Electronic assembly mounting device
A technology for electronic component installation and electronic components, applied in the direction of electrical components, electrical components, etc., can solve problems such as poor reliability, expensive devices, errors, etc., and achieve the effect of reliable suction nozzle blocking and low price
Inactive Publication Date: 2010-09-08
JUKI CORP
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Problems solved by technology
[0009] However, the device in Patent Document 1 requires processing time in order to obtain two-dimensional image information, and the price of the device is relatively expensive.
[0010] The devices in Patent Documents 2 and 3 only use the flow sensor to detect whether the electronic component is adsorbed or whether the adsorption state is good or bad, so there is a problem of poor reliability when the increase or decrease of the detected flow rate is small, etc.
In addition, there is a problem that it is not possible to reliably detect the suction error of the part standing sideways or obliquely.
Method used
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no. 1 approach
[0040] The electronic component mounting apparatus is provided with a pair of conveyance lanes 2 in the X direction of the central part of the base 1 . The conveyance lane 2 conveys the substrate 3 for mounting electronic components in the X direction. In addition, a substrate holding portion (not shown) is provided at the upper end portion of the transport path 2 . This substrate holding unit is a device that holds and positions the conveyed substrate 3 at a predetermined position.
[0041] Supply units 4 for electronic components are arranged on both sides of the transport path 2 . A plurality of tape feeders 5 are arranged in parallel on each supply unit 4 . The tape feeder 5 supports the tape containing the electronic components, and feeds the tape step by step to supply the electronic components.
[0042] A pair of Y-axis frames 8 are provided in the Y direction at both ends of the upper surface of the base 1 . Both ends of the X-axis frame 6 are supported by the pair...
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The present invention provides an electronic component mounting apparatus with which erroneous adsorption of an electronic component is detected reliably with an inexpensive apparatus.The electronic component mounting apparatus is provided with an optical sensor (19) provided at a mounting head and consisting of a projector and a light receiver, a flow rate sensor(16) arranged at an air suction path connecting a suction nozzle with a vacuum generator, and a control means for making control for mounting the electronic component adsorbed by the suction nozzle on a substrate. The control means is provided with a process of obtaining height data of the sucked electronic component by the optical sensor, a process of measuring an air flow rate by the flow rate sensor(16), a comparing process ofcomparing measured values of them with a set value set in advance, and a judgment process of judging the presence / absence of suction of the electronic part based on the comparing process and judging propriety of an suction posture.
Description
technical field [0001] The invention relates to an electronic component mounting device, which absorbs electronic components and mounts them on a substrate through a suction nozzle provided on a mounting head, and particularly relates to an electronic component mounting device capable of detecting adsorption errors of electronic components. Background technique [0002] In the past, Japanese Patent No. 3038905 (Patent Document 1), Japanese Patent No. 3269041 (Patent Document 2), and Japanese Patent Laid-Open No. 2003-133791 ( Patent Document 3). [0003] The electronic component mounting apparatus in Patent Document 1 has a one-dimensional optical sensor including a plurality of scanning lines, the one-dimensional sensor is arranged in a vertical direction, and a light projecting unit and a light receiving unit are opposed to each other. In addition, the electronic component mounting apparatus moves the attracted electronic component across the scanning line of the one-dime...
Claims
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IPC IPC(8): H05K13/04H05K13/08
Inventor 八幡直幸齐藤胜安西洋
Owner JUKI CORP