Miniature actuator integration for liquid cooling
a miniature actuator and integrated circuit technology, applied in the direction of basic electric elements, semiconductor devices, lighting and heating apparatus, etc., can solve the problems of high cost of pumping, ineffective liquid heat transfer method, and inability to achieve low cost methods of recirculating liquid through the hot region of the integrated circuit (ic). achieve the effect of discharging heat and low cos
Inactive Publication Date: 2008-06-12
HONEYWELL INT INC
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Benefits of technology
[0010]The present invention provides a low cost, effective liquid cooling device for cooling IC elements that generate heat when used. In its simplest form the invention includes a base that is to be placed proximate the element to be cooled that defines a chamber. Inside the chamber is an actuator that forces a cooling fluid, preferably a liquid such as water, through a plurality of channels or loops that dissipate heat generated by the element such as an IC chip. The base with the actuator, liquid and channels is sealed with a top.
Problems solved by technology
However, a low cost method of recirculating liquids through a hot region of an integrated circuit (IC) has yet to be successfully accomplished.
Also, in CPUs, it is possible to use fans and blowers to move air across those components that generate heat, but it is also not as efficient as liquid heat transfer methods.
However, these pumps are quite expensive compared to the cost of the IC, and do not always seal effectively.
One of the major costs in using external pump is liquid sealing, to prevent leaks and isolate the pump actuator from the liquid.
In addition, some cooling systems have volume constraints, which make large pumps unfeasible.
Moreover, small liquid pumps cannot meet the life requirements of most, if not all, IC designs.
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[0020]Referring to the figures, the device 10 generally includes a base 11, which is formed from a thermally conductive material such as copper or other thermally conductive materials used in the integrated circuit industry. Base 11 has a relatively large surface area. In one embodiment the length 13 and width 15 are about 50 mm each, while the sides 17 are about 7 mm, thus defining a chamber. This gives a ratio of surface area to thickness of about 50:7, or roughly 7:1. Preferred ratios may range from about 40:1 to about 5:1. The essential requirement is that the surface area is sufficient to dissipate all the heat from the element along its bottom. One advantage of this method is that the liquid flow inside can effectively carry and spread heat to large surface areas quite uniformly.
[0021]Inside the chamber defined by base 11 and sides 17 is a cooling fluid 19. Fluid 19 is preferably a liquid, and most preferably water. It may be appropriate to use distilled or deionized water to ...
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A device for cooling integrated circuits on circuit boards. A base placed proximate the element to be cooled contains an actuator that forces a cooling liquid through a plurality of channels that dissipate heat generated by the element. The base with the actuator, liquid and channels is sealed with a top. Preferred actuators are electric motors, and MEMS such as electrostatic actuators and piezoelectric actuators. The base has a large surface area relative to the thickness of the chamber The ratio of the surface area to thickness may range from about 40:1 to about 5:1.
Description
FIELD OF THE INVENTION[0001]The present invention relates in general to liquid cooling of integrated circuits and, more particularly, to low cost miniature actuators incorporated directly into the heat spreader or sink.BACKGROUND OF THE INVENTION[0002]Liquid cooling is known to have a significantly better heat transfer capability than solid conduction cooling. However, a low cost method of recirculating liquids through a hot region of an integrated circuit (IC) has yet to be successfully accomplished. Also, in CPUs, it is possible to use fans and blowers to move air across those components that generate heat, but it is also not as efficient as liquid heat transfer methods.[0003]The current method for regular desktop CPU cooling is a passive component of air cooled thermal solutions. Located above a silicon chip on a IC board is a heat spreader, such as a flat conductive sheet of, for example, copper or other conductive materials. Above the flat conductive sheet is a heat sink, which...
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Login to View More IPC IPC(8): F28D15/06
CPCH01L23/473H01L2924/0002H01L2924/00
Inventor ZHANG, CHUNBOYANG, WEI
Owner HONEYWELL INT INC