Component sealing system

Abstract

Method for the removable sealing of a component housing, and apparatus to practice the method using an elastic or conformable sealing band. The present invention teaches a sealing band, preferably elastic, to apply a horizontal seal to the horizontal seam defined by vertically assembled component case elements. The seal is maintained in position over the seam by an alignment element disposed on at least one of the seal and the case. The sealing band is rendered electrically conductive by admixing therewith a conductive material, or by plating thereon a conductive coating. A retaining element may be further added to at least one of the sealing band and the case to minimize tampering with the sealing band once installed.

Description

[0001] The present invention relates to a methodology for removably sealing housing elements utilizing an elastic seal element. More particularly, the present invention teaches a removable elastic casing methodology applicable to precision electronic component cases and the apparatus to perform the methodology.[0002] In many engineering disciplines, one or more housing or case elements are mechanically conjoined to form a chamber wherein the functional components of a device are housed. It is often the case that one or more of the housing elements is itself a functional component of a device. One such example is the housing elements of a computer head disc assembly (HDA). Typically, in most current production HDAs, at least one of the case elements also serves as a mounting frame for mounting at least some of the HDA functional components thereto.[0003] It is often desirable that the housing elements, when mechanically conjoined, provide not only a stable mechanical, electrical, hyd...

AI Technical Summary

Benefits of technology

The elastic sealing band method reduces the number of mechanical fasteners required, minimizes component damage, eliminates residue and out-gassing, and effectively seals and unseals HDAs while maintaining low EMI levels, facilitating easy alignment and secure sealing.

Problems solved by technology

EMI can be a significant problem in computer head disc assemblies in that excess levels of EMI can serve to apply an unwanted- signal or noise to interior components of the HDA.

Such noise can interfere with the proper read / write functionality of the HDA.

The case sealing methodology previously outlined presents several problems during the manufacture of HDAs.

A second problem is that during the manufacturing process of HDAs, it is occasionally necessary to rework an HDA being built.

As the number of screws required to mechanically connect the case elements increases, so increases both the amount of time required to assemble and disassemble the drive, as well as the likelihood that the assembly or disassembly process will damage the screw threads of either the screw itself or of the case elements.

Furthermore, it is often the case that a deformable gasket captured and clamped between a first and second case element is permanently deformed thereby or is damaged by the separation of the case elements, necessitating the replacement of the gasket during rework.

Each of these factors adds to the time, expense and effort required to rework an HDA.

While the previously discussed use of pressure sensitive adhesive tape provides an advantage over vertically clamped gaskets, this solution presents a new set of problems to HDA designers.

A first problem is occasioned by the fact that the removal of the tape and / or the adhesive residue therefrom during rework constitutes a further increase in labor costs during rework.

Further, pieces of tape removed during rework may inadvertently be introduced into the case interior, requiring further effort.

A third new problem is occasioned by the fact that adhesives in general, and pressure sensitive adhesives in particular, exhibit an out-gassing of volatile adhesive components, especially the adhesive's solvent or carrier.

These volatile components, when admixed with the ambient atmosphere inside the HDA and dispersed therethrough can adversely effect critical electronic or magnetic components contained inside the HDA.

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