A-2D and FIG. 3 are related to the background art and have been discussed above.

[0036] Applicants have found that a groove can be provided in the lower end of the motherboard so that a line of weakness is formed in the groove, thereby enabling reliable splitting of the deposited metal cladding into two substantially identical and preferably symmetrical sheets.

[0037] refer to Figure 4 , which represents the cathode motherboard 100, which has a V-shaped groove 150 along the lower edge of the cathode motherboard. For brevity, Figure 4 The arc of the groove 150 shown in FIG. 1 is 90 degrees, however, it can be understood from the foregoing that the groove is not limited to a V shape, and the arc of the groove does not necessarily have to be equal to 90 degrees.

[0038] V-groove 150 is shaped and sized to serve several functions. Its main function is to separate the deposited metal cladding 120 from the mother substrate 100 into two substantially identical plates 1...

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Abstract

A method of electro-depositing an envelope of metal on a cathode. The metal envelope (120) comprises metal sheets (122, 124) on either side of the cathode plate (100). A groove (150) is provided along one edge of the cathode plate whereby metal deposited on and adjacent to said groove forms a frangible portion (140). The groove is shaped such that a line of weakness (A) is formed in the metal deposited within the groove such that separation of the two sheets of deposited metal is initiated along the line of weakness.

Description

technical field [0001] The invention relates to a cathode plate for electrodepositing metals. Background technique [0002] There are various methods and apparatuses for electrorefining or electrowinning. [0003] A particularly successful method of electrodepositing copper is, for example, the so-called ISA process (PROCESS), in which copper is deposited on a stainless steel cathode mother plate. The electrolytically deposited copper is then stripped from the cathode plate by bending the cathode plate to separate at least a portion of the deposited copper from the cathode plate, and then using wedge stripping to separate the remaining copper from the cathode plate by gasblasting. The cathode plate is separated. [0004] In the ISA process, the bottom edge of the cathode motherboard is usually covered with a release compound like wax or a plastic edge strip to prevent copper from depositing on it. This helps to strip the electrodeposited copper from both sides of the cath...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25C7/08C25C7/02C25C1/12
CPCC25C7/02C25C7/08
Inventor 戴维·贝利雷维尔·韦恩·阿姆斯特朗
Owner COPPER REFINERIES PTY LTD