Electronic assembly mounting device
An electronic component installation and electronic component technology, which is applied to electrical components, electrical components, etc., can solve the problems of high device price, poor reliability, and inability to reliably detect adsorption, etc., and achieve the effect of low price and reliable adsorption nozzle blocking.
Inactive Publication Date: 2006-10-18
JUKI CORP
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Problems solved by technology
[0009] However, the device in Patent Document 1 requires processing time in order to obtain two-dimensional image information, and the price of the device is relatively expensive.
[0010] The devices in Patent Documents 2 and 3 only use the flow sensor to detect whether the electronic component is adsorbed or whether the adsorption state is good or bad, so there is a problem of poor reliability when the increase or decrease of the detected flow rate is small, etc.
In addition, there is a problem that it is not possible to reliably detect the suction error of the part standing sideways or obliquely.
Method used
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no. 1 approach
[0039] The electronic component mounting apparatus is provided with a pair of conveyance lanes 2 in the X direction of the central part of the base 1 . The conveyance lane 2 conveys the substrate 3 for mounting electronic components in the X direction. In addition, a substrate holding portion (not shown) is provided at the upper end portion of the transport path 2 . This substrate holding unit is a device that holds and positions the conveyed substrate 3 at a predetermined position.
[0040] Supply units 4 for electronic components are arranged on both sides of the transport path 2 . A plurality of tape feeders 5 are arranged in parallel on each supply unit 4 . The tape feeder 5 supports the tape containing the electronic components, and feeds the tape step by step to supply the electronic components.
[0041] A pair of Y-axis frames 8 are provided in the Y direction at both ends of the upper surface of the base 1 . Both ends of the X-axis frame 6 are supported by the pair...
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It is an object of the present invention to provide an electronic component mounting apparatus capable of reliably detecting a suction error of an electronic component with an inexpensive device. The electronic component mounting device includes: an optical sensor (19), which is arranged on the mounting head and is composed of a light projecting part and a light receiving part; a flow sensor (16), which is arranged in the air suction channel connecting the suction nozzle and the vacuum generating device Among them: a control unit, which performs the control of installing the electronic components adsorbed by the above-mentioned suction nozzle on the substrate, the control unit includes: the process of obtaining the height data of the electronic components adsorbed by the optical sensor (19); through the above-mentioned flow sensor (16 ) a process of measuring the air flow rate; a comparison process of comparing the measured value with a preset value; and a determination process, which determines whether the electronic component is adsorbed and whether the adsorption posture is good or not according to the comparison process.
Description
technical field [0001] The invention relates to an electronic component mounting device, which absorbs electronic components and mounts them on a substrate through a suction nozzle provided on a mounting head, and particularly relates to an electronic component mounting device capable of detecting adsorption errors of electronic components. Background technique [0002] In the past, Japanese Patent No. 3038905 (Patent Document 1), Japanese Patent No. 3269041 (Patent Document 2), and Japanese Patent Laid-Open No. 2003-133791 ( Patent Document 3). [0003] The electronic component mounting apparatus in Patent Document 1 has a one-dimensional optical sensor including a plurality of scanning lines, the one-dimensional sensor is arranged in a vertical direction, and a light projecting unit and a light receiving unit are opposed to each other. In addition, the electronic component mounting apparatus moves the attracted electronic component across the scanning line of the one-dime...
Claims
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IPC IPC(8): H05K13/04H05K13/08
Inventor 八幡直幸齐藤胜安西洋
Owner JUKI CORP