Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

System and method for inter connecting SP14 equipment and PCI Express equipment

A device and conversion unit technology, applied in the network field, can solve problems such as the interconnection of SPI4 interface and PCIExpress interface, and achieve the effects of avoiding mutual interference and reducing design difficulty and cost

Inactive Publication Date: 2006-09-13
NEW H3C TECH CO LTD
View PDF0 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in some design occasions, due to specific considerations, we also need to interconnect SPI4 devices with PCI Express devices, especially to achieve high-speed data transmission and reception between the two devices. However, since the SPI4 interface only involves the physical layer And the content of the data link layer, and the PCI Express interface has one more processing layer protocol than the SPI4 interface, so so far, there is no technical solution that can solve the problem of the interconnection between the SPI4 interface and the PCI Express interface

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • System and method for inter connecting SP14 equipment and PCI Express equipment
  • System and method for inter connecting SP14 equipment and PCI Express equipment
  • System and method for inter connecting SP14 equipment and PCI Express equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] Hereinafter, we will describe the preferred embodiments of the present invention in detail with reference to the accompanying drawings. First of all, it should be pointed out that the meanings of the terms, words and claims used in the present invention cannot be understood only by their literal and ordinary meanings, but also include meanings and concepts that are consistent with the technology of the present invention. This is because We, as inventors, give appropriate definitions of terms in order to best describe our invention. Therefore, the configurations given in this description and the drawings are only preferred embodiments of the present invention, and are not intended to enumerate all the technical characteristics of the present invention. We need to recognize that there are a wide variety of equivalents or modifications that can replace ours.

[0033] First, with reference to FIG. 1 , the first embodiment of the present invention will be introduced.

[00...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

This invention discloses a system for realizing interconnection between devices of SP14 and PCI Express including: devices SP14 and PCI Express and converting unit between them used in analyzing the received data to be converted to the process layer content of them and sent to the devices of SP14 or PCI, said system also includes an interruption unit and a CPU interface unit, in which, the conversion unit can analyze the data sent by them and convert the format so that the converted format is in conformity with that of them so as to solve the interconnection between them. A method for realizing the inter-connection between devices of them is provided.

Description

technical field [0001] The invention relates to network technology, in particular to the realization technology of interconnection between a fourth-level system packet-level interface (SPI4) and a peripheral component expansion interface (PCI Express). Background technique [0002] With the development of network technology, the application of high-speed signal transmission in network design is becoming more and more common. One of the currently used high-speed signal transmission interfaces is SPI4. [0003] SPI4 is a data packet or cell transfer interface between physical layer devices and link layer devices, which can support data transfer rates up to 16Gb / s. [0004] PCI Express is also a chip interconnect technology. As an interconnection bus of point-to-point serial architecture, it greatly improves the performance of bus interconnection and reduces the cost of the system. [0005] However, there are also big differences between the above two interconnection technolo...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H04L29/08H04L29/06
Inventor 肖亮陈科瞿凯朱根俊郭峰解叶军王书剑
Owner NEW H3C TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products